GB2094345A - Electrodeposition of metal in a recess - Google Patents

Electrodeposition of metal in a recess Download PDF

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Publication number
GB2094345A
GB2094345A GB8201022A GB8201022A GB2094345A GB 2094345 A GB2094345 A GB 2094345A GB 8201022 A GB8201022 A GB 8201022A GB 8201022 A GB8201022 A GB 8201022A GB 2094345 A GB2094345 A GB 2094345A
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Prior art keywords
recess
workpiece
electrodepositing
assembly according
support member
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GB8201022A
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GB2094345B (en
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Inoue Japax Research Inc
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Inoue Japax Research Inc
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/04Tubes; Rings; Hollow bodies
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04Electroplating with moving electrodes

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

An electrodepositing electrode assembly for forming an electrodeposited metallic layer in a recess 2 in a workpiece 1 comprises; an electrodepositing electrode element 11, 211, and a support member 12, 212 so formed as to contain the electrode element therein and have a surface contour substantially complementary to a surface contour of the recess in the workpiece, the support member comprising a porous mass composed, at least in part, of an electrically nonconductive material and having abrasive particles distributed therein at least along the contoured surface thereof. The electrode element may be in the form of a wire, rod or plate (Fig. 3) or of an electrically conductive film 211 deposited on the walls of the pores of the porous mass (fig. 5). In operation the electrode assembly is reciprocated to cyclically bring the support member in pressure contact with and away from the surface of the recess while a depositing current is passed between the electrode element and the workpiece, at least during a time period in which the support member and the surface of the recess are brought together, to uniformly deposit a metal in the recess. <IMAGE>

Description

SPECIFICATION Electrodeposition of metal in a recess The present invention relates in general to electrodepositing on a recessed workpiece or on a workpiece surface having a recess, or especially but not exclusively on an angularly dented area therein and, more particularly, to a method of forming an electrodeposited metallic layer on a wall of a recess in a workpiece and at least on a bottom wall portion of the entire surface of the recess and of the entire surface of the workpiece.
The invention is also concerned with an electrode assembly and an apparatus for carrying out the method described. The term "workpiece" is herein intended to refer to an article on which a metallic layer or film is electrodeposited for permanent retention thereon (electroplating) and a pattern or model on which such a layer orfilm is electrodeposited for subsequent removal therefrom (electroforming) for the purpose of providing an electroerosive machining (EDM, ECM or ECDM) electrode or any other application. Thus, the term "workpiece" is herein intended to generally refer to a metallic or metallized substrate for receiving such a layer or film thereon, irrespective of its desired end use.
In the art of electroplating and electroforming for forming an electrodeposited layer or film on a metallic or metallized substrate of workpiece, it is practically always desirable that the layer or film be formed uniformly on a desired surface area thereof. Depending upon the particular configuration of a selected receiving surface of a workpiece, however, it is generally difficult to assure a uniform distribution of potential gradients over the selected workpiece surface. There are surface areas on which an electrodeposit is little or very little formed as well as surface area on which the deposit is formed selectively or with a greater rate.The selective or preferential formation of electrodeposit on a certain area in the initial stage causes a further unbalance in the distribution of potential gradients so that in the subsequent stage the deposit is concentrated on that area and practically no further deposit is created on the other areas.
In order to solve this problem, various proposals have been made heretofore and include the use of a plurality of anodic electrodes designed and arranged in accordance with the particular surface configuration of the workpiece, the use of one or more auxiliary electrodes, the controlled delivery of an electrodepositing liquid electrolyte and the use of one or more masking plates in an attempt to create the distribution of potential gradients of a greater uniformity and to locally modify the thickness of the electric double layer.
Not only are these provisions complicated and inconvenient, it has been found that they are still not satisfactory to produce an electrodeposited layer of uniform thickness depending on the particular configuration of the receiving workpiece surface. Difficulties especially arise in the deposition on a deep recess or a surface including a deep or angularly dented area, especially uniformly on the entire wall of an angular recess and particularly on the bottom wall portion of an angular recess or dented area having an acute cross-sectional angle.
It is accordingly a general object of the present invention to overcome the aforementioned problem encountered in the prior art.
Specifically, the invention seeks to provide a novel, effective and yet efficient method of uniformly forming an electrodeposited metallic film on a wall of a recess in a workpiece having the recess, which method allows effective and yet efficient electrodeposition at least on a bottom wall portion of such a recess or of an angularly dented area of the entire surface of the recess having one or more such areas in the workpiece and which method allows a uniform deposition on the entire wall of the recess selectively or as well as on an area surrounding the recess in the workpiece.
The invention also seeks to provide a novel electrodepositing electrode assembly and an apparatus for carrying out the method described.
In accordance with the present invention, in a first aspect thereof, there is provided a method of forming an electrodeposited film on a wall of a recess in a workpiece and at least on a bottom wall portion of at least one angularly or otherwise dented area of the entire surface area of the recess, which method comprises the steps of: a) preparing an electrodepositing electrode assembly comprising at least one electrodepositing electrode element and a support member so formed as to contain the electrode element therein and have a surface contour complementary to the surface contour of the recess in said workpiece, the said support member comprising a porous mass composed at least in part of an electrically nonconductive material and having abrasive particles distributed therein at least along the said contoured surface thereof; b) positioning the said electrodepositing electrode assembly and the workpiece to establish generally a mating engagement of the said support member with the recess; c) supplying an electrodepositing liquid electrolyte onto the said wall of the recess; d) reciprocating at least one of the said electrode assembly and the worl < piece so as to repetitively bring the said support member into contact with and away from the surface of the recess in mating engagement therewith; and passing an electrodepositing electric current between the said electrode element and the workpiece at least during a time period in which the said support member and the surface of the recess are brought together in the step d) to electrodeposit a metal from the liquid electrolyte at least on the said bottom wall portion in the said recess.
The invention also provides an electrodepositing electrode assembly for forming a metallic film on a wall of a recess in a recessed workpiece and at least on a bottom wall portion of such a recess or of an angularly or otherwise dented area of the entire surface area of the recess, which assembly comprises: at least one electrodepositing electrode element and a support member so formed as to contain the electrode element and have a surface contour complementary to the surface contour of the said recess in the workpiece, the said support member comprising a porous mass composed, at least in part, of an electrically nonconductive material and having abrasive particles distributed therein at least along the said contoured surface thereof.
The invention further provides an apparatus for forming an electrodeposited metallic film on a wall of a recess in a workpiece and at least on a bottom wall portion of at least one angularly or otherwise dented area of the entire surface area of the recess, which apparatus comprises: an electrodepositing electrode assembly comprising at least one electrodepositing electrode element and a support member so formed as to contain the said electrode element therein and having a surface contour complementary to the surface contour of the recess in the workpiece, the said support member comprising a porous mass composed, at least in part, of an electrically nonconductive material and having abrasive particles distributed therein at least along the said contoured surface thereof; means for positioning the said electrode assembly and the workpiece to establish generally a mating engagement of the said support member with the recess; liquid delivery means for supplying an electrodepositing liquid electrolyte onto the wall of the recess; drive meansfor reciprocating at least one of the said electrode assembly and the workpiece so as to repetitively bring the said support member into contact with and away from the surface of the recess in mating engagement therewith; and a power supply for passing an electrodepositing electric current between the said electrode element and the workpiece at least during a time period in which the support member and the said surface of the recess are brought together to electrodeposit a metal from the liquid electrolyte at least on the said bottom wall portion in the recess.
The electrodepositing electrode element specifically may be in the form of a wire, rod or plate having one end electrically connected to one terminal (essentially positive) of the electrodepositing power supply and the other or active end which, when the support member is in mating engagement with the recess, lies in the proximity of the aforesaid bottom wall portion or an angularly dented area of the surface area of the recess. The other terminal of the power supply is, of course, electrically connected to the workpiece.
When more than one such dented areas are present in the recess of the workpiece, a plurality of such electrode elements may be provided so that their active ends lie close to those areas, respectively.
The porous mass of electrically nonconductive material constituting the support member is, specifically, composed of a synthetic resin, say, of the phenol or epoxy family and contains abrasive particles which may be of silicon carbide (SiC), boron carbide (B4C), zirconium oxide (Zr203 or Zero2), aluminium oxide (Al203), silicon oxide (six2), diamond or carbon. Powdery particles of an electrically conductive material (metal, alloy or graphite) may be added in the porous mass to impart to the mass a limited electrical conductivity or a semi-conductivity where desirable.
The invention also involves a method of preparing an electrodepositing electrode assembly described, which method comprises: forming a mixture of a synthetic resin and abrasive particles, and possibly also electrically conductive powder particles; applying the mixture onto or loading it into a workpiece pattern to form a yieldable mass of the mixture with a surface contour complementary to the surface contour of the workpiece; inserting one or more electrodepositing electrodes into the yieldable mass to a desirable depth or depths, respectively; and then solidifying the mass at a room temperature or by heating at an elevated temperature followed by cooling, thereby causing the electrode element or elements to be firmly held in the solidified mass.
The electrodepositing electrode element may alternatively, or additionally, be in the form of an electrically conductive film composed of, say, copper or nickel chemically deposited or platinum, palladium or copper vapor-deposited, on the wall portions of the internal pores of the porous mass of essentially electrically nonconductive material, i.e. synthetic resin, having abrasive particles distributed therein. In this case, the abrasive particles are bonded with the synthetic resin of adhesive nature to form a porous abrasive mass which may be shaped using a workpiece or a model thereof as a shaping pattern and subsequently baked in a furnace.
These and other objects and features of the present invention as well as advantages thereof will become more readily apparent from the following description made with reference to the accompanying diagrammatic drawing, in which: FIG. 1 is a cross-sectional view of a workpiece having a recess of a V-shaped cross-section and an uneven and undesirable format of electrodeposit formed on the workpiece with a conventional electrodepositing technique, in spite of the desire to form a layer of the electrodeposit uniformly over the entire surface area of the recess; ; FIG. 2 is a cross-sectional view diagrammatically illustrating a similar workpiece and a novel electrodepositing electrode assembly of the invention being formed using the surface contour of the workpiece as a pattern or the formed electrodepositing electrode assembly constituted as a part of the apparatus or used for carrying out the electrodepositing method according to the present invention; FIG. 3 is an elevational view essentially in section diagrammatically illustrating an apparatus according to the present invention; FIG. 4 is a similar view diagrammatically illustrating another form of the electrodepositing electrode assembly and a portion of an apparatus according to the invention;; FIG. 5 is a cross-sectional view diagrammatically illustrating another form of the electrodepositing electrode assembly in a working position for forming a uniform layer of electrodeposit over the entire surface area of a recess of V-shaped cross-section in a workpiece and on an area surrounding the recess; FIG. 5A shows an electrode element in the form of a continuous metallic film, and FIGS. 6 and 7 are elevational and top plan views, respectively, of a workpiece having a recess and an electrodepositing electrode assembly working on the workpiece in a modified mode of the method according to the invention.
In FIG. 1 there is shown a workpiece 1 having a recess 2 of a V-shaped cross-section. The recess 2 may thus be either of conical shape of a V-shaped groove extending from the front to the rear of the sheet of drawing and having an equal width.
Assuming, for example, that the recess 2 is of conical shape, it is apparent that with the conventional electrodepositing technique using a planar electrode 3 disposed above the opening 4 of the recess 2, electrodeposit 5 tends to build up selectively along and around the circular edge portion 6 at the recess opening 4, and gradually tapers off in thickness as the depth from the opening 4 increases. It is apparent that the edge portion 6 of the recess is the zone of lowest potential gradient and highest current density, and the narrow and angular bottom portion 7 of the recess 2 has the highest potential gradient and lowest current density so that very little or practically no plating occurs at the bottom portion 7. This problem is overcome in accordance with the present invention.
FIG. 2 shows the workpiece 1 or a model 1' prepared to duplicate the recess 2 of the workpiece 1 of V-shaped cross-section shown in FIG. 1 and a novel electrodepositing electrode assembly 8 of the invention formed by using the surface contour of the workpiece 1 or model 1' as a shaping die. The assembly 8 is prepared by molding a mixture of synthetic resin 9 and abrasive particles 10 in the recess 2, 2' and inserting an electrode element 11 which may be in the form of a rod, plate or wire so that its longitudinal axis preferably coincides with the axis of the conical recess 2, 2' and its lower end 1 a is positioned close to the angular bottom area 7, 7' of the recess 2, 2' where, as described, it is most difficult to form an electrodeposit with the conventional technique.The mixture 9, 10 having the electrode element 11 so positioned therein is solidified at a room temperature when the synthetic resin 9 is of adhesive nature (e.g. epoxy resin), or by heating to an elevated temperature followed by cooling to form a support 12 of porous mass. The support 12, in which the electrode element 11 is firmly held and which has the shape of the recess 2, is then removed from the workpiece 1 or model 1'. In the molding described, it is essential that the end portion 1 a of the electrode element 11 be positioned in the proximity of but slightly spaced from the angular bottom area 7 (7') so that there is no direct contact of the element 11 with the workpiece 1 in an electrodepositing operation which is to be described.As a result, it is possible that the end portion of the electrode element 11 in the support 12 removed from the workpiece 1 or model 1' is covered with synthetic resin or abrasive particles or both. It is accordingly essential that the support 12 be formed so porous that the electrode element 11 can communicate with the exterior through interconnected pores, and especially with the exterior at the end portion of the assembly 8. If synthetic resin and abrasive particles are present at that end portion and completely mask the end of the electrode element 11, they should be removed to allow electrical communication, via a liquid electrolyte, with the workpiece in the electrodepositing operation.
The electrode element 11 , which may be in the form of a rod, plate or wire, may have a width or thickness of 0.1 to 1 mm and may make use of copper or titanium plated with insoluble platinum or of an insoluble metal of the ferrite family or of graphite. A metal which dissociates into the electrolyte for electrodeposition may also be employed.
Abrasive particles 10 may be silicon carbide, boron carbide, boron nitride, aluminum oxide, zirconium oxide, silicon oxide, diamond or any other material conventionally used as abrasive.
Granular abrasive carbon particles may also be employed. Abrasive particles 10 may be of a particle size in the range between 0.01 and 0.3 mm and preferably of around 0.1 mm.
The synthetic resin 9 constituting the support 12 for the electrode element 11 and abrasive particles may be of the epoxy family or phenol family and should be resistant to the liquid electrolyte and chemically stable. The proportion of synthetic resin 9 to abrasive particles 10 in the mass of the support 12 should be 5 to 40% by weight. With a proportion less than 5%, the mechanical strength becomes insufficient and with a proportion in excess of 40%, the abrasive density becomes unsatisfactory. A preferred example is mixing silicon carbide (SiC) of a particle size of 0.1 mm with a phenol resin so that the abrasive is proportioned at 20% by weight relative to the resin.By heating the mixture to a temperature of 1 200C followed by cooling, a highly satisfactory porous support member 12 is obtained which allows electrodepositing current to be passed from the electrode element 11 supported therein to the workpiece 1 at a mean current density of 0.1 A/cm2 in electrodepositing operation. Phenol resin is thermally decomposed at a temperature of 5000C and thermal decomposition allows silicon-carbide or other abrasive particles and the electrode element to be recovered for reutilization.
In FIG. 3, a workpiece 1 having an angular recess 2 on the entire wall of which electrodeposit is to be uniformly formed is secured supported in a worktank 13 and immersed in a bath of liquid electrolyte 14 therein. The electrode assembly 8 according to the invention comprising the electrode element 11 and the support member 12 constructed and formed as described in connection with FIG. 2, is shown so positioned that the support 12 is in a mating engagement with the recess 2 of the workpiece 1. The assembly 8 is securely supported by a shank which is in the form of a piston 1 5 extending from a cylinder 1 6 fixed in position.The piston 1 5 is slidably movable in the cylinder 1 6 which accommodates a spring 17 tending to force the piston 1 5 and hence the electrode assembly 8 upwardly, and a spring 1 8 tending to force the piston 15 and the electrode assembly 8 downwardly in cooperation with a pusher 19. A rotary cam 20 in abutting contact with the pusher 19 is rotated with its shaft by a motor 21 to reciprocate the pusher 19 axially in the cylinder 16. This in turn causes the piston 1 5 and hence the electrode assembly 8 to reciprocate axially, thereby cyclically bringing the assembly 8 and the support member 12 into direct mating engagement with the recess 2 and in pressure contact with the surface of the recess.
An electrodepositing power supply 22 is electrically connected on the one hand to the workpiece 1 in the sense to make it generally anodic and on the other hand via a switch 23 to the upper end of the electrode element 11 in the sense to make the latter generally cathodic. The power supply 22 supplies an electrodepositing current in the form of a direct current, a succession of pulses or any other known form between the electrode element 11 and the workpiece 1 via the liquid electrolyte 14. The switch 23 is periodically closed by a conducting plate 24 supported by the reciprocating piston 1 5 via an arm 25.The conducting plate 24 is here arranged to close the switch 23 each time the electrode assembly 8 and the workpiece 1 are brought together and the support member 12 is brought into a contacting relationship with the surface of the recess 2 in the workpiece 1 in the reciprocation cycles of the assembly 8. Each time theelectrode assembly 8 is brought away from the surface of the recess 2 in the reciprocation cycle, the switch 23 is opened to disconnect the power supply 22 from the electrode element 11.
The contact pressure of the support 12 against the surface of the recess 2 may be adjusted by selecting elastic constants of the springs 17 and 18. It is also advisable to make the support 12 elastic by incorporating therein an elastic material, e.g. a synthetic rubber material to form a porous elastic support 12. The pressure contact force and conditions are in this case modified by elastic constants of the support 12 as well. It should be noted that an excessive pressure force is harmful because of the possibility that the electrodeposited layer on the surface of the recess 2 may be excessively ground off.
With the novel electrodepositing electrode assembly 8 according to the invention, it is essential that abrasive particles 10 be so contained in the support 12 as to be distributed therein and at least along the surface regions thereof. This feature, coupled with the feature that the support 12 is contoured complementarily with the surface contour of the recess 2, advantageously provides abrasive removal of the excessive build-up of electrodeposit on particular surface areas as described in connection with FIG. 1 in the course of operation by virtue of reciprocation of the assembly and its pressure contact against the recess surface. Thus, in the electrodepositing operation, no excessive build-up of electrodeposit occurs or remains beyond a desired thickness in any area on the entire surface of the recess 2.Furthermore, since the electrode element 11 is firmly embedded in the abrasive support member 12 and so arranged as described and is moved in reciprocation therewith, the active electrode and 1 1a comes periodically into direct proximity of the bottom area 7 of the recess 2 to reliabiy produce electrodeposit on the latter area with the electrodeposition current applied across the narrow gap selectively during each proximity time period in the successive mechanical reciprocation cycles. In addition, the reciprocation of the electrode assembly 8 causes a highly effective pumping action for the liquid electrolyte and keeps it renewed consecutively in the bottom area 7 of the recess 2.While one or more external nozzles designed to direct a stream or streams of the fresh liquid electrolyte into the recess 2 may be arranged or the electrode element may be made tubular to direct such a stream into the bottom area 7 and elsewhere in the recess 2, these measures are generally not required. When these measures are employed, it is advisable to synchronize the forced delivery of the liquid electrolyte in a stream with the retraction of the assembly 8 in each reciprocation cycle.
When a uniform layer of electrodeposit is formed over the entire surface of the recess 2 in this manner and builds up to a certain small extent in an initial stage of the operation, the layer then is capable of continuously building up uniformly over the entire surface. Thus, upon completion of the initial stage, it is possible to terminate the electrodepositing operation with the electrode assembly 8 and apparatus of the invention and then to continue the electrodepositing operation with a plate electrode (as shown at 3 in FIG. 1) or with a simple rod or plate electrode inserted in the recess 2 in a conventional electrodeposition arrangement. When it is desirable to form a layer of electrodeposit to a substantial thickness with the arrangement of the invention, the cylinder 1 6 should be moved upwardly or retracted at a rate of deposition while permitting the piston 1 5 and th.
assembly 8 to continue to reciprocate or without reciprocation of the assembly 8.
The reciprocation of the electrode assembly 8 according to the invention should have a rate of reciprocation of 0.01 to 100 Hz or cycles per second and an amplitude of reciprocation ranging between 0.1 and 100 mm. With the embodiment shown, the rate of reciprocation is determined by the rate of rotation of the motor 21 and the amplitude of reciprocation is determined basically by the shape and dimensions of the cam 20. For example, the electrode assembly 8 may in an electrodepositing operation be reciprocated with a rate of 2 cycles per second and an amplitude of 10 mm. It has been found that this allows an electrodeposition current to be thrown or supplied at a current density of 0.1 A/cm2 to yield a rate of electrodeposition of 0.16 mm/hour.
As described previously, in order to form electrodeposit uniformly over the entire surface of the recess in the process of this invention, it is essential that the supporting member 12 be so much porous that substantially all pores therein are interconnected and pervious to the liquid electrolyte and that the electrode element 11, in effect, communicates throughout its entire length or area with the exterior surface areas of the support 12. Where it is desirable to electrodeposit on only a selected area of the entire surface area of the recess 2, a masking film of electrically insulating material may be applied to that area or those areas of the recess 2 not to be coated.Only the bottom area 7 of the recess 2 where it is difficult to electrodeposit with the conventional technique can, however, be selectively electrodeposited without such a masking, by making the support member 12 non-porous or substantially free from the interconnected pores or impervious to liquid, and having only the tip portion 11 a of the electrode element 11 exposed to the exterior of the surface of the support 12.
It will be understood that modified forms of the reciprocation of the electrode assembly 8 are possible. For example, a small-amplitude and high-frequency reciprocation may be superimposed upon a high-amplitude and lowfrequency reciprocation. Further, one of the electrode assembly 8 or the workpiece 1 while either one is being reciprocated in the manner described may be rotated about the axis of the assembly and this applies particularly where the recess 2 and the support 32 are conical. It should also be noted that the reciprocation may not be limited to a vertical or axial reciprocation.
FIG. 4 shows another form of the electrodepositing electrode assembly 108 of the invention designed for use with a workpiece 101 having a recess 102 of intricate shape or possessing a multiplicity of sub-recesses or dented areas 107-1,107-2,107-3 and 107-4.
The electrode assembly 108 comprises a support 112 formed here as a layer composed of synthetic resin 9 and abrasive particles 10 distributed therein. The support 112 is securely supported by a backing member 30 of electrically insulating material which is in turn securely supported by a carriage 31. In preparing the assembly 108, the support 112 is first molded generally in the manner previously described with the workpiece 101 or a model thereof as a shaping die and is thereby shaped with a surface contour complementary to the surface contour of the workpiece 101. In the molding step, a plurality of electrode elements 111-1, 111-2, 111-3 and 111-4 are inserted in the support 112 and fixed therein generally in the manner already described.
Additional molding is then carried out to mold the backing member 30 on the support 112 to form the assembly 108 shown. The electrodes are shown electrically connected to one terminal (generally positive) of the power supply 22 and the workpiece 101 to the other terminal (generally negative) of the power supply 22 for uniform electrodeposition on the entire surface of the recess 102 including sub-recesses 107-1, 107-2, 107-3 and 107-4 and an area surrounding the recess 102. The entire electrode assembly 108 is reciprocated, during the electrodepositing operation, by means of a drive unit 32 which may be of the type previously described.
FIG. 5 shows a further form of the electrodepositing electrode assembly 208 of the invention shaped and positioned in a mating engagement with the recess 2 in the workpiece 1 for uniform electrodeposition on the entire surface of the recess 2 and on an area surrounding the recess 2. The support 212 is here constituted by a porous mass of abrasive particles 10 and nonconductive binder material 209 which may be an adhesive synthetic resin. The support 212 contains an electrode element 211 which is here in the form of a continuous metallic film formed by chemical or vapour deposition on the wall portions 40 of the interconnected pores 41 in the mass 209, 10 as shown in FIG. 5A. The electrode assembly 208 is securely supported by a shank or piston 215 as in the embodiment of FIG. 3.The electrodeposition power supply 22 has one output terminal 22A (generally positive) electrically connected to the conductive shank 215 and the other output terminal 22B (generally negative) electrically connected to the workpiece 1. The output current of the power supply 22 is thus passed from the terminal 22A via the conductor 215 and the electrode element 211 in the support member 212 and through the liquid electrolyte bridging the element 211 and the workpiece 1 to the terminal 22B to electrodeposit metal over the entire surface of the recess 2 and the area surrounding the recess 2.During the depositing operation, the electrode assembly 208 is reciprocated by a drive unit of the type shown in FIG. 3 to periodically bring the surface thereof into direct machining engagement and pressure contact with the surface of the recess generally in the manner already described to assure uniformity in thickness of the electrodeposited layer of metal on the entire surface area of the recess 2. As the thickness of the electrodeposit increases, the mean position of the electrode assembly 208 in reciprocation is displaced upwardly at a rate of increase in the thickness of the electrodeposit.
Alternatively or in addition, here again, the operation with the assembly 208 may be terminated when the thickness reaches a certain extent. The assembly 208 may then be replaced by a conventional rest plate or rod electrode to continue the depositing operation until a desired greater thickness is achieved. It should be apparent that in the assembly 208 shown in FIG. 5. the support 212 may additionaily incorporate a further electrode element in the form of a wire, rod or plate as shown at 11 in FIGS. 2 and 3 and arranged in the manner described.
The electrode assembly 308 shown in FIG. 6 comprises a support 312 composed and constructed generally in the same manner as described in connection with the previous Figures but slightly undersized with respect to the contour of a large recess 302 in a workpiece 301. The top plan view of the recess 302 and the workpiece 301 are shown in FIG. 7. In this embodiment, the reciprocation of the electrode assembly 308 is effected not only in the direction of the vertical or Z-axis but in the direction of x- or y-axis or both directions in the horizontal plane. The horizontal reciprocation may be replaced by an orbital movement whereby each point in the assembly 308 is moved along a circular path of an equal small radius. A multiplicity of electrodes elements 311-1,311-2,311-3,311-4and311-5are embedded in the support 312 and arranged and positioned therein in a manner hereinbefore described.

Claims (21)

1. An electrodepositing electrode assembly for forming an electrodeposited metallic layer on a wall of a recess in a workpiece and at least on a bottom area in the recess, the assembly comprising: an electrodepositing electrode element and a support member so formed as to contain said electrode element therein and have a surface contour substantially complementary to a surface contour of said recess in said workpiece, said support member comprising a porous mass composed, at least in part, of an electrically nonconductive material and having abrasive partides distributed therein at least along said contoured surface thereof.
2. An assembly according to Claim 1 wherein the electrode element is in the form of a wire, rod or plate having a first end arranged to be electrically connected to a terminal of a power supply, and a second end which is so situated within the support member that when the latter is in mating engagement with the recess the second end lies in the proximity of the bottom area of the recess.
3. An assembly according to Claim 2 for forming an electrodeposited metallic layer in a plurality of dented areas in the recess in the workpiece, the assembly comprising a plurality of said electrode elements so situated that when the support member is in mating engagement with said dented areas their second ends lie close to those areas, respectively.
4. An assembly according to any one of the preceding claims wherein said porous mass is composed of a synthetic resin.
5. An assembly according to Claim 4 wherein the synthetic resin is of the phenol or epoxy family.
6. An assembly according to any one of Claims 1 to 5 wherein the abrasive articles are of silicon carbide (SiC), boron carbide (B4C), boron nitride (BN), zirconium oxide (Zr2O3 orZrO2), aluminium oxide (Al2Os), silicon oxide (SiO2), diamond or carbon.
7. An assembly according to any one of Claims 1 to 6 wherein particles of electrically conductive material are added to the porous mass to impart to the mass a limited electrical conductivity or a semi-conductivity.
8. An assembly according to Claim 7 wherein the conductive material is a metal, an alloy, or graphite.
9. An assembly according to any one of Claims 1 to 8 wherein the electrode element is in the form of an electrically conductive film deposited on the wall portions of the interconnected pores of said porous material.
10. An assembly according to Claim 9 wherein the film is composed of chemically deposited copper or nickel or vapour-deposited platinum, palladium or copper.
11. An assembly according to Claim 9 or 10 wherein the synthetic resin is of adhesive nature and the abrasive particles are bonded therewith to form a porous abrasive mass.
12. An assembly according to any one of Claims 1 to 11 wherein the porous mass is shaped using the workpiece, or a model thereof, as a shaping pattern or mould whereupon the mass is solidified at a room temperature or by heating at an elevated temperature followed by cooling.
13. An assembly according to any one of Claims 1 to 12 the surface contour of which is smaller than the surface contour of the recess.
14. Electrodepositing electrode assembly constructed, arranged and adapted to operate substantially as herein described with reference to, and as shown in, Figure 2, Figure 3, Figure 4, Figure 5, Figure 5A or Figures 6 and 7 of the accompanying drawings.
15. An apparatus for forming an electrodeposited metallic layer on a wall of a recess in a workpiece and at least on a bottom area in the recess, the apparatus comprising an electrodepositing electrode assembly according to any one of Claims 1 to 14 then further comprising means for positioning said electrodepositing electrode assembly and said workpiece to establish generally a mating engagement of said support members with said recess; liquid-delivery means for supplying an electrodepositing liquid electrolyte at least onto said wall of said recess; drive means for reciprocating at least one of said electrode assembly and said workpiece so as to repetitively bring said support member into contact with and away from the surface of said recess in mating engagement therewith; and power supply means for passing an electrodepositing electric current between said electrode element and said workpiece at least during a time period in which said support member and said surface of the recess are brought together to electrodeposit a metal from said liquid electrolyte at least on said bottom area in said recess.
1 6. An apparatus for forming an electrodeposited metallic layer on a wall of a recess in a workpiece, constructed, arranged and adapted to operate substantially as herein described with reference to, and as shown in Figure 3 of the accompanying drawings.
1 7. A method of forming an electrodeposited metallic layer on a wall of a recess in a workpiece and at least on a bottom area in the recess, said method comprising the steps of: (a) preparing an electrodepositing electrode assembly according to any one of Claims 1 to 14, (b) positioning said electrodepositing electrode assembly and said workpiece to establish generally a mating engagement of said support member with said recess; (c) supplying an electrodepositing liquid electrolyte onto said wall of said recess; (d) reciprocating at least one of said electrode assembly and said workpiece so as to repetitively bring said support member into contact with and away from the surface of said recess in the mating engagement therewith; and (e) passing an electrodepositing electric current between said electrode element and said workpiece at least during a time period in which said support member and said surface of the recess are brought together in the step d) to electrodeposit a metal from said liquid electrolyte at least on said bottom area in said recess.
18. A method according to Claim 17 including preparing an electrodepositing electrode assembly according to Claim 13 and reciprocating at least one of said electrode assembly and said workpiece along at least two of three mutually perpendicular axes.
1 9. A method according to Claim 1 7 comprising the step of preparing an electrodepositing electrode assembly according to Claim 1 3 and reciprocating at least one of said electrode assembly and said workpiece along one axis and at the same time rotating it about the same axis.
20. A method of forming an electrodepositing metallic layer on a wall of a recess in a workpiece substantially as herein described with reference to Figures 2 to 7 of the accompanying drawings.
21. A workpiece having a recess on a wail of which was electrodeposited a metallic layer with the use of an electrodepositing electrode assembly according to any one of Claims 1 to 14, with the use of an apparatus according to Claim 1 5 or 1 6 or according to a method according to any one of Claims 17 to 20.
GB8201022A 1981-01-14 1982-01-14 Electrodeposition of metal in a recess Expired GB2094345B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56003236A JPS5944395B2 (en) 1981-01-14 1981-01-14 Electrodeposition processing method

Publications (2)

Publication Number Publication Date
GB2094345A true GB2094345A (en) 1982-09-15
GB2094345B GB2094345B (en) 1984-09-12

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GB8201022A Expired GB2094345B (en) 1981-01-14 1982-01-14 Electrodeposition of metal in a recess

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JP (1) JPS5944395B2 (en)
DE (1) DE3200948A1 (en)
FR (1) FR2497835B1 (en)
GB (1) GB2094345B (en)
IT (1) IT1154260B (en)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
DE19532170A1 (en) * 1995-08-31 1997-03-06 Ppv Verwaltungs Ag Firmly adhering platinum coating formation on silicon carbide substrate contg. free silicon

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CH353469A (en) * 1958-03-27 1961-04-15 Charmilles Sa Ateliers Tool for electrolytic machining and method of manufacturing this tool
DE1217171B (en) * 1958-08-21 1966-05-18 Caterpillar Tractor Co Method and device for the dimensionally accurate processing of the outer and / or inner surface of tubular bodies
US3619401A (en) * 1968-04-03 1971-11-09 Norton Co Apparatus for electrodeposition
AT305719B (en) * 1969-11-24 1973-03-12 Norton Co Method and device for the electrolytic deposition of metal
US3706650A (en) * 1971-03-26 1972-12-19 Norton Co Contour activating device
GB1364182A (en) * 1971-08-16 1974-08-21 Micromatic Ind Inc Electroplating and hining apparatus
US3751346A (en) * 1971-08-16 1973-08-07 Micromatic Ind Inc Combined plating and honing method and apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19532170A1 (en) * 1995-08-31 1997-03-06 Ppv Verwaltungs Ag Firmly adhering platinum coating formation on silicon carbide substrate contg. free silicon

Also Published As

Publication number Publication date
DE3200948A1 (en) 1982-09-16
FR2497835B1 (en) 1987-05-22
IT1154260B (en) 1987-01-21
JPS5944395B2 (en) 1984-10-29
JPS57116796A (en) 1982-07-20
FR2497835A1 (en) 1982-07-16
GB2094345B (en) 1984-09-12
IT8247557A0 (en) 1982-01-13

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