GB2041342A - Carbon Fibre Reinforced Composite Materials - Google Patents
Carbon Fibre Reinforced Composite Materials Download PDFInfo
- Publication number
- GB2041342A GB2041342A GB7904102A GB7904102A GB2041342A GB 2041342 A GB2041342 A GB 2041342A GB 7904102 A GB7904102 A GB 7904102A GB 7904102 A GB7904102 A GB 7904102A GB 2041342 A GB2041342 A GB 2041342A
- Authority
- GB
- United Kingdom
- Prior art keywords
- solution
- carbon fibre
- reinforced composite
- fibre reinforced
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 229910052799 carbon Inorganic materials 0.000 title claims abstract description 35
- 239000000835 fiber Substances 0.000 title claims abstract description 32
- 239000011208 reinforced composite material Substances 0.000 title claims description 16
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000007772 electroless plating Methods 0.000 claims abstract description 10
- 238000007747 plating Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 12
- 230000001235 sensitizing effect Effects 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 claims description 5
- 239000001476 sodium potassium tartrate Substances 0.000 claims description 5
- 235000011006 sodium potassium tartrate Nutrition 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 4
- 229910000366 copper(II) sulfate Inorganic materials 0.000 claims description 4
- 229910021645 metal ion Inorganic materials 0.000 claims description 4
- 229910052793 cadmium Inorganic materials 0.000 claims description 3
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 239000003638 chemical reducing agent Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims description 2
- 230000000873 masking effect Effects 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 230000006641 stabilisation Effects 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910021120 PdC12 Inorganic materials 0.000 claims 1
- 229910002666 PdCl2 Inorganic materials 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims 1
- 239000002131 composite material Substances 0.000 description 10
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
-
- D—TEXTILES; PAPER
- D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
- D01F—CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS; APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBON FILAMENTS
- D01F11/00—Chemical after-treatment of artificial filaments or the like during manufacture
- D01F11/10—Chemical after-treatment of artificial filaments or the like during manufacture of carbon
- D01F11/12—Chemical after-treatment of artificial filaments or the like during manufacture of carbon with inorganic substances ; Intercalation
- D01F11/127—Metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Textile Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
Abstract
Carbon fibre reinforced materials are made more conductive by electroless plating at least the end surfaces of the fibres thus allowing the electrical connection of the material through the exposed plated ends of the carbon fibres.
Description
SPECIFICATION
Improvements In or Relating To Carbon
Reinforced Composite Materials
The present invention relates to carbon fibre reinforced composite materials and more particularly to the improvement of the conductive properties of such materials.
Carbon fibre composite material is made up of graphite fibres oriented parallel to each other in thin layers and enclosed in epoxy resin which is cured under temperature and pressure. The layers can be bonded together, with the fibre directions oriented at a variety of angles in the various layers, depending on the particular structural environment for which the material is intended.
Conduction in carbon fibre composite material occurs preferentially along the graphite fibres as the epoxy matrix is essentially non conductive.
Attempts to make electrical contact to the material have proved unsuccessful because of the inability of the various methods to make electrical contact to all of the available fibre. It is the fibre ends which must be contacted as only here are the fibres exposed to the exterior.
Methods such as mercury contacts, indium contacts, conductive paint or resin contacts and vacuum deposited or sprayed metal coatings are all impractical, for example because of irreproducible results electrically, or poor mechanical strength.
It is an object of the present invention to provide a coating for carbon fibre reinforced composite materials which electrically connects the ends of the carbon fibres and thereby improves the electrical characteristics of the material.
According to the present invention there is provided a block of carbon fibre reinforced composite material in which the exposed carbon fibre ends are electrically connected by electroless copper plating.
The electroless copper plating can be used as a base for a thicker and more robust coating or one more corrosion resistant.
The invention also provices a method of electroless plating a carbon fibre reinforced composite material.
Embodiments of the present invention will now be described with reference to the following process for electroless plating of carbon fibre reinforced composite material and with reference to the accompanying drawings in which: Figure 1 shows diagrammatically a crosssection of a panel to panel bolted joint,
Figure 2 shows a similar panel to panel adhesively bonded joint and,
Figure 3 shows joint and grounding stud attached to a carbon fibre composite member.
The invention is a two stage process consisting of sensitising the surface to be plated and then depositing a layer of copper on this surface. The sensitising solution consists oft 3.5 gms of SnCI2
20 cm3 of concentrated HCI
5 cm3 of 1% (by weight) PdCI2
Dissolved in water and made up to 100 cm3.
The specimen to be plated is then placed in the sensitising solution for 5 minutes. Care must be taken to expose only the surface to be plated to the solution. This can be achieved by masking the areas not to be plated for instance with waterproof adhesive tape. After sensitisation has taken place the specimen is rinsed for ten minutes, for example, under a stream of running water. Also any vessels used for sensitising should not be used when plating as the sensitising solution even in small quantities can make the copper readily precipitate from the plating solution.
The plating solution consists of:
35 gm of CuSO4 1 70 gms of sodium potassium tartrate
50 gms of NaOH
The copper salt and complexing agent (sodium potassium tartrate) is dissolved firstly in about 0.5 dm3 of water before adding the sodium hydroxide.
The solution is then made up to 1 dm3.
Immediately prior to use formaldehyde is added in a proportion of 8% by volume. The sample is then immersed in the plating solution for several hours, still making sure that any surfaces which are not to be plated are masked, until a suitable copper coating is achieved. The layer deposited can be subsequently contacted by soldering or other means. If soldering is carried out then the temperature should not be too high, i.e. less than approximately 2300C.
The solutions described above contain metal ion plus a reducing agent together with other additives for pH stabilisation. The metal ions are reduced to metal atoms at the surface thus forming a chemical bond there. Good electrical contact can thus be made to carbon fibre composite material.
This process considerably improves the electrical performance of carbon, fibre composite material when it is used in airframes. It is clear, both from theoretical and experimental work that in order to make the best electrical bond to carbon fibre composite material it is necessary to contact as many graphite fibre ends as possible.
The invention provides a method of doing this.
For instance if a carbon fibre composite panel has its edges plated by the method described then a considerable improvement in shielding performance over the unplated specimen can be achieved (of the order of 35 db). Similar treatment can also be used to improve the materials properties with respect to its use as an aerial ground plane and the resistance of an aircraft, the skin of which is made of this material, to damage by lightning strike. Conductivity between composite panels and/or metal panels and ground studs is also greatly improved when the invention is used to promote electrical bonding in such cases.
When electrically bonding composite parts to galvanically incompatible metal components it is necessary to electroplate another metal on to the copper because copper is a corrrosion hazard when in contact with aluminium alloys (used in most modern airframes). The invention lends itself to such plating. Metals such as tin, nickel or cadmium could be used for this purpose.
The invention therefore provides improved conductivity for a carbon fibre reinforced composite plate; it enables plates to be conductively connected together when used in large structures such as for example aircraft frames; and it improves the electromagnetic shielding properties of the plate and hence of any structure made from a number of such plates.
Embodiments of the invention are now described with reference to Figures 1 to 3. Figure
1 shows two carbon fibre reinforced plates 1,2 which are to be connected to a T section 3 to form a larger structure. The plates 1, 2 are connected to the T section 3 by countersunk bolts 4, 5 fitted with respective nuts and washers 6, 7, 8, 9. To ensure good electrical conductivity between the two plates 1, 2 the edges of the countersunk holes 10, 11 are electroless plated as shown at 12 in the inset drawing. Also to ensure good electrical connection to the T section the plating 13 is continued as shown on to the flat surface of the T section such that it will contact the washer 9 when the nuts and bolt are tightened.
Figure 2 shows three plates 20, 21, 22 of carbon fibre reinforced material. The two plates 20,21 are mechanically joined to the third plate 22 by means of a suitable glue/adhesive 23. The end surfaces of the plates 20,21 are electroless copper plated as shown at 24, 25 and the plating portions are joined together by a conductive filler 26.
Referring now to Figure 2 if a grounding strap is required a plate 30 is drilled, the edges of the hole are electroless plated 31 and the plating is continued around the periphery of the hole as shown at 32, 33. A cadmium plated steel bolt 34 is introduced into the hole and is locked in position by a washer 35 and a nut 36. A further nut 37 is used to trap a grounding lead 38 which is thereby effectively conductively coupled to the plate 30.
Claims (14)
1. A carbon fibre reinforced composite material in which at least some exposed carbon fibres are electrically connected by electroless copper plating applied over the exposed carbon fibres.
2. A carbon fibre reinforced composite material as claimed in claim 1 in which exposed carbon fibre ends are electically connected by electroless copper plating.
3. A carbon fibre reinforced composite material as claimed in claim 1 or claim 2 in which carbon fibres intermediate of their ends are exposed and electroless copper plated.
4. A carbon fibre reinforced composite material as claimed in any preceding claim in which the electroless copper plating is coated with at least one further metallic coating.
5. A carbon fibre reinforced composite material as claimed in claim 4 in which the at least one further metallic coating is selected from one or more of tin, nickel and cadmium.
6. A carbon fibre reinforced composite material as claimed in claim 4 or 5 in which the at least one further metallic coating is electroplated on to the copper plating.
7. A method of electroless plating exposed carbon fibres in a carbon fibre reinforced composite material comprising the steps of masking the surfaces of the material not to be plated, sensitising the surfaces to be plated in a sensitising solution and depositing a layer of copper on those surfaces in a plating solution, the solution containing metal ions, a reducing agent and other means for pH stabilisation whereby the metal ions are reduced to metal atoms at the surface to be coated.
8. A method of electroless plating as claimed in claim 7 in which the sensitising solution comprises a solution in water of SnCI2, concentrated HCI and PdC12.
9. A method of electroless plateg as claimed in claim 8 in which the sensitising solution comprises a solution having substantially the same proportional composition as a 100 cm3 solution in water of
3.5 grams of SnCI2
20 cm3 of concentrated HCI
5 cm3 of 1% (by weight) PdCl2
10. A method of electroless plating as claimed in any of claims 7 to 9 in which the plating solution comprises a solution in water of CuSO4, sodium potassium tartrate, NaOH and formaldehyde.
11. A method of electroless plating as claimed in claim 10 in which thesensitising solution comprises a solution having substantially the same proportional compositionasa 1 dm3 solution in water of
35 grams of CuSO4 170 grams of sodium potassium tartrate
50 grams of NaOH plus 8% by volume of formaldehyde.
12. A method of electroless plating as claimed in claim 9 in which the material is placed in the sensitising solution for substantially five minutes and then rinsed in water for at least ten minutes.
13. A method of electroless plating as claimed in claim 11 in which the CuSO4 and the sodium potassium tartrate are dissolved in approximately 0.5 dm3 of water, the NaOH is added, the solution is made up to 1 dm3 and immediately prior to use the formaldehyde is added and the material is immersed in the plating solution for such time until the required thickness of copper coating is achieved.
14. A carbon fibre reinforced composite material made substantially as hereinbefore described with reference to the accompanying drawings.
1 5. A method of electroless plating exposed fibres in a carbon fibre reinforced composite material substantially as hereinbefore described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB7904102A GB2041342B (en) | 1979-02-06 | 1979-02-06 | Carbon fibre reinforced composite materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB7904102A GB2041342B (en) | 1979-02-06 | 1979-02-06 | Carbon fibre reinforced composite materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2041342A true GB2041342A (en) | 1980-09-10 |
| GB2041342B GB2041342B (en) | 1982-09-29 |
Family
ID=10502993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB7904102A Expired GB2041342B (en) | 1979-02-06 | 1979-02-06 | Carbon fibre reinforced composite materials |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2041342B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0065618A1 (en) * | 1981-02-21 | 1982-12-01 | Bayer Ag | Metallised carbon fibres and laminated products containing these fibres |
| CN115044843A (en) * | 2022-06-29 | 2022-09-13 | 东北大学 | Preparation method of rolled carbon fiber reinforced aluminum alloy composite material |
-
1979
- 1979-02-06 GB GB7904102A patent/GB2041342B/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0065618A1 (en) * | 1981-02-21 | 1982-12-01 | Bayer Ag | Metallised carbon fibres and laminated products containing these fibres |
| CN115044843A (en) * | 2022-06-29 | 2022-09-13 | 东北大学 | Preparation method of rolled carbon fiber reinforced aluminum alloy composite material |
| CN115044843B (en) * | 2022-06-29 | 2023-09-22 | 东北大学 | Preparation method of rolled carbon fiber reinforced aluminum alloy composite material |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2041342B (en) | 1982-09-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3585010A (en) | Printed circuit board and method of making same | |
| CN102701603B (en) | Preparation method for copper/zinc coating on surface of glass fiber | |
| KR900004543B1 (en) | Rfi shielded plastic articles and process for making same | |
| EP0081129B1 (en) | Method of activating substrate surfaces for electroless metal plating | |
| JPH0327587A (en) | Direct electro-plating on wall surface of through hole and printed circuit board | |
| CN105367809A (en) | Method for producing nickel-plated carbon fiber board having electromagnetic shielding property | |
| US4770946A (en) | Surface-treated magnesium or magnesium alloy, and surface treatment process therefor | |
| CN1109924A (en) | Plating surface of unconductor | |
| US4061837A (en) | Plastic-metal composite and method of making the same | |
| EP0997061A1 (en) | Method for metallization of a substrate containing electric non-conductive surface areas | |
| CN205223076U (en) | Nickel plating carbon fiber plate with electromagnetic shielding performance | |
| GB2041342A (en) | Carbon Fibre Reinforced Composite Materials | |
| CN1542073A (en) | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby | |
| EP0406678A1 (en) | Swelling agent for the pre-treatment of polymers to be plated by electrolysis | |
| CN1234910C (en) | Technique for producing multifunctional aluminum base flexible shielding material | |
| DE69229115T2 (en) | BASIC ACCELERATOR SOLUTION FOR DIRECT ELECTRO COATING | |
| JPS6077151A (en) | Metal-coated glass fiber, production thereof and frp product using said fiber | |
| US20140308538A1 (en) | Surface treated aluminum foil for electronic circuits | |
| CN220300847U (en) | Multifunctional corrosion-resistant composite layer and aluminum terminal | |
| JPH0513983A (en) | Elastic conductive member and manufacture thereof | |
| CN1181223C (en) | Metallization method of bimaleimide resin-glass fibre composite material | |
| JPH0366272B2 (en) | ||
| CN109338448B (en) | Method for foaming surface of metal film | |
| JPS5855674Y2 (en) | Plating jig for printed wiring boards | |
| CN105586598A (en) | Magnesium alloy material, terminal, communication device, vehicle and preparing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |