GB2031224A - Enclosure for photocell array - Google Patents
Enclosure for photocell array Download PDFInfo
- Publication number
- GB2031224A GB2031224A GB7930493A GB7930493A GB2031224A GB 2031224 A GB2031224 A GB 2031224A GB 7930493 A GB7930493 A GB 7930493A GB 7930493 A GB7930493 A GB 7930493A GB 2031224 A GB2031224 A GB 2031224A
- Authority
- GB
- United Kingdom
- Prior art keywords
- glass
- sheets
- photovoltaic devices
- array according
- array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011521 glass Substances 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 5
- 239000013536 elastomeric material Substances 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 abstract description 3
- 229920002554 vinyl polymer Polymers 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/30—Electrical components
- H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
- H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
- H01L31/02013—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising output lead wires elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0508—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
An array of photovoltaic devices has an enclosure comprising two spaced sheets of glass 2,7 between which the photovoltaic devices 5 are located, the two sheets of glass being sealed to each other at least around their edges, for example through a spacing frame 8, and one of the sheets of glass having electrically conductive tracks 1 serving to make electrical contacts to the photovoltaic devices. Advantageously the photovoltaic devices are also physically attached to the tracks. Instead of using the frame 8, the glass sheets may be sealed together by a layer of vinyl material to form a laminated structure. <IMAGE>
Description
SPECIFICATION
Enclosure of photovoltaic devices
The invention relates to the mounting and interconnection of photovoltaic devices and their enclosure to form an array suitable for use as an energy converter in a terrestrial environment.
Photovoltaic devices of known types need interconnection to provide voltages and currents at levels required for most practical applications. They also require protection from the environment to achieve acceptable life. Known methods include interconnection by mounting on printed wiring substrates and subsequent encapsulation in transparent materials with or without glass covers. It is also known to mount the photovoltaic devices on printed wiring substrates and enclose the assembly in a sealed case having a transparent cover.
It is an object of the present invention to reduce the cost and improve the performance of photovoltaic arrays for terrestrial use.
This object is achieved in accordance with the invention by enclosing the devices between two sheets of glass, the rearmost having on its inner surface conducting tracks which serve as part of the necessary interconnection and may also serve as points of attachment of the devices to the rear glass.
The front glass may be spaced from the rear glass by a frame to provide clearance for the devices, the two glasses being sealed together by the spacing frame or by the frame and suitable sealant in combination.
Alternatively, the glasses and mounted photovoltaic devices may be laminated together with an essentially transparent medium using materials and techniques derived from those employed in the manufacture of laminated windscreens for automotive and aeronautical use.
A Apreferred embodiment of the mounting and enclosure arrangement in accordance with the invention will now be described with reference to the accompanying drawing which shows a cross-section through the arrangement.
In the embodiment shown in Figure 1, the conducting tracks 1 are screen printed onto the inner surface of the rear glass 2 using conductive ink. The track is stabilised by firing, which process may conveniently be combined with any toughening process employed. Suitable sections of track may be extended onto the edge or onto the outer surface of the rear glass to form a connection between the array of photovoltaic devices and external circuits. It is convenient to mount a connection box 3 onto the edge or outer surface of the rear glass and the extended tracks are arranged to penetrate into this connection box, which may then be weatherproof.
Any track remaining exposed is protected by suitable known varnish 4 for example, or adhesive tape.
The photovoltaic devices 5 are connected mechanically and electrically to the conductive track by solder or conductive adhesive. Additional electrical connections 6 must be made between the front electrodes of the devices and appropriate points of the conductive track.
In this embodiment the front glass 7 is spaced from, but sealed to, the rear glass by an elastomeric frame 8 attached to both glasses by suitable adhesive 9. The elastomeric frame accomodates any dimensional change due to temperature difference between front and rear glasses.
In a second embodiment the devices 5 are mounted to the rear glass, as in the above described embodiment. Suitably formed sheets of interleaving vinyl material are then laminated between the rear glass with its assembled devices in position and the front glass. It is found advantageous to prepare interleaving sheets with cut out sections to accommodate the photovoltaic devices 5 and add an additional interleaving layer over cut out sheet and devices. This improves the flow of vinyl material around the devices and reduces the severity of the heating and pressing required to effect sealing.
As an alternative to extending the track on to the outer surface of the rear glass as described above, a suitably located hole could be provided in the rear glass through which electrical interconnection could be made between the track and the connection box, the interconnecting lead or leads passing directly into the box through the hole. Thus the connection box would be positioned on the outer face of the rear glass over the hole and the weatherproofing of the array would be enhanced.
Claims (10)
1. An array of photovoltaic devices comprising a plurality of photovoltaic devices and an enclosure therefor comprising two spaced sheets of glass between which the photovoltaic devices are located, the two sheets of glass being sealed to each other at least around their edges and one of the sheets of glass on its inwardly facing surface having an electrically conducting track serving to interconnect the photovoltaic devices electrically.
2. An array according to Claim 1, wherein said photovoltaic devices are physically attached to said track.
3. An array according to claim 1 or 2, wherein the two sheets of glass are spaced from each other by a frame through which said two sheets are sealed together.
4. An array according to claim 3, wherein said frame is of elastomeric material.
5. An array according to claim 1 or 2, wherein the two sheets of glass are spaced from each other by a laminate of thermoplastics material which is sealed to the sheets of glass by its own adhesion.
6. An array according to claim 5, wherein at least one layer of the laminate is formed with cut-outs to accommodate the photovoltaic devices.
7. An array according to any preceding claim, wherein said track extends to the outwardly facing surface of said one sheet of glass and into a connection box mounted on said outwardly facing surface.
8. An array acc ,rding to any one of claims 1 to 6, wherein a hole is provided through said one sheet of glass through which electrical interconnection is made between said track and a connection box mounted on the outwardly facing surface of said one sheet of glass.
9. An array according to claim 8, wherein the electrical lead or leads constituting said electrical interconnection pass through said hole directly into said connection box.
10. An array of photovoltaic devices substantially as hereinbefore described with reference to the accompanying drawing.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB7835600 | 1978-09-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB2031224A true GB2031224A (en) | 1980-04-16 |
Family
ID=10499440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB7930493A Withdrawn GB2031224A (en) | 1978-09-05 | 1979-09-03 | Enclosure for photocell array |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2031224A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3129456A1 (en) * | 1980-07-29 | 1982-04-22 | Andrés Cuevas Fernandez | Solar cell generator, particularly in plate form |
| US5071491A (en) * | 1988-12-12 | 1991-12-10 | Siemens Aktiengesellschaft | Frame for solar cell devices |
| DE19739170A1 (en) * | 1997-09-06 | 1999-03-18 | High Solar Entwicklungs Und Ve | Solar collector with current generating, platelet-shaped solar cells |
| WO2003050891A2 (en) * | 2001-10-23 | 2003-06-19 | Bp Corporation North America Inc. | Sealed thin film photovoltaic modules |
| US7449629B2 (en) | 2002-08-21 | 2008-11-11 | Truseal Technologies, Inc. | Solar panel including a low moisture vapor transmission rate adhesive composition |
| US8101039B2 (en) | 2008-04-10 | 2012-01-24 | Cardinal Ig Company | Manufacturing of photovoltaic subassemblies |
| US8716592B2 (en) | 2004-07-12 | 2014-05-06 | Quanex Ig Systems, Inc. | Thin film photovoltaic assembly method |
-
1979
- 1979-09-03 GB GB7930493A patent/GB2031224A/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3129456A1 (en) * | 1980-07-29 | 1982-04-22 | Andrés Cuevas Fernandez | Solar cell generator, particularly in plate form |
| US5071491A (en) * | 1988-12-12 | 1991-12-10 | Siemens Aktiengesellschaft | Frame for solar cell devices |
| DE19739170A1 (en) * | 1997-09-06 | 1999-03-18 | High Solar Entwicklungs Und Ve | Solar collector with current generating, platelet-shaped solar cells |
| WO2003050891A2 (en) * | 2001-10-23 | 2003-06-19 | Bp Corporation North America Inc. | Sealed thin film photovoltaic modules |
| WO2003050891A3 (en) * | 2001-10-23 | 2003-11-20 | Bp Corp North America Inc | Sealed thin film photovoltaic modules |
| US7449629B2 (en) | 2002-08-21 | 2008-11-11 | Truseal Technologies, Inc. | Solar panel including a low moisture vapor transmission rate adhesive composition |
| US8716592B2 (en) | 2004-07-12 | 2014-05-06 | Quanex Ig Systems, Inc. | Thin film photovoltaic assembly method |
| US8101039B2 (en) | 2008-04-10 | 2012-01-24 | Cardinal Ig Company | Manufacturing of photovoltaic subassemblies |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |