GB202210053D0 - Micromechanical devices and methods of manufacturing thereof - Google Patents

Micromechanical devices and methods of manufacturing thereof

Info

Publication number
GB202210053D0
GB202210053D0 GBGB2210053.1A GB202210053A GB202210053D0 GB 202210053 D0 GB202210053 D0 GB 202210053D0 GB 202210053 A GB202210053 A GB 202210053A GB 202210053 D0 GB202210053 D0 GB 202210053D0
Authority
GB
United Kingdom
Prior art keywords
manufacturing
methods
micromechanical devices
micromechanical
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GBGB2210053.1A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Autorient Tech AS
Original Assignee
Autorient Tech AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Autorient Tech AS filed Critical Autorient Tech AS
Priority to GBGB2210053.1A priority Critical patent/GB202210053D0/en
Publication of GB202210053D0 publication Critical patent/GB202210053D0/en
Priority to PCT/EP2023/069069 priority patent/WO2024008976A1/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0242—Gyroscopes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0361—Tips, pillars
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/05—Arrays
    • B81B2207/056—Arrays of static structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/013—Etching
    • B81C2201/0132—Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling
GBGB2210053.1A 2022-07-08 2022-07-08 Micromechanical devices and methods of manufacturing thereof Pending GB202210053D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GBGB2210053.1A GB202210053D0 (en) 2022-07-08 2022-07-08 Micromechanical devices and methods of manufacturing thereof
PCT/EP2023/069069 WO2024008976A1 (en) 2022-07-08 2023-07-10 Micromechanical devices having stress decoupling structure and methods of manufacturing thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB2210053.1A GB202210053D0 (en) 2022-07-08 2022-07-08 Micromechanical devices and methods of manufacturing thereof

Publications (1)

Publication Number Publication Date
GB202210053D0 true GB202210053D0 (en) 2022-08-24

Family

ID=84539966

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB2210053.1A Pending GB202210053D0 (en) 2022-07-08 2022-07-08 Micromechanical devices and methods of manufacturing thereof

Country Status (2)

Country Link
GB (1) GB202210053D0 (en)
WO (1) WO2024008976A1 (en)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1096260B1 (en) 1999-10-29 2005-06-15 SensoNor asa Micromechanical device
US7166911B2 (en) * 2002-09-04 2007-01-23 Analog Devices, Inc. Packaged microchip with premolded-type package
US7247246B2 (en) * 2003-10-20 2007-07-24 Atmel Corporation Vertical integration of a MEMS structure with electronics in a hermetically sealed cavity
FI116544B (en) 2004-12-31 2005-12-15 Vti Technologies Oy Oscillating, micro-mechanical angular velocity sensor has stationary electrode pairs together with surface of mass forming two capacitance which varies as function of angle of rotation of primary motion of mass
FI116543B (en) 2004-12-31 2005-12-15 Vti Technologies Oy Oscillating micro-mechanical angular velocity sensor, for vehicle, has seismic masses that are connected to support areas using springs or auxiliary structures
US8742557B2 (en) 2007-06-19 2014-06-03 Honeywell International Inc. Die mounting stress isolator
US7830003B2 (en) 2007-12-27 2010-11-09 Honeywell International, Inc. Mechanical isolation for MEMS devices
US8240203B2 (en) 2008-12-11 2012-08-14 Honeywell International Inc. MEMS devices and methods with controlled die bonding areas
CN201598171U (en) * 2010-03-05 2010-10-06 南京理工大学 Stress isolated MEMS inertial sensor packaging structure
EP2377809A1 (en) 2010-04-16 2011-10-19 SensoNor Technologies AS Method for Manufacturing a Hermetically Sealed Structure
EP2420470B1 (en) 2010-08-18 2015-10-14 Nxp B.V. MEMS Microphone
US8803262B2 (en) 2012-01-17 2014-08-12 Rosemount Aerospace Inc. Die attach stress isolation
DE102020203906A1 (en) * 2020-03-26 2021-09-30 Robert Bosch Gesellschaft mit beschränkter Haftung Method for manufacturing a micromechanical sensor

Also Published As

Publication number Publication date
WO2024008976A1 (en) 2024-01-11

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