GB202013991D0 - A multi-mode and efficient chip heat dissipation device - Google Patents

A multi-mode and efficient chip heat dissipation device

Info

Publication number
GB202013991D0
GB202013991D0 GBGB2013991.1A GB202013991A GB202013991D0 GB 202013991 D0 GB202013991 D0 GB 202013991D0 GB 202013991 A GB202013991 A GB 202013991A GB 202013991 D0 GB202013991 D0 GB 202013991D0
Authority
GB
United Kingdom
Prior art keywords
mode
heat dissipation
dissipation device
chip heat
efficient chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB2013991.1A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wenzhou Kongyunru Electronic Tech Co Ltd
Original Assignee
Wenzhou Kongyunru Electronic Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wenzhou Kongyunru Electronic Tech Co Ltd filed Critical Wenzhou Kongyunru Electronic Tech Co Ltd
Publication of GB202013991D0 publication Critical patent/GB202013991D0/en
Ceased legal-status Critical Current

Links

GBGB2013991.1A 2020-06-02 2020-09-07 A multi-mode and efficient chip heat dissipation device Ceased GB202013991D0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010490567.7A CN111564421B (en) 2020-06-02 2020-06-02 Multimode efficient chip heat abstractor

Publications (1)

Publication Number Publication Date
GB202013991D0 true GB202013991D0 (en) 2020-10-21

Family

ID=72072576

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB2013991.1A Ceased GB202013991D0 (en) 2020-06-02 2020-09-07 A multi-mode and efficient chip heat dissipation device

Country Status (2)

Country Link
CN (1) CN111564421B (en)
GB (1) GB202013991D0 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113161305B (en) * 2021-03-25 2022-03-22 浙江焜腾红外科技有限公司 Infrared thermal imaging chip refrigeration and heat dissipation device and using method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10147666B1 (en) * 2014-07-31 2018-12-04 Xilinx, Inc. Lateral cooling for multi-chip packages
CN205030036U (en) * 2015-10-25 2016-02-10 杨方舟 Novel converter heat dissipation device
CN110211938B (en) * 2019-06-24 2020-07-24 深圳市财富云端信息技术有限公司 Chip packaging device based on information technology control
CN110763076A (en) * 2019-11-13 2020-02-07 余姚零今换热设备有限公司 Heat exchanger capable of improving heat radiation efficiency
CN111030382A (en) * 2020-01-06 2020-04-17 嵊州软岩智能技术有限公司 Motor heat detection self-radiating device
CN111092520B (en) * 2020-02-27 2020-10-23 温州同岸机电配件股份有限公司 Self-radiating shell device of motor

Also Published As

Publication number Publication date
CN111564421A (en) 2020-08-21
CN111564421B (en) 2020-12-01

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)