CN111564421A - Multimode efficient chip heat abstractor - Google Patents
Multimode efficient chip heat abstractor Download PDFInfo
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- CN111564421A CN111564421A CN202010490567.7A CN202010490567A CN111564421A CN 111564421 A CN111564421 A CN 111564421A CN 202010490567 A CN202010490567 A CN 202010490567A CN 111564421 A CN111564421 A CN 111564421A
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- 238000001816 cooling Methods 0.000 claims abstract description 69
- 230000007246 mechanism Effects 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 4
- 230000002146 bilateral effect Effects 0.000 claims description 2
- 230000033228 biological regulation Effects 0.000 claims description 2
- 230000008844 regulatory mechanism Effects 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 29
- 239000002184 metal Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a multi-mode high-efficiency chip heat dissipation device, which comprises a box body, wherein a left end wall of the box body is provided with chip grooves which are communicated left and right, cooling pipes are symmetrically and fixedly arranged left and right in the chip grooves, chips are connected between the cooling pipes, slide blocks are symmetrically connected left and right in the chip grooves, end walls of the slide blocks, which are far away from the chips, are connected with stop blocks, a data wire groove with a forward opening is arranged on the front end wall of the chip groove, a data wire connected with the front end wall of the chip is arranged in the data wire groove, the front end of the data wire is connected with a connecting interface positioned outside the device, a group of front belt grooves with openings towards the chips are symmetrically arranged on the upper end wall and the lower end wall of the chip groove, an air cooling mechanism is arranged in the front belt groove, the rear end wall of the cooling pipe, the water-cooling heat dissipation mode can be normally operated at low temperature.
Description
Technical Field
The invention relates to the technical field of chip heat dissipation devices, in particular to a multi-mode high-efficiency chip heat dissipation device.
Background
Chips are a way in electronics to miniaturize circuits (including primarily semiconductor devices, including passive components, etc.) and are often fabricated on the surface of a semiconductor wafer. The heat dissipation of the chip greatly affects the working state of the chip.
The chip heat dissipation device at the present stage has the advantages of single heat dissipation mode, unobvious heat dissipation effect, excessive power sources required by heat dissipation, increased heat dissipation workload, and incapability of normally operating in a water-cooling heat dissipation mode when the temperature is too low.
Disclosure of Invention
Aiming at the technical defects, the invention provides a multi-mode high-efficiency chip heat dissipation device which can overcome the defects.
The invention relates to a multi-mode high-efficiency chip heat dissipation device, which comprises a box body, wherein a chip groove communicated left and right is arranged on the left end wall of the box body, cooling pipes are symmetrically and fixedly arranged left and right in the chip groove, a chip is connected between the cooling pipes in a sliding manner, sliders are symmetrically and slidably connected left and right in the chip groove, the end wall of each slider far away from the chip is fixedly connected with a stop block, the front end wall of the chip groove is provided with a data wire groove with a forward opening, a data wire connected with the front end wall of the chip is arranged in the data wire groove, the front end of the data wire is connected with a connecting interface positioned outside the device, the upper end wall and the lower end wall of the chip groove are symmetrically provided with a group of front belt grooves with forward openings towards the chip, an air cooling mechanism is arranged in the front belt groove, the rear end wall of, the improved cooling box is characterized in that a lower connecting pipe is fixedly connected to the front end of the heat exchange pipe, a temperature adjusting groove is formed in the position of the lower connecting pipe, a temperature adjusting mechanism is arranged in the position of the temperature adjusting groove, a liquid storage container is fixedly connected to the front end of the lower connecting pipe, a cooling groove is formed in the rear side of the heat exchange pipe, seven cooling fans are uniformly arranged in the cooling groove, a cooling fan shaft is fixedly connected to the rear end wall of each cooling fan, the cooling fan shaft is rotatably connected with the box body, a cooling mechanism is arranged on the rear side of each cooling fan shaft, a front connecting pipe is fixedly connected to the front end wall of each.
Preferably, the air cooling mechanism comprises a first belt wheel arranged in the front belt groove, the end wall of the first belt wheel far away from the chip is fixedly connected with a heat dissipation fan shaft, the heat dissipation fan shaft is rotatably connected with the box body, the end wall of the first belt wheel near the chip is provided with a fan groove with an opening facing the chip, a heat dissipation fan is fixedly connected between the side walls of the fan groove, a second belt wheel positioned at one side of the first belt wheel far away from the chip is arranged in the front belt groove, the second belt wheel is connected with the first belt wheel through a belt, the end wall of the second belt wheel far away from the chip is fixedly connected with a belt wheel shaft, the belt wheel shaft is rotatably connected with the box body, one end of the belt wheel shaft far away from the chip is fixedly connected with a first gear, and the first gear is positioned in a gear groove with an opening facing away from the chip, the front and back first gears are both provided with racks located on one side, away from the chip, of the first gear, a piston is fixedly connected to the front end wall of the stop block rack, the piston is located in a hydraulic cavity and is in sliding connection with the hydraulic cavity, and the hydraulic cavity is fixedly connected with one end, away from the chip, of the upper connecting pipe.
Preferably, a gear cavity is arranged between the rear ends of the upper and lower racks, a second gear is arranged in the gear cavity, the second gear is fixedly connected with the top end of a rear gear shaft, the rear gear shaft is rotatably connected with the box body, the rear gear shaft is fixedly connected with a third gear positioned on the lower side of the second gear, the second gear is meshed with fourth gears symmetrically arranged in a left-right direction, the fourth gears are fixedly connected with an incomplete gear shaft, the incomplete gear shaft is rotatably connected with the box body, incomplete gears are symmetrically and fixedly connected with the upper and lower end walls of the incomplete gear shaft, the incomplete gears are positioned in the incomplete gear cavity, the left and right incomplete gears can be meshed with the racks positioned between the incomplete gears, a rack groove with a forward opening is arranged on the rear end wall of the incomplete gear cavity, and the rack groove can be slidably connected with the racks, the rack rear end wall is connected with the rack groove through a spring.
Preferably, the third gear is engaged with a fifth gear located on the front side of the third gear, the fifth gear is fixedly connected with a front gear shaft, the fifth gear is located in a rear belt groove with an opening facing the chip, the front gear shaft is rotatably connected with the box body, the front gear shaft is fixedly connected with a third belt pulley located on the lower side of the fifth gear, a motor shaft cavity is formed between the left and right rear belt grooves, two fourth belt pulleys are symmetrically arranged in the motor shaft cavity up and down, the upper and lower fourth belt pulleys are fixedly connected with a motor shaft, the motor shaft is rotatably connected with the box body, the top end of the motor shaft is dynamically connected with a motor, and the bottom end of the motor shaft is fixedly connected with a first bevel gear.
Preferably, temperature regulation mechanism including set up in the heat pipe of lower connecting pipe upside, the heat pipe top is located folding flexible gasbag, folding flexible gasbag roof fixedly connected with sheetmetal, the circuit between heating ring and its power can be connected to the sheetmetal, heating ring inner ring wall fixed set up in on the temperature regulation groove lateral wall, folding flexible gasbag is located the sheetmetal spout, the sheetmetal spout with be located it sheetmetal sliding connection.
Preferably, the cooling mechanism comprises a second bevel gear fixedly connected to the rear end wall of the cooling fan shaft, the second bevel gear is meshed with a third bevel gear in the middle, the first bevel gear is symmetrically meshed with the third bevel gear in a left-right manner, the end wall of the motor, away from the third bevel gear, is fixedly connected with a bevel gear shaft, the bevel gear shaft is rotatably connected with the box body, three fourth bevel gears are uniformly and fixedly connected with the bevel gear shaft, the fourth bevel gears are located in bevel gear cavities, and the fourth bevel gears are meshed with the second bevel gear located on the front side of the fourth bevel gears.
The beneficial effects are that: the device has two heat dissipation modes of air cooling and water cooling, the heat dissipation effect is enhanced by combining the air cooling mode and the water cooling mode, the power source required by heat dissipation is less, the work load of heat dissipation is not increased basically, the cost of the device is lower, and the water cooling mode can run normally after automatic temperature rise when the temperature is too low, wherein the air cooling mechanism can dissipate heat of the chip through a plurality of fans, the temperature adjusting mechanism ensures the normal work of the water cooling mechanism at low temperature, the cooling mechanism does not need other devices for cooling, and the cost of the heat dissipation device is reduced.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a multimode and efficient chip heat dissipation device according to the present invention;
FIG. 2 is a schematic view of A-A in FIG. 1 according to an embodiment of the present invention;
FIG. 3 is a schematic view of B-B in FIG. 1 according to an embodiment of the present invention;
FIG. 4 is a schematic view of C-C in FIG. 2 according to an embodiment of the present invention;
FIG. 5 is a schematic view of D-D in FIG. 3 according to an embodiment of the present invention.
Detailed Description
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations and/or steps that are mutually exclusive.
The invention will now be described in detail with reference to fig. 1-5, for convenience of description, the following orientations will now be defined: the up, down, left, right, and front-back directions described below correspond to the up, down, left, right, and front-back directions in the projection relationship of fig. 1 itself.
The invention relates to a multi-mode high-efficiency chip heat dissipation device, which comprises a box body 10, wherein a chip groove 21 communicated left and right is arranged on the left end wall of the box body 10, cooling pipes 20 are symmetrically and fixedly arranged left and right in the chip groove 21, a chip 18 is slidably connected between the cooling pipes 20, sliders 23 are symmetrically and slidably connected left and right in the chip groove 21, a stop block 22 is fixedly connected to the end wall of each slider 23 far away from the chip 18, a data wire groove 41 with a forward opening is arranged on the front end wall of the chip groove 21, a data wire 40 connected with the front end wall of the chip 18 is arranged in the data wire groove 41, a connecting interface 39 positioned outside the device is connected to the front end of the data wire 40, a group of front belt grooves 13 with openings facing the chip 18 are symmetrically arranged on the upper and lower end walls of the chip groove 21, and an air cooling mechanism is arranged, the rear end wall of the cooling pipe 20 is fixedly connected with a rear connecting pipe 33, the bottom end of the rear connecting pipe 33 is fixedly connected with a heat exchange pipe 44, the front end of the heat exchange pipe 44 is fixedly connected with a lower connecting pipe 66, a temperature adjusting groove 67 is formed in the position of the lower connecting pipe 66, a temperature adjusting mechanism is arranged in the position of the temperature adjusting groove 67, the front end of the lower connecting pipe 66 is fixedly connected with a liquid storage container 42, the rear side of the heat exchange pipe 44 is provided with a cooling groove 45, seven cooling fans 46 are uniformly arranged in the cooling groove 45, the rear end wall of each cooling fan 46 is fixedly connected with a cooling fan shaft 47, the cooling fan shaft 47 is rotatably connected with the box body 10, the rear side of the cooling fan shaft 47 is provided with a cooling mechanism, the front end wall of the cooling pipe 20.
Advantageously, the air cooling mechanism comprises a first belt pulley 14 disposed in the front belt groove 13, a heat dissipation fan shaft 15 is fixedly connected to an end wall of the first belt pulley 14 away from the chip 18, the heat dissipation fan shaft 15 is rotatably connected to the case 10, a fan groove 16 opening to the chip 18 is disposed on an end wall of the first belt pulley 14 close to the chip 18, a heat dissipation fan 17 is fixedly connected between side walls of the fan groove 16, a second belt pulley 19 disposed on a side of the first belt pulley 14 away from the chip 18 is disposed in the front belt groove 13, the second belt pulley 19 is connected to the first belt pulley 14 through a belt, a belt pulley shaft 24 is fixedly connected to an end wall of the second belt pulley 19 away from the chip 18, the belt pulley shaft 24 is rotatably connected to the case 10, and a first gear 11 is fixedly connected to an end of the belt pulley shaft 24 away from the chip 18, the first gear 11 is located in a gear groove 12 with an opening facing away from the chip 18, the front and rear first gears 11 are both connected with a rack 29 located on one side of the first gear away from the chip 18, a piston 27 is fixedly connected to the front end wall of the rack 29 of the stop block 2, the piston 27 is located in a hydraulic cavity 26 and is in sliding connection with the hydraulic cavity 26, and the hydraulic cavity 26 is fixedly connected with one end of the upper connecting pipe 28 away from the chip 18.
Beneficially, a gear cavity 68 is arranged between the rear ends of the upper and lower racks 29, a second gear 49 is arranged in the gear cavity 68, the second gear 49 is fixedly connected with the top end of a rear gear shaft 50, the rear gear shaft 50 is rotatably connected with the box body 10, the rear gear shaft 50 is fixedly connected with a third gear 51 positioned at the lower side of the second gear 49, the second gear 49 is engaged with a fourth gear 53 arranged in bilateral symmetry, the fourth gear 53 is fixedly connected with an incomplete gear shaft 52, the incomplete gear shaft 52 is rotatably connected with the box body 10, incomplete gears 30 are symmetrically and fixedly connected with the upper and lower end walls of the incomplete gear shaft 52, the incomplete gears 30 are positioned in the incomplete gear cavity 25, the left and right incomplete gears 30 can be engaged with the racks 29 positioned therebetween, and the rear end wall of the incomplete gear cavity 25 is provided with a rack slot 32 with a forward opening, the rack groove 32 is slidably connected to the rack 29, and a spring 31 connects a rear end wall of the rack 29 to the rack groove 32.
Advantageously, the third gear 51 is engaged with a fifth gear 58 located at the front side thereof, the fifth gear 58 is fixedly connected with a front gear shaft 60, the fifth gear 58 is located in a rear belt groove 57 opening to the chip 18, the front gear shaft 60 is rotatably connected with the box body 10, the front gear shaft 60 is fixedly connected with a third belt pulley 59 located at the lower side of the fifth gear 58, a motor shaft cavity 69 is arranged between the left and right rear belt grooves 57, two fourth belt pulleys 54 are symmetrically arranged in the motor shaft cavity 69, the upper and lower fourth belt pulleys 54 are fixedly connected with a motor shaft 55, the motor shaft 55 is rotatably connected with the box body 10, the top end of the motor shaft 55 is dynamically connected with a motor 56, and the bottom end of the motor shaft 55 is fixedly connected with a first bevel gear 64.
Advantageously, the temperature adjustment mechanism includes a heat pipe 37 disposed on the upper side of the lower connection pipe 66, the top end of the heat pipe 37 is located inside the foldable and telescopic air bag 35, a metal sheet 36 is fixedly connected to the top wall of the foldable and telescopic air bag 35, the metal sheet 36 can connect the circuit between the heating ring 43 and the power supply thereof, the inner annular wall of the heating ring 43 is fixedly disposed on the side wall of the temperature adjustment groove 67, the foldable and telescopic air bag 35 is located inside the metal sheet sliding groove 34, and the metal sheet sliding groove 34 is slidably connected to the metal sheet 36 located therein.
Advantageously, the cooling mechanism comprises a second bevel gear 48 fixedly connected to the rear end wall of the cooling fan shaft 47, the second bevel gear 48 is connected with a third bevel gear 65 in a meshing manner, the first bevel gear 64 is connected with the third bevel gear 65 in a left-right symmetrical meshing manner, the end wall of the third bevel gear 65 far away from the motor 56 is fixedly connected with a bevel gear shaft 61, the bevel gear shaft 61 is rotatably connected with the box body 10, three fourth bevel gears 63 are uniformly and fixedly connected with the bevel gear shaft 61, the fourth bevel gears 63 are positioned in bevel gear cavities 62, and the fourth bevel gears 63 are connected with the second bevel gear 48 positioned at the front side thereof in a meshing manner.
In the initial state, the spring 31 and the folding telescopic air bag 35 are in a normal stretching state; sequence of mechanical actions of the whole device: 1. taking out the stoppers 22 and the sliders 23, placing the chip 18 between the upper and lower cooling tubes 20, pushing the stoppers 22 and the sliders 23 toward the chip 18, positioning the chip 18 with the stoppers 22 on both sides in close proximity to the left and right end walls of the case 10, connecting to other devices through the connection interface 39, starting the motor 56 to rotate the motor shaft 55, thereby rotating the fourth pulley 54, thereby rotating the third pulley 59, thereby rotating the front gear shaft 60, thereby rotating the fifth gear 58, thereby rotating the third gear 51, thereby rotating the rear gear shaft 50, thereby rotating the second gear 49, thereby rotating the fourth gear 53, thereby rotating the incomplete gear shaft 52, thereby rotating the incomplete gear 30, thereby repeatedly moving the rack 29 back and forth, thereby rotating the first gear 11, thereby rotating the pulley shaft 24, thereby rotating the second pulley 19, thereby rotating the first pulley 14 and thus rotating the heat dissipation fan 17, thereby performing continuous air-cooling heat dissipation on the chip 18; 2. the rack 29 repeatedly moves back and forth to repeatedly move the piston 27 back and forth, so that the cooling liquid among the front end of the hydraulic chamber 26, the upper connection pipe 28, the front connection pipe 38, the cooling pipe 20, the rear connection pipe 33, the heat exchange pipe 44, the lower connection pipe 66 and the liquid storage container 42 is maintained to circulate, so that the water-cooling heat dissipation of the chip 18 is realized, the motor shaft 55 rotates to rotate the first bevel gear 64, so that the third bevel gear 65 rotates, so that the bevel gear shaft 61 rotates, so that the fourth bevel gear 63 rotates, so that the second bevel gear 48 rotates, so that the cooling fan shaft 47 rotates, so that the cooling fan 46 rotates, so that the cooling liquid flowing through the heat exchange pipe 44 is cooled to ensure the working efficiency thereof; 3. when the temperature of the coolant is too low, the coolant is conducted into the foldable and retractable air bag 35 through the heat pipe 37, so that the gas in the foldable and retractable air bag 35 is contracted when cooled, the metal sheet 36 moves downwards to be connected with the circuit between the heating ring 43 and the power supply thereof, and the heating ring 43 heats the coolant flowing through the lower connecting pipe 66 to ensure the working efficiency thereof; 4. when the device needs to be reset, the motor 56 is turned off, so that each moving part stops moving, the spring 31 plays a reset role, and the device completes resetting.
The above description is only an embodiment of the invention, but the scope of the invention is not limited thereto, and any changes or substitutions that are not thought of through the inventive work should be included in the scope of the invention. Therefore, the protection scope of the invention should be subject to the protection scope defined by the claims.
Claims (6)
1. The utility model provides a multimode efficient chip heat abstractor, includes the box, its characterized in that: the left end wall of the box body is provided with chip grooves which are communicated left and right, cooling pipes are symmetrically and fixedly arranged left and right in the chip grooves, chips are connected between the cooling pipes, sliders are symmetrically and left and right in the chip grooves, end walls of the sliders, which are far away from the chips, are connected with stoppers, the front end wall of the chip groove is provided with a data wire groove with a forward opening, a data wire connected with the front end wall of the chip is arranged in the data wire groove, the front end of the data wire is connected with a connecting interface positioned outside the device, the upper end wall and the lower end wall of the chip groove are symmetrically provided with a group of openings which are symmetrically arranged left and right towards the front belt groove of the chip, an air cooling mechanism is arranged in the front belt groove, the rear end wall of the cooling pipe is connected with a rear connecting pipe, the bottom end of the rear connecting pipe, the improved cooling box is characterized in that a temperature adjusting mechanism is arranged at the position of the temperature adjusting groove, the front end of the lower connecting pipe is connected with a liquid storage container, the rear side of the heat exchange pipe is provided with a cooling groove, seven cooling fans are uniformly arranged in the cooling groove, the rear end wall of each cooling fan is connected with a cooling fan shaft, the cooling fan shaft is connected with the box body, the rear side of each cooling fan shaft is provided with a cooling mechanism, the front end wall of each cooling pipe is connected with a front connecting pipe, and the top end of each front connecting pipe is connected.
2. The multimode, efficient chip heat sink of claim 1, wherein: the air cooling mechanism comprises a first belt wheel arranged in the front belt groove, the end wall of the first belt wheel far away from the chip is connected with a radiating fan shaft, the radiating fan shaft is connected with the box body, the end wall of the first belt wheel close to the chip is provided with a fan groove with an opening facing the chip, a radiating fan is connected between the side walls of the fan groove, a second belt wheel positioned at one side of the first belt wheel far away from the chip is arranged in the front belt groove, the second belt wheel is connected with the first belt wheel through a belt, the end wall of the second belt wheel far away from the chip is connected with a belt wheel shaft, the belt wheel shaft is connected with the box body, one end of the belt wheel shaft far away from the chip is connected with a first gear, the first gear is positioned in a gear groove with an opening facing away from the chip, and the front and rear first gears are both connected with racks positioned at one side of the belt, the front end wall of the stop block rack is connected with a piston, the piston is located in a hydraulic cavity and connected with the hydraulic cavity, and the hydraulic cavity is connected with one end, far away from the chip, of the upper connecting pipe.
3. The multimode, efficient chip heat sink of claim 1, wherein: a gear cavity is arranged between the rear ends of the upper and lower racks, a second gear is arranged in the gear cavity, the second gear is connected with the top end of a rear gear shaft, the rear gear shaft is connected with the box body, the rear gear shaft is connected with a third gear positioned on the lower side of the second gear, the second gear is meshed with a fourth gear which is arranged symmetrically left and right, the fourth gear is connected with an incomplete gear shaft, the incomplete gear shaft is connected with the box body, the upper end wall and the lower end wall of the incomplete gear shaft are symmetrically connected with incomplete gears, the incomplete gear is positioned in the incomplete gear cavity, the left incomplete gear and the right incomplete gear can be meshed and connected with the rack positioned between the left incomplete gear and the right incomplete gear, the incomplete gear cavity rear end wall is provided with the forward rack groove of opening, the rack groove can with the rack is connected, rack rear end wall with pass through spring coupling between the rack groove.
4. The multimode, efficient chip heat sink of claim 3, wherein: the third gear is meshed with a fifth gear located on the front side of the third gear, the fifth gear is connected with a front gear shaft, the fifth gear is located in a rear belt groove with an opening facing the chip, the front gear shaft is connected with the box body, the front gear shaft is connected with a third belt wheel located on the lower side of the fifth gear, a motor shaft cavity is formed between the left belt groove and the right belt groove, two fourth belt wheels are symmetrically arranged in the motor shaft cavity up and down, the upper fourth belt wheel and the lower fourth belt wheel are connected with a motor shaft, the motor shaft is connected with the box body, the top end of the motor shaft is connected with a motor in a power mode, and the bottom end of the motor shaft is connected with a first bevel gear.
5. The multimode, efficient chip heat sink of claim 1, wherein: temperature regulation mechanism including set up in the heat pipe of connecting pipe upside down, the heat pipe top is located folding flexible gasbag, folding flexible gasbag roof is connected with the sheetmetal, the circuit between heating ring and its power can be connected to the sheetmetal, heating ring inner ring wall fixed set up in on the temperature regulation groove lateral wall, folding flexible gasbag is located the sheetmetal spout, the sheetmetal spout with be located it the sheetmetal is connected.
6. The multimode, efficient chip heat sink of claim 1, wherein: the cooling mechanism comprises a second bevel gear connected to the rear end wall of the cooling fan shaft, the second bevel gear is meshed with a third bevel gear in the middle, the first bevel gear is connected with the third bevel gear in a bilateral symmetry meshed mode, the end wall, far away from the motor, of the third bevel gear is connected with a bevel gear shaft, the bevel gear shaft is connected with the box body, the bevel gear shaft is evenly connected with three fourth bevel gears, the fourth bevel gears are located in bevel gear cavities, and the fourth bevel gears are meshed with the second bevel gears located on the front sides of the fourth bevel gears.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010490567.7A CN111564421B (en) | 2020-06-02 | 2020-06-02 | Multimode efficient chip heat abstractor |
| GBGB2013991.1A GB202013991D0 (en) | 2020-06-02 | 2020-09-07 | A multi-mode and efficient chip heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010490567.7A CN111564421B (en) | 2020-06-02 | 2020-06-02 | Multimode efficient chip heat abstractor |
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| Publication Number | Publication Date |
|---|---|
| CN111564421A true CN111564421A (en) | 2020-08-21 |
| CN111564421B CN111564421B (en) | 2020-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010490567.7A Active CN111564421B (en) | 2020-06-02 | 2020-06-02 | Multimode efficient chip heat abstractor |
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| CN (1) | CN111564421B (en) |
| GB (1) | GB202013991D0 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113161305A (en) * | 2021-03-25 | 2021-07-23 | 浙江焜腾红外科技有限公司 | Infrared thermal imaging chip refrigeration and heat dissipation device and using method thereof |
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2020
- 2020-06-02 CN CN202010490567.7A patent/CN111564421B/en active Active
- 2020-09-07 GB GBGB2013991.1A patent/GB202013991D0/en not_active Ceased
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| US10147666B1 (en) * | 2014-07-31 | 2018-12-04 | Xilinx, Inc. | Lateral cooling for multi-chip packages |
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| CN110211938A (en) * | 2019-06-24 | 2019-09-06 | 深圳市财富云端信息技术有限公司 | A kind of chip packaging device based on information technology control |
| CN110763076A (en) * | 2019-11-13 | 2020-02-07 | 余姚零今换热设备有限公司 | Heat exchanger capable of improving heat radiation efficiency |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113161305A (en) * | 2021-03-25 | 2021-07-23 | 浙江焜腾红外科技有限公司 | Infrared thermal imaging chip refrigeration and heat dissipation device and using method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111564421B (en) | 2020-12-01 |
| GB202013991D0 (en) | 2020-10-21 |
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