GB201808325D0 - Apparatus For Monitoring A Coating - Google Patents

Apparatus For Monitoring A Coating

Info

Publication number
GB201808325D0
GB201808325D0 GBGB1808325.3A GB201808325A GB201808325D0 GB 201808325 D0 GB201808325 D0 GB 201808325D0 GB 201808325 A GB201808325 A GB 201808325A GB 201808325 D0 GB201808325 D0 GB 201808325D0
Authority
GB
United Kingdom
Prior art keywords
monitoring
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB1808325.3A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3d Automated Metrology Inspection Ltd
Original Assignee
3d Automated Metrology Inspection Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3d Automated Metrology Inspection Ltd filed Critical 3d Automated Metrology Inspection Ltd
Priority to GBGB1808325.3A priority Critical patent/GB201808325D0/en
Publication of GB201808325D0 publication Critical patent/GB201808325D0/en
Priority to GB1907178.6A priority patent/GB2575543A/en
Priority to PCT/GB2019/051404 priority patent/WO2019224534A1/en
Ceased legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
GBGB1808325.3A 2018-05-21 2018-05-21 Apparatus For Monitoring A Coating Ceased GB201808325D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GBGB1808325.3A GB201808325D0 (en) 2018-05-21 2018-05-21 Apparatus For Monitoring A Coating
GB1907178.6A GB2575543A (en) 2018-05-21 2019-05-21 Apparatus for monitoring a coating
PCT/GB2019/051404 WO2019224534A1 (en) 2018-05-21 2019-05-21 Apparatus for monitoring a coating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB1808325.3A GB201808325D0 (en) 2018-05-21 2018-05-21 Apparatus For Monitoring A Coating

Publications (1)

Publication Number Publication Date
GB201808325D0 true GB201808325D0 (en) 2018-07-11

Family

ID=62812532

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB1808325.3A Ceased GB201808325D0 (en) 2018-05-21 2018-05-21 Apparatus For Monitoring A Coating
GB1907178.6A Withdrawn GB2575543A (en) 2018-05-21 2019-05-21 Apparatus for monitoring a coating

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB1907178.6A Withdrawn GB2575543A (en) 2018-05-21 2019-05-21 Apparatus for monitoring a coating

Country Status (2)

Country Link
GB (2) GB201808325D0 (en)
WO (1) WO2019224534A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11497124B2 (en) * 2020-06-09 2022-11-08 Io Tech Group Ltd. Methods for printing conformal materials on component edges at high resolution
CN117091516B (en) * 2022-05-12 2024-05-28 广州镭晨智能装备科技有限公司 Method, system and storage medium for detecting thickness of circuit board protective layer

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10204943B4 (en) * 2002-02-07 2005-04-21 Leica Microsystems Jena Gmbh Method for determining layer thicknesses
US8315834B2 (en) * 2003-12-17 2012-11-20 Siemens Energy, Inc. System and method for measuring coating thickness
FR2872897B1 (en) * 2004-07-06 2006-10-13 Commissariat Energie Atomique OPTICAL DEVICE FOR MEASURING THE THICKNESS OF AT LEAST PARTIALLY TRANSPARENT MEDIA
EP1643209B1 (en) * 2004-09-30 2020-11-04 Ansaldo Energia IP UK Limited Method for measuring a coating thickness
US20080158572A1 (en) * 2006-12-27 2008-07-03 Honeywell, Inc. System and method for measurement of thickness of thin films
EP2312267A1 (en) * 2009-10-19 2011-04-20 Siemens Aktiengesellschaft Device and method for measuring thickness of coating with laser triangulation
US9593939B1 (en) * 2013-12-30 2017-03-14 Flextronics Ap, Llc Glue thickness inspection (GTI)
KR101848173B1 (en) * 2016-11-24 2018-05-24 한양대학교 산학협력단 Apparatus and method for printed circuit board coating inspection

Also Published As

Publication number Publication date
GB201907178D0 (en) 2019-07-03
WO2019224534A1 (en) 2019-11-28
GB2575543A (en) 2020-01-15

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)