KR101848173B1 - Apparatus and method for printed circuit board coating inspection - Google Patents

Abstract

Disclosed are an apparatus and a method for printed circuit board coating inspection. The apparatus for printed circuit board coating inspection comprises: a transfer unit supplied with a printed circuit board in which a coating area is formed to be moved to a predetermined mounting point; an image photographing unit photographing the printed circuit board placed in the mounting point to acquire a substrate image; a substrate detection sensor detecting the printed circuit board placed in the mounting point; a height measurement sensor measuring a height of an electronic component mounted on the printed circuit board; a thickness measurement sensor measuring a coating thickness of the printed circuit board; and a control unit performing at least one of coating thickness inspection, bubble inspection, and exfoliation inspection with respect to the coating area with the acquired substrate image when the measured coating thickness satisfies a predetermined reference coating thickness.

Description

[0001] Apparatus and method for printed circuit board coating inspection [

The present invention relates to an apparatus and a method for inspecting a printed circuit board coating.

Generally, a printed circuit board (PCB) on which electronic components are mounted is coated with a coating solution for protecting electronic components. The bubbles present in the coagulated coating solution coated on the printed circuit board can swell up at an increased temperature and cause the coating solution to drop out. And peeling of the coating solution causes damages of electronic parts due to moisture, which may cause malfunction of a device on which the printed circuit board is mounted. And, the coating thickness below the appropriate level can cause the electronic parts mounted on the printed circuit board to be dropped out by the vibration.

Conventionally, in order to inspect the coating state of a printed circuit board, a fluorescent material that emits light in response to ultraviolet rays is added to a coating solution, and after the coating solution is applied to a printed circuit board, ultraviolet rays are irradiated onto a printed circuit board A check of the condition is made.

At this time, since the coating inspection is performed through the naked eye of the operator, in the process of performing inspection on a plurality of coating areas of the printed circuit board, the inspection of some areas may be omitted or the determination of the inspection result may be subjectively determined There is a problem. In addition, there is a problem that it is difficult to perform bubble inspection, peeling inspection and thickness inspection to be performed in coating inspection through the naked eye of a worker.

Korean Registered Patent No. 10-1017332 (Feb. 17, 2011)

The present invention provides a printed circuit board coating inspecting apparatus and method for inspecting coating thickness of a coating solution applied to protect a terminal of an electronic part or an electronic part on a printed circuit board on which an electronic part is mounted, coating state of bubbles and exfoliation .

According to an aspect of the present invention, a printed circuit board coating inspection apparatus is disclosed.

The printed circuit board coating inspecting apparatus according to an embodiment of the present invention includes a transferring unit for transferring a printed circuit board on which a coating area is formed to a predetermined seating position, A height sensor for measuring the height of the electronic component mounted on the printed circuit board, a sensor for measuring the thickness of the printed circuit board, A controller for performing at least one of a coating thickness inspection, a bubble inspection and a peeling inspection on the coating area using the obtained substrate image when the measured thickness and the measured coating thickness satisfy a preset reference coating thickness .

The control unit moves the printed circuit board to the seating point to measure the height of the electronic component and adjusts the height of the electronic component so that the image pickup unit and the thickness measurement sensor are positioned close to the printed circuit board Wherein the control unit controls the drive control unit and the thickness measurement sensor to measure the coating thickness and controls the image pickup unit to acquire the substrate image when the measured coating thickness satisfies a preset reference coating thickness, And an inspection unit that performs the coating thickness inspection, the bubble inspection, and the peeling test using the substrate image.

The inspection unit controls the thickness measurement sensor to measure the coating thickness at at least one point specified in the coating area, and if the measured coating thickness does not satisfy the reference coating thickness, the inspection unit terminates the inspection process .

The inspection unit performs the coating thickness inspection by estimating a coating thickness by comparing the hue of the coating area with a preset reference hue.

The inspection unit estimates a coating thickness by a color value difference with a reference color with respect to the color of the coating area.

The inspection unit performs the coating thickness inspection on the entire coated area and the divided areas obtained by dividing the coated area into a predetermined shape using color.

The inspection unit compares a pattern of the coating area with a preset existing bubble pattern to determine whether bubbles have been generated, thereby performing the bubble inspection.

The inspection unit searches for an edge in a coating area of the substrate image. When the edge is detected, the inspection unit determines the edge detection area as a bubble generation suspect area, and performs the bubble inspection on the bubble generation suspect area.

If the edge is not detected, the inspection unit performs the bubble inspection on the entire coating area.

The inspection unit performs the peeling test by checking an area where a color difference between pixels over the reference distance is detected based on a pixel having a distance difference equal to or greater than a predetermined reference distance in the coating area.

The inspection unit determines that the area where the color difference is greater than or equal to the reference distance is a stripped area.

The image photographing unit includes first moving means for moving on a guide bar formed on the upper portion along the longitudinal direction of the conveyance unit, second moving means for moving on a first guide rail formed along the vertical direction to the first moving means, A camera installed in the second moving means so as to face the lower portion so as to approach and photograph the printed circuit board located at the seating point, and a camera installed at the lower end of the first moving means so that ultraviolet rays are irradiated onto the printed circuit board ≪ / RTI >

The thickness measuring sensor is mounted on the second moving means such that it moves on a second guide rail formed along the vertical direction to the second moving means and looks downward with the camera.

The height measurement sensor is installed on a side of the seating point, and detects whether the electronic component exceeds a preset height.

The height measuring sensor is provided to be movable on the guide bar with moving means, and measures the height of each electronic component mounted on the printed circuit board.

When the drive control unit receives the substrate detection signal from the substrate detection sensor, the drive control unit stops driving the transfer unit to place the printed circuit board on the seating position.

The driving control unit controls the first moving means, the second driving means, and the second driving means so that the camera, the ultraviolet light, and the thickness measurement sensor approach the printed circuit board as much as possible without contacting the electronic component, The movement means and the movement of the thickness measurement sensor.

According to another aspect of the present invention, there is provided a printed circuit board coating inspection method comprising: a transferring part for transferring a printed circuit board on which a coating area is formed; an image pickup part for photographing the printed circuit board; a substrate sensor; a height measuring sensor; A method of inspecting a printed circuit board coating performed by an apparatus is disclosed.

A method of inspecting a printed circuit board coating according to an exemplary embodiment of the present invention includes moving a printed circuit board to a predetermined seating position using the conveyance unit and the substrate detection sensor, Moving the image pickup unit and the thickness measurement sensor close to the printed circuit board in accordance with a height of the electronic component, measuring a height of the electronic component mounted on the printed circuit board by using the thickness measurement sensor, Measuring a coating thickness of the printed circuit board, if the measured coating thickness satisfies a predetermined reference coating thickness, capturing the printed circuit board to obtain a substrate image, and using the obtained substrate image, Inspecting the coating area, wherein the step of inspecting the coating area comprises: A thickness inspection step, a bubble inspection step, and a peeling inspection step.

The coating thickness inspection step performs the coating thickness inspection by estimating a coating thickness by comparing a hue of the coating area with a preset reference hue.

In the bubble inspection step, bubble inspection is performed by comparing a pattern of the coating area with a preset existing bubble pattern to determine whether bubbles have been generated.

In the peeling test, the peeling test is performed by checking a region where a color difference between pixels over the reference distance is detected based on a pixel having a distance difference greater than or equal to a predetermined reference distance in the coating region.

An apparatus and a method for inspecting a printed circuit board coating according to an embodiment of the present invention are provided for checking the coating thickness of a coating solution applied to a printed circuit board on which electronic parts are mounted and the coating state of bubbles and peeling, The coating state of the applied coating solution can be automatically and accurately discriminated without manual operation, and the inspection accuracy can be greatly improved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 schematically illustrates the structure of a printed circuit board coating inspection apparatus according to an embodiment of the present invention; FIG.
2 is a view showing an image pickup part and a thickness measurement sensor of the printed circuit board coating inspection apparatus of FIG.
3 is a view illustrating a height measurement sensor of the printed circuit board coating inspection apparatus of FIG.
4 is a flowchart illustrating a method of inspecting a printed circuit board coating according to an embodiment of the present invention.
Figure 5 is a flow chart detailing the coating thickness checking step of Figure 4;
6 is a flow chart showing in detail the bubble inspection step of FIG. 4;
FIG. 7 is a flow chart showing in detail the peeling test step of FIG. 4; FIG.
Figures 8-11 illustrate coated printed circuit boards.

As used herein, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. In this specification, the terms "comprising ", or" comprising "and the like should not be construed as necessarily including the various elements or steps described in the specification, Or may be further comprised of additional components or steps. Also, the terms "part," " module, "and the like described in the specification mean units for processing at least one function or operation, which may be implemented in hardware or software or a combination of hardware and software .

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic view illustrating the configuration of a printed circuit board coating inspecting apparatus according to an embodiment of the present invention, FIG. 2 is a view showing an image capturing unit and a thickness measuring sensor of the printed circuit board coating inspecting apparatus of FIG. 1 FIG. 3 is a view illustrating a height measurement sensor of the printed circuit board coating inspection apparatus of FIG. 1, and FIGS. 8 to 11 are views illustrating a coated printed circuit board. Hereinafter, a configuration of a printed circuit board coating inspection apparatus according to an embodiment of the present invention will be described with reference to FIG. 1, with reference to FIGS. 2, 3, and 8 to 11.

1, a PCB inspection apparatus according to an exemplary embodiment of the present invention includes a transfer unit 100, an image pickup unit 200, a substrate detection sensor 310, a height measurement sensor 320, a thickness measurement sensor 330 and a control unit 400.

The transfer unit 100 receives the printed circuit board 10 on which the coating area 15 is formed on the mounted electronic component and moves the printed circuit board 10 to the predetermined seating point 20.

For example, the transfer unit 100 may comprise a conveyor belt to move the printed circuit board 10, and may include a stopper for fixing the printed circuit board 10 arriving at the seating point 20.

The image capturing unit 200 captures a printed circuit board 10 positioned at the seating point 20 to obtain a substrate image.

The thickness measuring sensor 330 measures the coating thickness of the printed circuit board 10.

2, the image capturing unit 200 may include a camera 210, an ultraviolet light 220, a first moving unit 230, and a second moving unit 240 .

That is, the first moving means 230 can move on the guide bar 250 formed on the upper portion along the longitudinal direction (x axis) of the transfer unit 100. The second moving means 240 can move on the first guide rail 231 formed along the vertical direction (z-axis) to the first moving means 230. At this time, the camera 210 may be installed in the second moving unit 240 so as to look down the lower side of the printed circuit board 10 for photographing. The ultraviolet light 220 may be installed at the lower end of the first moving unit 230 so that ultraviolet rays are irradiated onto the printed circuit board 10 to be photographed. The thickness measuring sensor 330 moves on the second guide rail 241 formed along the vertical direction (z-axis) to the second moving means 240 and moves along the second guide rail 241, May be installed in the means (240). As described above, the camera 210, the ultraviolet light 220, and the thickness measuring sensor 330 are installed in the first moving unit 230 and the second moving unit 240, . ≪ / RTI >

The apparatus for inspecting a printed circuit board coating according to an embodiment of the present invention includes an ultraviolet light source 220 for obtaining a substrate image on which a coating area 15 of a printed circuit board 10 appears, After irradiating ultraviolet rays, the camera 210 is used to photograph the printed circuit board 10. For example, FIG. 8 is a substrate image of the printed circuit board 10 not irradiated with ultraviolet rays, and FIG. 9 is a substrate image of the printed circuit board 10 irradiated with ultraviolet rays.

The substrate detection sensor 310 senses the printed circuit board 10 located at the seating point 20. [

The height measuring sensor 320 measures the height of the electronic component mounted on the printed circuit board 10. [

For example, referring to FIG. 3, the substrate detection sensor 310 may be installed at a lower portion of the seating point 20 to detect whether the printed circuit board 10 is positioned, and may include a plurality of sensing sensors 311 and 312 May be additionally installed to accurately detect whether or not the printed circuit board 10 is positioned. That is, the first sensing sensor 311 and the second sensing sensor 312 are installed at both ends of the seating point 20 to sense both ends of the printed circuit board 10, 20) position.

The height measurement sensor 320 may be at least one of the first height measurement sensor 321 and the second height measurement sensor 322. The first height measurement sensor 321 may be installed on a side surface of the seating point 20 to detect whether an electronic component mounted on the printed circuit board 10 exceeds a preset height, The height of each electronic component mounted on the printed circuit board 10 positioned at the seating point 20 is set so as to move on the guide bar 250 with the moving means like the image pickup unit 200, Can be measured.

The control unit 400 controls each component of the printed circuit board coating inspection apparatus (for example, the transfer unit 100, the image pickup unit 200, and the substrate 100) to inspect the coating area 15 of the printed circuit board 10 to be supplied. (Not shown) of the printed circuit board 10 using the substrate image of the printed circuit board 10, and controls the driving of the sensing area 310, the height measurement sensor 320, the thickness measurement sensor 330, (15).

That is, the control unit 400 includes a driving control unit 410, an inspection unit 420, and a storage unit 430.

The drive control unit 410 may control the transfer unit 100 according to the substrate detection signal of the substrate detection sensor 310 so that the supplied printed circuit board 10 is seated at the mount point 20. [ For example, when the drive control unit 410 receives the substrate detection signal from the substrate detection sensor 310, the drive control unit 410 may stop driving the transfer unit 100 to place the printed circuit board 10 on the seating point 20 .

Then, the drive control unit 410 controls the height measurement sensor 320 to measure the height of the electronic component mounted on the printed circuit board 10.

The driving control unit 410 controls the positions of the image pickup unit 200 and the thickness measurement sensor 330 according to the height of the electronic component measured by the height measurement sensor 320. For example, the driving control unit 410 may control the camera 210, the ultraviolet light 220, and the thickness measurement sensor 330 to be mounted on the printed circuit board 10 without contacting the electronic components using the measured height of the electronic component. It is possible to control the movement of the first moving means 230, the second moving means 240 and the thickness measuring sensor 330 so as to approach as close as possible.

The inspection unit 420 controls the thickness measurement sensor 330 to measure the coating thickness of the printed circuit board 10 and determines whether the measured coating thickness satisfies a preset reference coating thickness. For example, the measurement of the coating thickness may be performed at at least one point specified in the coating area 15, and whether the measured coating thickness satisfies the reference coating thickness may be determined, The inspection procedure may be terminated.

If the measured coating thickness satisfies the preset reference coating thickness, the inspection unit 420 may take the image of the printed circuit board 10 positioned at the seating point 20 to acquire the substrate image And performs coating thickness inspection, bubble inspection and peeling inspection on the coating area 15 using the obtained substrate image.

That is, the inspection unit 420 performs the coating thickness inspection by estimating the coating thickness by comparing the hue of the coating area 15 with the reference hue. The inspection unit 420 can estimate the coating thickness by the color value difference with the reference color with respect to the color of the coating area 15. [ For example, the inspection unit 420 estimates an area having a large color value (i.e., a dark area) of the coating area 15 as a reference area based on the reference color as a thicker area than the reference thickness, and conversely, By estimating the area of the coating area 15 having a small color value (i.e., the thin area) as the area where the coating thickness is thinner than the reference, the approximate coating thickness of the coating area 15 can be estimated. The inspection unit 420 may perform a coating thickness inspection using a doubled color for each of the entire coating region 15 and each of the divided regions in which the coating region 15 is divided into a predetermined shape.

The inspection unit 420 compares the pattern of the coating area 15 with the existing bubble pattern to determine whether the bubble is generated, thereby performing the bubble inspection. For example, the inspection unit 420 searches for an edge in the coating area 15 of the substrate image. When an edge is detected, the edge detection area is determined as a bubble generation suspected region, and bubble inspection is performed on the bubble generation suspected region Can be performed. Here, the size of the suspicious bubble region may be set based on the minimum distance of the recognized two edges. Alternatively, the inspection unit 420 can perform the bubble inspection for the entire coating area 15 when no edge is detected.

In addition, the inspection unit 420 performs a peeling test by checking a region where a color difference between pixels over a reference distance is detected based on a pixel having a distance difference greater than or equal to a reference distance in the coating region 15. For example, the inspection unit 420 can determine that the region where the color difference is greater than the reference distance is peeled off (coating solution uncoated region).

The storage unit 430 stores inspection setting information and inspection result information.

For example, the inspection setting information may include inspection reference information and device setting information received from a user using an input unit (not shown). The inspection reference information may include reference color information for coating thickness inspection, bubble inspection and exfoliation inspection, existing bubble pattern information, reference distance information between pixels, and reference coating thickness information, And may further include area information. The inspection subject area may be set to the entire coating area 15 as shown in Fig. 10, or may be set as a partition area where a specific electronic part is located, as shown in Fig.

The device setting information may include the seating point 20 information, the image capturing unit 200, and the position information of the thickness measuring sensor 330, and the like.

The inspection result information is calculated by the inspection unit 420 and can be output through an output unit (not shown).

FIG. 4 is a flowchart illustrating a method of inspecting a coating on a printed circuit board according to an exemplary embodiment of the present invention. FIG. 5 is a flowchart illustrating a coating thickness inspection step of FIG. And FIG. 7 is a flowchart showing in detail the peeling test step of FIG.

In step S410, the printed circuit board coating inspection apparatus receives and stores inspection setting information. Here, the inspection setting information may include inspection reference information and device setting information.

In step S420, the printed circuit board coating inspection apparatus moves the supplied printed circuit board 10 to the seating point 20. For example, when the printed circuit board 10 is detected at the seating point 20 by the substrate detection sensor 310, the printed circuit board coating inspection apparatus stops the driving of the transfer unit 100, Can be seated on the seat (20).

In step S430, the printed circuit board coating inspection apparatus measures the height of the electronic component mounted on the printed circuit board 10 using the height measurement sensor 320. [

In step S440, the printed circuit board coating inspection apparatus moves the image pickup unit 200 and the thickness measurement sensor 330 close to the printed circuit board 10 according to the height of the measured electronic component. For example, the printed circuit board coating inspecting apparatus uses the height of the measured electronic components so that the camera 210, the ultraviolet light 220, and the thickness measuring sensor 330 can be mounted on the printed circuit board 10 without contacting the electronic components. The second moving means 240, and the thickness measuring sensor 330 so as to approach the first moving means 230 as much as possible.

In step S450, the printed circuit board coating inspection apparatus measures the coating thickness of the printed circuit board 10 using the thickness measurement sensor 330 and determines whether the measured coating thickness satisfies a preset reference coating thickness . If the measured coating thickness does not satisfy the reference coating thickness, the printed circuit board 10 may be rejected and the inspection procedure may be terminated.

In step S460, the printed circuit board coating inspection apparatus captures the substrate image by photographing the printed circuit board 10 when the measured coating thickness satisfies a predetermined reference coating thickness.

In step S470, the printed circuit board coating inspection apparatus performs the coating thickness inspection by estimating the coating thickness by comparing the hue of the coating area 15 with the reference hue using the obtained substrate image.

Hereinafter, step S470 will be described in more detail with reference to FIG.

In step S471, the printed circuit board coating inspection apparatus analyzes the obtained substrate image to perform the pre-processing of the obtained substrate image to perform the printed circuit board coating inspection. For example, the printed circuit board coating inspection apparatus may perform image processing on a substrate image, and may convert a color coordinate system of the substrate image obtained by the RGB color coordinate system into a color coordinate system suitable for a predetermined computer processing.

In step S472, the printed circuit board coating inspection apparatus extracts inspection standards for coating thickness inspection from the previously stored inspection setting information. That is, the printed circuit board coating inspection apparatus can extract reference color information and inspection area information from the stored inspection setting information.

In step S473, the printed circuit board coating inspection apparatus performs coating thickness inspection by estimating the coating thickness by comparing the hue of the entire coating area 15 with the reference hue. Here, the printed circuit board coating inspection apparatus can estimate the coating thickness by the color value difference with the reference color with respect to the color of the entire coating region 15.

In step S474, the printed circuit board coating inspection apparatus performs the coating thickness inspection by estimating the coating thickness by comparing the hue of a predetermined division area in the coating area 15 with the reference hue. Here, the printed circuit board coating inspection apparatus can estimate the coating thickness by the color value difference with the reference color with respect to the color of the divided region.

In step S480, the printed circuit board coating inspection apparatus compares the pattern of the coating area 15 with the existing bubble pattern using the obtained substrate image to determine bubble occurrence, thereby performing the bubble detection.

Hereinafter, step S480 will be described in more detail with reference to FIG.

In step S481, the printed circuit board coating inspection apparatus analyzes the obtained substrate image to perform pre-processing of the obtained substrate image to perform the printed circuit board coating inspection. For example, the printed circuit board coating inspection apparatus may perform image processing on a substrate image, and may convert a color coordinate system of the substrate image obtained by the RGB color coordinate system into a color coordinate system suitable for a predetermined computer processing.

In step S482, the printed circuit board coating inspection apparatus extracts inspection standards for the bubble inspection from the previously stored inspection setting information. That is, the printed circuit board coating inspection apparatus can extract the existing bubble pattern information from the stored inspection setting information.

In step S483, the printed circuit board coating inspection apparatus searches for an edge in the coating area 15 of the substrate image, and determines whether or not an edge is detected.

In step S484, when an edge is detected, the printed circuit board coating inspection apparatus determines the edge detection region as a bubble generation suspected region and performs bubble inspection on the bubble generation suspected region. For example, the size of the suspected bubble region may be set based on the minimum distance of the two recognized edges.

In step S485, the printed circuit board coating inspection apparatus performs bubble inspection on the entire coating area 15 when an edge is not detected.

In step S490, the printed circuit board coating inspecting apparatus checks an area where a color difference between pixels over a reference distance is displayed based on a pixel having a distance difference greater than or equal to a reference distance in the coating area 15 using the obtained substrate image, .

Hereinafter, step S490 will be described in more detail with reference to FIG.

In step S491, the printed circuit board coating inspection apparatus analyzes the obtained substrate image and performs pre-processing of the obtained substrate image to perform the printed circuit board coating inspection. For example, the printed circuit board coating inspection apparatus may perform image processing on a substrate image, and may convert a color coordinate system of the substrate image obtained by the RGB color coordinate system into a color coordinate system suitable for a predetermined computer processing.

In step S492, the printed circuit board coating inspection apparatus extracts inspection criteria for the peeling test from the previously stored inspection setting information. That is, the printed circuit board coating inspection apparatus can extract reference distance information between pixels from the stored inspection setting information.

In step S493, the printed circuit board coating inspection apparatus specifies a pixel having a distance difference greater than or equal to a reference distance in the coating area 15.

In step S494, the printed circuit board coating inspection apparatus identifies a region where a color difference between pixels over a reference distance is indicated based on a specified pixel. For example, the printed circuit board coating inspecting apparatus can judge that the region where the color difference is larger than the reference distance is peeled off (the coating solution uncoated region).

On the other hand, the components of the above-described embodiment can be easily grasped from a process viewpoint. That is, each component can be identified as a respective process. Further, the process of the above-described embodiment can be easily grasped from the viewpoint of the components of the apparatus.

In addition, the above-described technical features may be implemented in the form of program instructions that can be executed through various computer means and recorded in a computer-readable medium. The computer-readable medium may include program instructions, data files, data structures, and the like, alone or in combination. The program instructions recorded on the medium may be those specially designed and constructed for the embodiments or may be available to those skilled in the art of computer software. Examples of computer-readable media include magnetic media such as hard disks, floppy disks and magnetic tape; optical media such as CD-ROMs and DVDs; magnetic media such as floppy disks; Magneto-optical media, and hardware devices specifically configured to store and execute program instructions such as ROM, RAM, flash memory, and the like. Examples of program instructions include machine language code such as those produced by a compiler, as well as high-level language code that can be executed by a computer using an interpreter or the like. The hardware device may be configured to operate as one or more software modules to perform the operations of the embodiments, and vice versa.

It will be apparent to those skilled in the art that various modifications, additions and substitutions are possible, without departing from the spirit and scope of the invention as defined by the appended claims. Should be regarded as belonging to the following claims.

100:
200: image shooting unit
310: substrate detection sensor
320: Height sensor
330: Thickness sensor
400:

Claims (21)

A transfer unit for transferring a printed circuit board having a coating area formed thereon to a preset seating position;
An image photographing unit for photographing the printed circuit board located at the seating point to obtain a substrate image;
A substrate detection sensor for sensing the printed circuit board located at the seating point;
A height measuring sensor for measuring a height of the electronic component mounted on the printed circuit board;
A thickness measuring sensor for measuring a coating thickness of the printed circuit board;
A drive control unit for moving the printed circuit board to the seating position to measure the height of the electronic component and controlling the image pickup unit and the thickness measurement sensor to be positioned close to the printed circuit board in accordance with the height of the electronic component, ; And
Wherein the controller controls the thickness measuring sensor to measure the coating thickness and controls the image pickup section to acquire the substrate image when the measured coating thickness satisfies a predetermined reference coating thickness, A coating thickness inspection, a bubble inspection and a peel inspection,
Wherein,
The coating thickness inspection is performed by estimating a coating thickness by a color value difference with a reference color with respect to the color of the coating area,
Wherein the edge detection region is determined as a bubble generation suspected region when the edge is detected and the existing bubble pattern previously set with the pattern of the coating region with respect to the suspected bubble generation region is determined Determining whether or not air bubbles have been generated by performing the air bubble test,
Wherein the peeling test is performed by determining a region where a color difference between the pixels having the reference distance or more is peeled off from a pixel having a distance difference greater than a predetermined reference distance in the coating region, .
delete The method according to claim 1,
Wherein the inspection unit controls the thickness measurement sensor to measure the coating thickness at at least one point specified in the coating area and if the measured coating thickness does not satisfy the reference coating thickness, Wherein the printed circuit board coating inspection apparatus comprises:
delete delete The method according to claim 1,
Wherein the inspection unit performs the coating thickness inspection using the color for each of the entire coating area and each of the divided areas obtained by dividing the coating area into predetermined shapes.
delete delete The method according to claim 1,
Wherein the inspection unit performs the bubble inspection on the entire coating area when the edge is not detected.
delete delete The method according to claim 1,
Wherein,
A first moving means for moving on a guide bar formed on an upper portion along a longitudinal direction of the conveyance unit;
Second moving means for moving on a first guide rail formed along the vertical direction to said first moving means;
A camera installed on the second moving means so as to approach and photograph the printed circuit board located at the lower seating position; And
And an ultraviolet light illumination unit installed at a lower end of the first moving unit so that the printed circuit board is irradiated with ultraviolet light.
13. The method of claim 12,
Wherein the thickness measuring sensor is mounted on the second moving means such that the thickness measuring sensor moves on a second guide rail formed along the vertical direction to the second moving means and faces the lower portion together with the camera. .
13. The method of claim 12,
Wherein the height measuring sensor is installed on a side surface of the seating point to detect whether the electronic component exceeds a preset height.
13. The method of claim 12,
Wherein the height measuring sensor is provided to move on the guide bar and includes moving means for measuring height of each electronic component mounted on the printed circuit board.
13. The method of claim 12,
Wherein the driving control unit stops the driving of the conveyance unit when the substrate detection signal is received from the substrate detection sensor, thereby placing the printed circuit board on the seating point.
13. The method of claim 12,
The driving control unit controls the first moving means, the second driving means, and the second driving means so that the camera, the ultraviolet light, and the thickness measurement sensor approach the printed circuit board as much as possible without contacting the electronic component, The moving means and the movement of the thickness measuring sensor are controlled.
A printed circuit board coating inspection performed by a printed circuit board coating inspection apparatus including a transfer section for moving a printed circuit board on which a coated region is formed, an image capturing section for capturing the printed circuit board, a substrate detecting sensor, a height measuring sensor and a thickness measuring sensor In the inspection method,
Moving the printed circuit board to a predetermined seating position using the conveyance unit and the substrate detection sensor;
Measuring a height of the electronic component mounted on the printed circuit board using the height measuring sensor;
Moving the image pickup unit and the thickness measurement sensor close to the printed circuit board according to a height of the measured electronic component;
Measuring a coating thickness of the printed circuit board using the thickness measurement sensor;
If the measured coating thickness satisfies a predetermined reference coating thickness, capturing the printed circuit board to obtain a substrate image; And
And inspecting the coating area using the obtained substrate image,
The step of inspecting the coating area includes a coating thickness inspection step, a bubble inspection step, and a stripping inspection step,
The coating thickness inspection step may include:
The coating thickness inspection is performed by estimating a coating thickness by a color value difference with a reference color with respect to the color of the coating area,
In the bubble inspection step,
Wherein the edge detection region is determined as a bubble generation suspected region when the edge is detected and the existing bubble pattern previously set with the pattern of the coating region with respect to the suspected bubble generation region is determined Determining whether or not air bubbles have been generated by performing the air bubble test,
In the peeling test,
Wherein the peeling test is performed by determining a region where a color difference between pixels having the reference distance or more is peeled off from a pixel having a distance difference of a predetermined distance or more in a predetermined region of the coating region, .



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