GB201709290D0 - Coil antenna device and antenna module - Google Patents

Coil antenna device and antenna module

Info

Publication number
GB201709290D0
GB201709290D0 GBGB1709290.9A GB201709290A GB201709290D0 GB 201709290 D0 GB201709290 D0 GB 201709290D0 GB 201709290 A GB201709290 A GB 201709290A GB 201709290 D0 GB201709290 D0 GB 201709290D0
Authority
GB
United Kingdom
Prior art keywords
antenna
coil
module
antenna device
antenna module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB1709290.9A
Other versions
GB2549630A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of GB201709290D0 publication Critical patent/GB201709290D0/en
Publication of GB2549630A publication Critical patent/GB2549630A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
    • H01Q7/08—Ferrite rod or like elongated core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/003—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Details Of Aerials (AREA)
  • Support Of Aerials (AREA)
  • Magnetic Resonance Imaging Apparatus (AREA)
GB1709290.9A 2012-05-09 2017-06-12 Coil antenna device and antenna module Withdrawn GB2549630A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012107164 2012-05-09
JP2013033101 2013-02-22
GB1400713.2A GB2516130B (en) 2012-05-09 2013-04-24 Coil antenna device and antenna module

Publications (2)

Publication Number Publication Date
GB201709290D0 true GB201709290D0 (en) 2017-07-26
GB2549630A GB2549630A (en) 2017-10-25

Family

ID=49550609

Family Applications (2)

Application Number Title Priority Date Filing Date
GB1400713.2A Active GB2516130B (en) 2012-05-09 2013-04-24 Coil antenna device and antenna module
GB1709290.9A Withdrawn GB2549630A (en) 2012-05-09 2017-06-12 Coil antenna device and antenna module

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB1400713.2A Active GB2516130B (en) 2012-05-09 2013-04-24 Coil antenna device and antenna module

Country Status (5)

Country Link
US (1) US10170836B2 (en)
JP (2) JP5700233B2 (en)
CN (3) CN106601421A (en)
GB (2) GB2516130B (en)
WO (1) WO2013168558A1 (en)

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GB2491447B (en) * 2010-03-24 2014-10-22 Murata Manufacturing Co RFID system
JP2015130566A (en) * 2014-01-07 2015-07-16 株式会社リコー Antenna device and apparatus
US9368564B2 (en) * 2014-03-28 2016-06-14 Qualcomm Incorporated 3D pillar inductor
US20150340338A1 (en) * 2014-05-23 2015-11-26 Texas Instruments Incorporated Conductor design for integrated magnetic devices
JP5930137B1 (en) * 2014-12-19 2016-06-08 株式会社村田製作所 Wireless IC device, resin molded body and manufacturing method thereof
CN110011705B (en) * 2014-12-19 2021-08-06 株式会社村田制作所 Wireless IC device
WO2016143584A1 (en) * 2015-03-09 2016-09-15 株式会社村田製作所 Coil device and electronic device
CN207624916U (en) 2015-03-12 2018-07-17 株式会社村田制作所 Communication terminal
CN106299633B (en) * 2015-05-15 2019-05-14 佳邦科技股份有限公司 Antenna structure and preparation method thereof for communication module
US20170005395A1 (en) * 2015-06-30 2017-01-05 Tdk Corporation Antenna device
WO2017033698A1 (en) * 2015-08-26 2017-03-02 株式会社村田製作所 Coil element, antenna device, card-type information medium, wireless ic device and electronic device
CN105552563B (en) * 2016-02-03 2018-08-10 深圳市信维通信股份有限公司 Bicyclic Wound-rotor type NFC antenna based on zigzag and antenna system
CN105609947A (en) * 2016-03-17 2016-05-25 青岛中科移动物联科技有限公司 Miniature 433-MHz Archimedes planar single spiral antenna
KR101866642B1 (en) * 2016-06-20 2018-06-11 주식회사 두산 Antenna module, and mobile terminal comprising the same
KR102480127B1 (en) * 2016-07-08 2022-12-22 주식회사 위츠 Wireless communication antenna and fabrication method thereof
KR101832344B1 (en) * 2016-08-12 2018-02-26 이재군 A multi-band antenna of the multi-layer structure including a magnetic material sheet
CN110121768B (en) * 2016-12-14 2023-10-31 株式会社村田制作所 Front-end module and communication device
EP3340260B1 (en) * 2016-12-22 2022-03-23 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Inductor made of component carrier material comprising electrically conductive plate structures
KR20180090078A (en) * 2017-02-02 2018-08-10 삼성전기주식회사 Wireless communication antenna
CN108879083B (en) * 2017-05-09 2020-05-26 昌泽科技有限公司 Method for manufacturing chip signal element
KR20190009936A (en) * 2017-07-20 2019-01-30 삼성전기주식회사 Antenna module and electronic device having the same
KR20190066872A (en) * 2017-12-06 2019-06-14 삼성전기주식회사 Wireless communication antenna
KR20220052615A (en) * 2020-10-21 2022-04-28 타이코에이엠피 주식회사 Antenna device
JP7464210B1 (en) 2022-09-02 2024-04-09 株式会社村田製作所 RFID Module

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JPS60109205A (en) * 1983-11-18 1985-06-14 Canon Inc Coil assembly
JPH06112655A (en) * 1992-09-29 1994-04-22 Matsushita Electric Ind Co Ltd Multilayer printed wiring board with built-in coil, and its manufacture
US6442399B1 (en) * 1995-08-07 2002-08-27 Murata Manufacturing Co., Ltd. Mobile communication apparatus
JPH11214209A (en) * 1998-01-20 1999-08-06 Toshiba Corp Antenna magnetic core for non-contact data carrier, non-contact data carrier package, and non-contact data carrier system
US6288680B1 (en) * 1998-03-18 2001-09-11 Murata Manufacturing Co., Ltd. Antenna apparatus and mobile communication apparatus using the same
JP3982268B2 (en) * 2002-01-17 2007-09-26 ソニー株式会社 Antenna circuit device and manufacturing method thereof
US8436780B2 (en) * 2010-07-12 2013-05-07 Q-Track Corporation Planar loop antenna system
JP4206745B2 (en) * 2002-12-13 2009-01-14 株式会社村田製作所 Multilayer chip inductor
JP3594031B1 (en) * 2003-07-04 2004-11-24 株式会社村田製作所 Multilayer ceramic electronic component, multilayer coil component, and method of manufacturing multilayer ceramic electronic component
JP4277753B2 (en) * 2003-08-13 2009-06-10 株式会社村田製作所 Chip coil for antenna and chip coil antenna
WO2005036566A1 (en) * 2003-10-10 2005-04-21 Murata Manufacturing Co., Ltd. Multilayer coil component and its manufacturing method
JP2005184094A (en) * 2003-12-16 2005-07-07 Olympus Corp Antenna and manufacturing method of antenna
CN102709687B (en) * 2003-12-25 2013-09-25 三菱综合材料株式会社 Antenna device
CN1930776B (en) * 2004-03-16 2012-02-01 日立金属株式会社 High-frequency circuit and high-frequency component
US8072387B2 (en) * 2005-07-07 2011-12-06 Toda Kogyo Corporation Magnetic antenna and board mounted with the same
JP4821965B2 (en) * 2005-07-07 2011-11-24 戸田工業株式会社 Magnetic antenna
GB2485318B (en) * 2007-04-13 2012-10-10 Murata Manufacturing Co Magnetic field coupling antenna module and magnetic field coupling antenna device
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KR101663839B1 (en) 2008-04-25 2016-10-07 도다 고교 가부시끼가이샤 Magnetic antenna, substrate with the magnetic antenna mounted thereon, and rf tag
WO2010113751A1 (en) * 2009-03-31 2010-10-07 戸田工業株式会社 Composite rf tag and tool provided with the composite rf tag
JP5403279B2 (en) * 2010-08-04 2014-01-29 戸田工業株式会社 RF tag manufacturing method, magnetic antenna manufacturing method, substrate mounted with the RF tag, and communication system
CA2752716C (en) * 2010-09-21 2019-04-30 Inside Secure Nfc card sensitive to foucault currents

Also Published As

Publication number Publication date
GB201400713D0 (en) 2014-03-05
GB2516130B (en) 2018-05-23
CN103636066A (en) 2014-03-12
JP2015128302A (en) 2015-07-09
US20140176383A1 (en) 2014-06-26
JP5700233B2 (en) 2015-04-15
CN103636066B (en) 2017-02-08
US10170836B2 (en) 2019-01-01
GB2549630A (en) 2017-10-25
CN106486779A (en) 2017-03-08
CN106601421A (en) 2017-04-26
GB2516130A (en) 2015-01-14
WO2013168558A1 (en) 2013-11-14
JPWO2013168558A1 (en) 2016-01-07

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)