GB201708984D0 - Method and device for etching transparent insulating material with magnetic powder induction laser plasma - Google Patents
Method and device for etching transparent insulating material with magnetic powder induction laser plasmaInfo
- Publication number
- GB201708984D0 GB201708984D0 GBGB1708984.8A GB201708984A GB201708984D0 GB 201708984 D0 GB201708984 D0 GB 201708984D0 GB 201708984 A GB201708984 A GB 201708984A GB 201708984 D0 GB201708984 D0 GB 201708984D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- insulating material
- magnetic powder
- transparent insulating
- laser plasma
- powder induction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/346—Working by laser beam, e.g. welding, cutting or boring in combination with welding or cutting covered by groups B23K5/00 - B23K25/00, e.g. in combination with resistance welding
- B23K26/348—Working by laser beam, e.g. welding, cutting or boring in combination with welding or cutting covered by groups B23K5/00 - B23K25/00, e.g. in combination with resistance welding in combination with arc heating, e.g. TIG [tungsten inert gas], MIG [metal inert gas] or plasma welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/356—Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410663206.2A CN104475976B (en) | 2014-11-19 | 2014-11-19 | The method and apparatus of magnetic induction type laser plasma etching insulation transparent material |
PCT/CN2014/092874 WO2016078138A1 (en) | 2014-11-19 | 2014-12-03 | Method and device for etching transparent insulating material with magnetic powder induction laser plasma |
Publications (3)
Publication Number | Publication Date |
---|---|
GB201708984D0 true GB201708984D0 (en) | 2017-07-19 |
GB2547862A GB2547862A (en) | 2017-08-30 |
GB2547862B GB2547862B (en) | 2021-07-21 |
Family
ID=52750651
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1708984.8A Active GB2547862B (en) | 2014-11-19 | 2014-12-03 | Method and device for etching transparent insulating material with magnetic powder induction laser plasma |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN104475976B (en) |
GB (1) | GB2547862B (en) |
WO (1) | WO2016078138A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104942388B (en) * | 2015-06-17 | 2017-11-17 | 江苏大学 | The apparatus and method of electrochemical discharge and laser Compound Machining material |
CN106757285B (en) * | 2016-11-25 | 2019-03-05 | 江苏大学 | The inner-light powder-supplying composite electrodeposition processing method and its device of hollow laser |
CN108115296A (en) * | 2016-11-29 | 2018-06-05 | 深圳中科光子科技有限公司 | A kind of laser processing device and method |
CN106424987B (en) * | 2016-12-06 | 2018-10-09 | 江苏大学 | The coaxial combined machining method and device that pipe electrode electric discharge is irradiated with laser |
CN108169181A (en) * | 2016-12-08 | 2018-06-15 | 东莞东阳光科研发有限公司 | A kind of optical bio chip preparation method |
CN106944744B (en) * | 2017-04-26 | 2019-05-24 | 广东工业大学 | A kind of anisotropic material method for implantation and device based on induced with laser cavitation |
WO2019246167A1 (en) * | 2018-06-22 | 2019-12-26 | Avava, Inc. | Apparatus for materials processing |
CN112658446B (en) * | 2020-12-10 | 2023-04-07 | 中国科学院宁波材料技术与工程研究所 | Laser-induced plasma micro-machining device and method |
CN114012268B (en) * | 2021-10-13 | 2023-06-16 | 浙江师范大学 | Ultraviolet laser processing device and method for photovoltaic synergistic microstructure |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06102276B2 (en) * | 1985-11-11 | 1994-12-14 | 株式会社井上ジャパックス研究所 | Laser welding method |
JP3171150B2 (en) * | 1997-09-29 | 2001-05-28 | 日本電気株式会社 | Wiring correction method and device |
CN2422144Y (en) * | 2000-02-22 | 2001-03-07 | 魏荣忠 | Electromagnetic dustless blackboard |
JP2008246974A (en) * | 2007-03-30 | 2008-10-16 | Kobe Steel Ltd | Laminated resin coated metal plate excellent in electromagnetic wave absorbency |
CN101412176A (en) * | 2008-11-20 | 2009-04-22 | 江苏大学 | Laser impact refabrication method for metallic structural parts containing fine crack |
CN101665859B (en) * | 2009-09-08 | 2011-10-19 | 南京工业大学 | Laser shot-blasting process for stainless steel welded joint |
CN101701282B (en) * | 2009-10-30 | 2011-09-14 | 江苏大学 | Method for strengthening complex surface based on laser shock wave technology and device thereof |
CN101866996B (en) * | 2010-05-21 | 2011-11-23 | 山东大学 | LED large-area controllable surface coarsening and etching method based on laser |
CN102241201B (en) * | 2011-04-18 | 2014-12-31 | 北京工业大学 | Laser melting and etching marking device and method based on transparent material |
DE102012219890A1 (en) * | 2012-10-31 | 2014-04-30 | Robert Bosch Gmbh | Donor element and method for its production |
CN103170630B (en) * | 2013-04-19 | 2015-03-04 | 安徽工业大学 | Forming method and device of anisotropic neodymium iron boron bonded permanent magnet |
CN203437818U (en) * | 2013-05-16 | 2014-02-19 | 广东工业大学 | A processing device capable of increasing sapphire laser back wet etching rate |
-
2014
- 2014-11-19 CN CN201410663206.2A patent/CN104475976B/en not_active Expired - Fee Related
- 2014-12-03 WO PCT/CN2014/092874 patent/WO2016078138A1/en active Application Filing
- 2014-12-03 GB GB1708984.8A patent/GB2547862B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN104475976B (en) | 2016-04-06 |
CN104475976A (en) | 2015-04-01 |
GB2547862B (en) | 2021-07-21 |
WO2016078138A1 (en) | 2016-05-26 |
GB2547862A (en) | 2017-08-30 |
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