CN108115296A - A kind of laser processing device and method - Google Patents
A kind of laser processing device and method Download PDFInfo
- Publication number
- CN108115296A CN108115296A CN201611075252.6A CN201611075252A CN108115296A CN 108115296 A CN108115296 A CN 108115296A CN 201611075252 A CN201611075252 A CN 201611075252A CN 108115296 A CN108115296 A CN 108115296A
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- 238000000034 method Methods 0.000 title claims description 23
- 239000007788 liquid Substances 0.000 claims abstract description 87
- 230000008016 vaporization Effects 0.000 claims abstract description 10
- 238000009834 vaporization Methods 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 238000007493 shaping process Methods 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 229920000742 Cotton Polymers 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims 2
- 239000000463 material Substances 0.000 description 15
- 238000010586 diagram Methods 0.000 description 5
- 238000002679 ablation Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000859 sublimation Methods 0.000 description 2
- 230000008022 sublimation Effects 0.000 description 2
- 230000002459 sustained effect Effects 0.000 description 2
- 239000000571 coke Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
Abstract
A kind of laser processing device includes:Supporting item, for fixing workpiece to be processed;Laser sends laser beam for receiving enabled instruction;Beam expander, after the laser beam is expanded shaping, laser beam of the output with uniform energy density;Laser beam for adjusting the angle of the laser beam, is converged in the position of Laser Processing by scanning galvanometer;The laser beam focus for the position according to the Laser Processing, is formed hot spot on workpiece and is processed by focus lamp;Liquid tank is placed in the lower section of the workpiece, for storing the liquid that can cool down, when heating causes the liquid to cool down the vaporization of storage when processing, takes away the heat of the workpiece;Water-absorbing body is placed in the liquid tank below the workpiece, and the upper surface of the water-absorbing body is contacted with the lower surface of the workpiece, and for absorbing liquid, the surface that liquid is attached to the water-absorbing body persistently cools down the workpiece.In addition, also provide a kind of laser processing.
Description
Technical field
The present invention relates to laser technology field more particularly to a kind of laser processing device and methods.
Background technology
Laser Processing is the most common application of laser system.According to the mechanism that laser beam and material interact, substantially may be used
Laser Processing is divided into laser heat processing and photochemical reaction processes two classes.Laser heat processing refers to utilize laser beam projects to material
The fuel factor of surface generation is expected to complete process.
In practical applications, laser action causes material damage or serious side to that can generate very high temperature on material
Edge ablation in order to reduce influence degree of the ablation to material, accelerates cooling by being introduced into coolant in laser processing procedure, passes
The method of system includes directly soaking material in water or the method using surface injection water, since laser beam passes through water meeting
Refraction and scattering are generated, therefore influences whether the effect of Laser Processing, so needing the smooth water surface and the current of stabilization
It can obtain stable processing effect.
The content of the invention
In consideration of it, the embodiment of the present invention provides a kind of laser processing device and method, the present apparatus uses bibulous suction
Water body bracketing can not only use water rapid cooling, and water is constrained on water-absorbing body, does not interfere with laser beam below workpiece
Transmission, reduce laser refraction and scattering to processing when heat affecting, further stabilize the quality of Laser Processing.
A kind of laser processing device provided in an embodiment of the present invention, the laser processing device include:Supporting item, laser
Device, beam expander, scanning galvanometer, focus lamp, liquid tank and water-absorbing body, the supporting item are placed in the liquid tank, for fixing
Workpiece to be processed;The laser sends laser beam for receiving enabled instruction;The beam expander, for receiving the laser
The laser beam that device is sent, and after the laser beam is expanded shaping, laser beam of the output with uniform energy density is swept to described
Retouch galvanometer;The scanning galvanometer, has the homogeneous energy close for receiving the laser beam for having uniform energy density, and described in adjusting
The angle of the laser beam of degree converges in the laser beam for having uniform energy density on the focus lamp;The focus lamp is used
In the position according to work pieces process, the laser beam focus is formed into hot spot on the workpiece and is processed;The liquid tank,
The lower section of the workpiece is placed in, for storing the liquid that can cool down, heating up when processing causes the liquid vapour to cool down of storage
During change, the heat of the workpiece is taken away;Water-absorbing body is placed in the liquid tank below the workpiece, the upper table of the water-absorbing body
Face is contacted with the lower surface of the workpiece, and for absorbing liquid, liquid is attached to the surface of the water-absorbing body to the workpiece
Persistently cooled down.
Optionally, the supporting item is at least one circular or square cylinder.
Optionally, between the beam expanding lens and the focus lamp, the scanning galvanometer includes using the scanning galvanometer
In the scanning mirror for the laser beam deflection that will be exported and the galvanometer of adjusting lasing beam diameter.
Optionally, the liquid to cool down of the liquid tank storage can be water or alcohol.
Optionally, the water-absorbing body can be cavernous body or cotton.
A kind of laser processing provided in an embodiment of the present invention is fixed to be processed by the supporting item being placed in liquid tank
Workpiece;Laser receives enabled instruction and sends laser beam;Beam expander receives the laser beam, and the laser beam is expanded shaping
Afterwards, laser beam of the output with uniform energy density;Scanning galvanometer has the laser beam of uniform energy density described in receiving, and adjusts
The angle of the laser beam for having a uniform energy density, the laser beam for having uniform energy density is converged on focus lamp;
The focus lamp is formed the laser beam focus for having uniform energy density according to the position of work pieces process on the workpiece
Hot spot is processed;During the liquid to cool down the vaporization that heating causes to store in the liquid tank when processing, the work is taken away
The heat of part;Water-absorbing body is placed in the liquid tank below the workpiece, the upper surface of the water-absorbing body and the workpiece
Lower surface contact absorbs liquid, and the surface that liquid is attached to the water-absorbing body persistently cools down the workpiece.
Optionally, the supporting item is at least one circular or square cylinder.
Optionally, the liquid to cool down is water or alcohol.
Optionally, the water-absorbing body can be cavernous body or cotton.
The laser processing device and method of the embodiment of the present invention can utilize liquid sublimation to be taken away after vaporizing and laser machine
The heat generated in journey, fast cooling reduce influence degree of the ablation to workpiece material of Laser Processing, and pass through water suction
Body persistently absorbs water so that the continuous surface that the liquid that cools down is attached to water-absorbing body always effectively cools down, and stable liquid
Face does not interfere with the transmission of laser beam, and heat affecting when reducing the refraction of laser and scattering to processing further stabilizes sharp
The quality of light processing.
Description of the drawings
Fig. 1 is the module diagram of the laser processing device of one embodiment of the invention.
Fig. 2 is the structure diagram of the laser processing device of one embodiment of the invention.
Fig. 3 is the laser processing flow diagram of one embodiment of the invention.
Specific embodiment
Fig. 1 is the module diagram of the laser processing device of one embodiment of the invention, and Laser Processing belongs to contactless processing,
And the energy and its translational speed of high energy laser beam are adjustable, therefore can realize the purpose of a variety of processing.It can be right
Various metals, nonmetallic processing, particularly can be with processing high-hardness, high brittleness and dystectic material.Laser Processing is flexible big
It is mainly used for cutting, is surface-treated, welds, mark and punching etc..
Also referring to Fig. 1 and Fig. 2, the laser processing device 100 is arrived laser beam projects by hot worked mode
The fuel factor that is generated on workpiece 200 completes process.The laser processing device 100 includes:Supporting item 101, laser
103rd, beam expander 105, scanning galvanometer 107, focus lamp 109, liquid tank 111 and water-absorbing body 113, supporting item 101 are placed in the liquid
In body slot 111, for fixing workpiece to be processed;
In some embodiments, the supporting item 101 is at least one circular or square cylinder.
Direction, shape and the quantity of the supporting item 101 can adapt to any workpiece 200, for example, when the work
When part 200 is the packet described in Fig. 1, the supporting item 101 can be two or more cylinders, can also be two or more
Square body.When cylinder of the workpiece 200 for transverse direction, the supporting item 101 can be the cylinder of two or more Y shapes, use
It is fixed in by the horizontal cylinder in the opening of Y shape.Workpiece 200 to be processed can be various metals, non-metallic material
Material, or high rigidity, high brittleness and dystectic material.
Laser 103 sends laser beam for receiving enabled instruction;
In some embodiments, the laser 103 makes choice according to the material property and processing request of workpiece 200,
The laser 103 can be a point gas laser, solid state laser, semiconductor laser, optical fiber laser, dye laser
And at least one of free electron laser etc..
Beam expander 105, for receiving the laser beam that the laser 103 is sent, and after the laser beam is expanded shaping,
The laser beam with uniform energy density is exported to the scanning galvanometer 107;
In some embodiments, the beam expander 105 is located in the light path of the laser beam output beam, beam expander 105
It is a kind of common beam converter.Usually structure is expanded there are two types of structure:The structure of falling Kepler and the structure of falling Galileo.
The beam expander of Kepler's structure is that a small focal length convex lens and one big focal length convex lens are coaxially in series, and small focal length is convex
The object focus of lens is overlapped with the rear focus of big focal length convex lens.In embodiments of the present invention, the beam expander 105 be by
Convex lens and concavees lens composition, due to the addition of concavees lens, are improved the adjustable range for expanding multiplying power under the confined space,
The selection of concavees lens and convex lens can be realized utilizes minimum axial space and adjustable in identical expand than on the premise of
The scope of section is big, can be applied to expanding for higher power laser system.
Scanning galvanometer 107, has the homogeneous energy close for receiving the laser beam for having uniform energy density, and described in adjusting
The angle of the laser beam of degree converges in the laser beam for having uniform energy density on the focus lamp 109;
In some embodiments, the scanning galvanometer 107 is between the beam expanding lens 103 and the focus lamp 109, institute
Stating scanning galvanometer 107 includes the scanning mirror for deflecting outgoing laser beam and adjusts the galvanometer of beam diameter.Swash when described
After light beam is scanned the reflection of galvanometer 107, the scanning galvanometer 107 axis that prolongs back and forth of high speed under the drive of motor rotates, and reaches
Change the purpose of laser beam path.
The laser beam focus for the position processed according to workpiece 200, is formed light by focus lamp 109 on workpiece 200
Spot is processed;
In some embodiments, focused on after the focus lamp 109 is per beam laser beam transparent focus lamp 109 and form hot spot, with
Carry out the processing of workpiece 200.In the focusing system of current laser equipment, generally using traditional monolithic or multiple-piece
Spherical surface focusing mirror.
Liquid tank 111 is placed in the lower section of the workpiece 200, and for storing the liquid that can cool down, heating up when processing causes
During the liquid to cool down the vaporization of storage, the heat of the workpiece 200 is taken away;
In some embodiments, the liquid to cool down stored in the liquid tank 111 is water or alcohol.As described in Figure 1,
The liquid tank 111 is the cuboid of upper opening, contains the liquid water or alcohol that can cool down, the shape of the liquid tank 111
Shape can be adapted to according to the shape of workpiece 200.
Water-absorbing body 113 is placed in the liquid tank of 200 lower section of workpiece, the upper surface of the water-absorbing body 113 and institute
The lower surface contact of workpiece 200 is stated, for absorbing liquid, liquid is attached to the surface of the water-absorbing body 113 to the workpiece
200 are persistently cooled down.
In some embodiments, the water-absorbing body 113 is cavernous body or cotton.As shown in Fig. 2, the water-absorbing body 113 is
Cavernous body, the shape of sponge are to adapt to the cuboid of workpiece 200, and drag workpiece for supportting, when laser processing device 100 is swashing
When temperature promotes the liquid boiling vaporization in liquid tank 111 in light process, the sponge can constantly absorb liquid tank 111
In liquid so that the surface of sponge is constantly in moisture state, can so be cooled down with continuous and effective to workpieces processing 200.
Since cavernous body is very steady and sustained absorption liquid, liquid splash and fluctuation will not be caused.Therefore liquid tank 111 can be ensured
In liquid be constantly in stable state, can also cause the quality of work pieces process will not be subject to laser due to liquid refracting and anti-
The influence penetrated can cause the quality of processing effectively to be promoted.
Referring to Fig. 3, the method flow diagram of the laser processing for one embodiment of the invention, the laser processing
Comprise the following steps:
S101 fixes workpiece to be processed by the supporting item being placed in liquid tank;
After workpiece to be processed is determined, workpiece to be processed is fixed by supporting item, to be subsequently processed.
S103 starts the laser and sends laser beam;
In some embodiments, start button is had on the laser processing device, after startup, the laser provides
Laser beam.
S105, beam expander receive the laser beam, and after the laser beam is expanded shaping, and output has the homogeneous energy close
The laser beam of degree;
In some embodiments, the beam expander is located in the laser beam output beam light path, the beam expander extension
The diameter of laser beam reduces the angle of divergence of laser beam, and laser beam reshaping is exported the laser beam into uniform energy density.
S107, scanning galvanometer receive described in have the laser beam of uniform energy density, and have uniform energy density described in adjusting
Laser beam angle, the laser beam for having uniform energy density is converged on focus lamp;
In some embodiments, after the laser beam is scanned vibration mirror reflected, the scanning galvanometer is under the drive of motor
High speed prolongs axis rotation back and forth, achievees the purpose that change laser beam path.
S109, the focus lamp gather the laser beam for having uniform energy density according to the position of the work pieces process
Coke forms hot spot on workpiece and is processed;
In some embodiments, when laser beam on room and time high concentration, using the focus lamp focus on after, can
The laser power density of high-energy is obtained so that spot diameter is narrowed down to micron order, high power density can be in any material
Laser Processing is carried out on the workpiece of material, high functional density, which also brings along high temperature, influences the material generation deformation of the workpiece
So as to influence processing effect.
S111 when the liquid to cool down the vaporization that the temperature heating of processing causes to store in the liquid tank, takes away institute
State the heat of workpiece;
In some embodiments, the liquid that can be cooled down using liquid tank storage is cooled down, and the liquid that can usually cool down exists
In the case that high temperature reaches boiling point, the liquid vaporization that can distil becomes steam, so as to take away the temperature of workpiece surface so that processing is more
Add and stablize effectively.
S113, water-absorbing body are placed in the liquid tank below the workpiece, the upper surface of the water-absorbing body and the work
The lower surface contact of part absorbs liquid, and the surface that liquid is attached to the water-absorbing body persistently cools down the workpiece.
In some embodiments, in laser processing procedure the rise of temperature can promote storage liquid boiling vaporization, the cavernous body meeting
Constantly absorb the liquid in liquid tank so that the surface of sponge is constantly in moisture state, so can giving with continuous and effective
Workpieces processing cools down.Since cavernous body is very steady and sustained absorption liquid, liquid splash and fluctuation will not be caused.It therefore can be with
Ensure that the liquid in liquid tank is constantly in stable state, can also cause the quality of work pieces process will not be subject to laser due to liquid
Body reflects and the influence of reflection, and the quality of processing can be caused effectively to be promoted.
Laser processing device and method in above-described embodiment, after being vaporized during processing using liquid sublimation
The heat generated in laser processing procedure is taken away, fast cooling reduces influence journey of the ablation of Laser Processing to workpiece material
Degree, and the liquid that cools down of persistently being absorbed water by water-absorbing body is attached to the continuous surface of water-absorbing body and is effectively dropped always
Temperature, and smoothly liquid side does not interfere with the transmission of laser beam, hot shadow when reducing the refraction of laser and scattering to processing
It rings, further stabilizes the quality of Laser Processing.
On this basis, the foregoing is merely the embodiment of the present invention, it is not intended to limit the scope of the invention, it is all
It is the equivalent structure or equivalent flow shift made using description of the invention and accompanying drawing content, such as technology between each embodiment
Feature be combined with each other, and is directly or indirectly used in other related technical areas, is similarly included in the patent of the present invention
In protection domain.
Claims (10)
1. a kind of laser processing device, which is characterized in that the laser processing device includes:Supporting item, laser, beam expander,
Scanning galvanometer, focus lamp, liquid tank and water-absorbing body,
The supporting item is placed in the liquid tank, for fixing workpiece to be processed;
The laser sends laser beam for receiving enabled instruction;
The beam expander, for receiving the laser beam that the laser is sent, and after the laser beam is expanded shaping, output tool
There is the laser beam of uniform energy density to the scanning galvanometer;
The scanning galvanometer for receiving the laser beam for having uniform energy density, and has uniform energy density described in adjustment
Laser beam angle, the laser beam for having uniform energy density is converged on the focus lamp;
The focus lamp, for the position according to work pieces process, by the laser beam focus for having uniform energy density described
Hot spot is formed on workpiece to be processed;
The liquid tank is placed in the lower section of the workpiece, and for storing the liquid that can cool down, heating up when processing causes storage
During the liquid vaporization that can cool down, the heat of the workpiece is taken away;
The water-absorbing body is placed in the liquid tank below the workpiece, the upper surface of the water-absorbing body and the workpiece
Lower surface contacts, and for absorbing liquid, the surface that liquid is attached to the water-absorbing body persistently cools down the workpiece.
2. laser processing device according to claim 1, which is characterized in that the supporting item is at least one circular or side
The cylinder of shape.
3. laser processing device according to claim 1, which is characterized in that the beam expanding lens is by convex lens and concavees lens group
Into.
4. laser processing device according to claim 1, which is characterized in that the scanning galvanometer be located at the beam expanding lens with
Between the focus lamp, the scanning galvanometer includes the scanning mirror for being used for the laser beam deflection that will be exported and adjusting laser beam is straight
The galvanometer in footpath.
5. laser processing device according to claim 1, which is characterized in that the liquid to cool down of the liquid tank storage
Body can be water or alcohol.
6. laser processing device according to claim 1, which is characterized in that the water-absorbing body can be cavernous body or cotton
Cloth.
7. a kind of laser processing, which is characterized in that comprise the following steps:
Workpiece to be processed is fixed by the supporting item being placed in liquid tank;
Laser receives enabled instruction and sends laser beam;
Beam expander receives the laser beam, and after the laser beam is expanded shaping, laser of the output with uniform energy density
Beam;
Scanning galvanometer has the laser beam of uniform energy density described in receiving, and have the laser beam of uniform energy density described in adjustment
Angle converges in the laser beam for having uniform energy density on focus lamp;
The focus lamp is according to the position of work pieces process, by the laser beam focus for having uniform energy density on the workpiece
Hot spot is formed to be processed;
During the liquid to cool down the vaporization that heating causes to store in the liquid tank when processing, the heat of the workpiece is taken away;
Water-absorbing body is placed in the liquid tank below the workpiece, the upper surface of the water-absorbing body and the lower surface of the workpiece
Contact absorbs liquid, and the surface that liquid is attached to the water-absorbing body persistently cools down the workpiece.
8. laser processing according to claim 7, which is characterized in that the supporting item is at least one circular or side
The cylinder of shape.
9. laser processing according to claim 7, which is characterized in that the liquid to cool down stored in the liquid tank
Body can be water or alcohol.
10. laser processing according to claim 7, which is characterized in that the water-absorbing body can be cavernous body or cotton
Cloth.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201611075252.6A CN108115296A (en) | 2016-11-29 | 2016-11-29 | A kind of laser processing device and method |
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CN201611075252.6A CN108115296A (en) | 2016-11-29 | 2016-11-29 | A kind of laser processing device and method |
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CN108115296A true CN108115296A (en) | 2018-06-05 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110233208A (en) * | 2019-05-09 | 2019-09-13 | 恩利克(浙江)智能装备有限公司 | A kind of fitting of rotatory polarization piece and shape cutting apparatus and method of flexibility OLED display panel |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050274702A1 (en) * | 2004-06-15 | 2005-12-15 | Laserfacturing Inc. | Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser |
CN101920398A (en) * | 2009-06-12 | 2010-12-22 | 东捷科技股份有限公司 | Laser cutting device with workpiece bottom immersed in liquid level |
CN102431694A (en) * | 2010-07-22 | 2012-05-02 | 太平洋专利有限公司 | Self-assemblable container for generic use and manufacturing method thereof |
CN102867876A (en) * | 2012-10-15 | 2013-01-09 | 上海电力学院 | Natural circulating type phase-changing radiating device generally used in condensation high-temperature hot point |
CN104475976A (en) * | 2014-11-19 | 2015-04-01 | 江苏大学 | Method and device for etching transparent insulating material by adopting magnetic powder induction type laser plasma |
CN106112276A (en) * | 2016-08-23 | 2016-11-16 | 苏州市华宁机械制造有限公司 | A kind of cooling jacket for cut laser head |
-
2016
- 2016-11-29 CN CN201611075252.6A patent/CN108115296A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050274702A1 (en) * | 2004-06-15 | 2005-12-15 | Laserfacturing Inc. | Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser |
CN101920398A (en) * | 2009-06-12 | 2010-12-22 | 东捷科技股份有限公司 | Laser cutting device with workpiece bottom immersed in liquid level |
CN102431694A (en) * | 2010-07-22 | 2012-05-02 | 太平洋专利有限公司 | Self-assemblable container for generic use and manufacturing method thereof |
CN102867876A (en) * | 2012-10-15 | 2013-01-09 | 上海电力学院 | Natural circulating type phase-changing radiating device generally used in condensation high-temperature hot point |
CN104475976A (en) * | 2014-11-19 | 2015-04-01 | 江苏大学 | Method and device for etching transparent insulating material by adopting magnetic powder induction type laser plasma |
CN106112276A (en) * | 2016-08-23 | 2016-11-16 | 苏州市华宁机械制造有限公司 | A kind of cooling jacket for cut laser head |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110233208A (en) * | 2019-05-09 | 2019-09-13 | 恩利克(浙江)智能装备有限公司 | A kind of fitting of rotatory polarization piece and shape cutting apparatus and method of flexibility OLED display panel |
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Application publication date: 20180605 |