CN206241465U - A kind of laser processing device - Google Patents
A kind of laser processing device Download PDFInfo
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- CN206241465U CN206241465U CN201621294422.5U CN201621294422U CN206241465U CN 206241465 U CN206241465 U CN 206241465U CN 201621294422 U CN201621294422 U CN 201621294422U CN 206241465 U CN206241465 U CN 206241465U
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Abstract
A kind of laser processing device includes：Support member, for fixing workpiece to be processed；Laser, laser beam is sent for receiving enabled instruction；Beam expander, after the laser beam is expanded into shaping, laser beam of the output with uniform energy density；Scanning galvanometer, the angle for adjusting the laser beam, laser beam is converged in the position of Laser Processing；The laser beam focus, for the position according to the Laser Processing, are formed hot spot and are processed by focus lamp on workpiece；Liquid tank, is placed in the lower section of the workpiece, for storing the liquid that can lower the temperature, when intensification causes the vaporizing liquid lowered the temperature of storage when processing, takes away the heat of the workpiece；Water-absorbing body, in the liquid tank being placed in below the workpiece, the upper surface of the water-absorbing body contacts with the lower surface of the workpiece, for absorbing liquid, the surface that liquid is attached to the water-absorbing body is persistently cooled down to the workpiece.
Description
Technical field
The utility model is related to laser technology field, more particularly to a kind of laser processing device.
Background technology
Laser Processing is the most frequently used application of laser system.According to the mechanism that laser beam and material interact, substantially may be used
Laser Processing is divided into laser heat processing and photochemical reaction processes two classes.Laser heat processing refers to using laser beam projects to material
Expect the fuel factor of surface generation to complete process.
In actual applications, laser action causes material damage or serious side to that can produce temperature very high on material
Edge ablation, in order to reduce influence degree of the ablation to material, cooling is accelerated by being introduced into coolant in laser processing procedure, is passed
The method of system includes directly soaking material in water, or using the method for surface injection water, because laser beam is by water meeting
Produce refraction and scatter, therefore influence whether the effect of Laser Processing, so the current of the smooth water surface of needs and stabilization are
The processing effect that can be stablized.
Utility model content
In consideration of it, the utility model embodiment provides a kind of laser processing device, the present apparatus uses bibulous water suction
Body bracketing can not only use water quick heat radiating, and water to be constrained on water-absorbing body below workpiece, not interfere with laser beam
Transmission, heat affecting when reducing the refraction and scattering of laser to processing, further stabilizes the quality of Laser Processing.
A kind of laser processing device that the utility model embodiment is provided, the laser processing device includes：Support member, swash
Light device, beam expander, scanning galvanometer, focus lamp, liquid tank and water-absorbing body, the support member are placed in the liquid tank, for solid
Determine workpiece to be processed；The laser, laser beam is sent for receiving enabled instruction；The beam expander, it is described sharp for receiving
The laser beam that light device sends, and after the laser beam is expanded into shaping, laser beam of the output with uniform energy density is to described
Scanning galvanometer；The scanning galvanometer, for receive it is described have the laser beam of uniform energy density, and have homogeneous energy described in adjusting
The angle of the laser beam of density, the laser beam for having uniform energy density is converged on the focus lamp；The focus lamp,
For the position according to work pieces process, the laser beam focus are formed into hot spot on the workpiece and is processed；The liquid
Groove, is placed in the lower section of the workpiece, and for storing the liquid that can lower the temperature, being heated up when processing causes the liquid lowered the temperature of storage
During vaporization, the heat of the workpiece is taken away；In the liquid tank that water-absorbing body is placed in below the workpiece, the water-absorbing body it is upper
Surface contacts with the lower surface of the workpiece, for absorbing liquid, liquid is attached into the surface of the water-absorbing body to the work
Part is persistently cooled down.
Alternatively, the support member is at least one circular or square cylinder.
Alternatively, the scanning galvanometer is located between the beam expanding lens and the focus lamp, and the scanning galvanometer includes using
In the scanning mirror and the galvanometer of regulation lasing beam diameter of the laser beam deflection that will be exported.
Alternatively, the liquid lowered the temperature of the liquid tank storage can be water or alcohol.
Alternatively, the water-absorbing body can be cavernous body or cotton.
The laser processing device of the utility model embodiment, laser processing procedure is taken away after being vaporized using liquid sublimation
The heat of middle generation, fast cooling reduces the influence degree of the ablation to workpiece material of Laser Processing, and by water-absorbing body
Lasting water suction causes that the continuous surface that cooling liquid is attached to water-absorbing body all the time is effectively lowered the temperature, and smoothly liquid side
The transmission of laser beam is not interfered with, heat affecting when reducing the refraction and scattering of laser to processing further stabilizes laser
The quality of processing.
Brief description of the drawings
Fig. 1 is the module diagram of the laser processing device of the embodiment of the utility model one.
Fig. 2 is the structural representation of the laser processing device of the embodiment of the utility model one.
Specific embodiment
Fig. 1 is the module diagram of the laser processing device of the embodiment of the utility model one, and Laser Processing belongs to contactless
Processing, and the energy and its translational speed of high energy laser beam are adjustable, therefore the purpose of various processing can be realized.It can
With to various metals, nonmetallic processing, particularly can be with processing high-hardness, fragility high and dystectic material.Laser Processing is soft
Property is mainly used in cutting greatly, is surface-treated, welds, mark and punching etc..
Also referring to Fig. 1 and Fig. 2, the laser processing device 100 is arrived laser beam projects by hot worked mode
The fuel factor produced on workpiece 200 completes process.The laser processing device 100 includes：Support member 101, laser
103rd, beam expander 105, scanning galvanometer 107, focus lamp 109, liquid tank 111 and water-absorbing body 113, support member 101, are placed in the liquid
In body groove 111, for fixing workpiece to be processed；
In certain embodiments, the support member 101 is at least one circular or square cylinder.
The direction of the support member 101, shape and quantity can adapt to any workpiece 200, for example, working as the work
When part 200 is the packet described in Fig. 1, the support member 101 can be two or more cylinders, can also be two or more
Square body.When the workpiece 200 is for horizontal cylinder, the support member 101 can be the cylinder of two or more Y shapes, use
In the opening that the horizontal cylinder is fixed on into Y shape.Workpiece 200 to be processed can be various metals, non-metallic material
Material, or high rigidity, fragility high and dystectic material.
Laser 103, laser beam is sent for receiving enabled instruction；
In certain embodiments, the laser 103 is selected according to the material property and processing request of workpiece 200,
The laser 103 can be point gas laser, solid state laser, semiconductor laser, optical fiber laser, a dye laser
And at least one in free electron laser etc..
Beam expander 105, the laser beam for receiving the transmission of the laser 103, and after the laser beam is expanded into shaping,
Export the laser beam with uniform energy density to the scanning galvanometer 107；
In certain embodiments, the beam expander 105 is located in the light path of the laser beam output beam, beam expander 105
It is a kind of conventional beam converter.Generally have two kinds of structures expands structure：The structure of falling Kepler and the structure of falling Galileo.
The beam expander of Kepler's structure is a small focal length convex lens coaxially in series with a big focal length convex lens, and small focal length is convex
The object focus of lens overlaps with the rear focus of big focal length convex lens.In the utility model embodiment, the beam expander 105
It is made up of with concavees lens convex lens, due to the addition of concavees lens, enables to expand the adjustable range of multiplying power under the confined space
Improve, the selection of concavees lens and convex lens can realize identical expand than on the premise of using minimum axial space and
Adjustable scope is big, can apply to expanding for more power laser system.
Scanning galvanometer 107, for receive it is described have the laser beam of uniform energy density, and have homogeneous energy close described in adjusting
The angle of the laser beam of degree, the laser beam that will have uniform energy density is converged on the focus lamp 109；
In certain embodiments, the scanning galvanometer 107 is located between the beam expanding lens 103 and the focus lamp 109, institute
Stating scanning galvanometer 107 includes the galvanometer of scanning mirror and regulation beam diameter for outgoing laser beam to be deflected.Swash when described
After the scanned galvanometer 107 of light beam reflects, the axle that prolongs back and forth of high speed under the drive of motor of the scanning galvanometer 107 rotates, and reaches
Change the purpose of laser beam path.
The laser beam focus, for the position processed according to workpiece 200, are formed light by focus lamp 109 on workpiece 200
Spot is processed；
In certain embodiments, focused on after the focus lamp 109 is per beam laser beam transparent focus lamp 109 and form hot spot, with
Carry out the processing of workpiece 200.In the focusing system of current laser equipment, traditional monolithic or multiple-piece is generally used
Spherical surface focusing mirror.
Liquid tank 111, is placed in the lower section of the workpiece 200, and for storing the liquid that can lower the temperature, being heated up when processing causes
During the vaporizing liquid lowered the temperature of storage, the heat of the workpiece 200 is taken away；
In certain embodiments, the liquid lowered the temperature for being stored in the liquid tank 111 is water or alcohol.As described in Figure 2,
The liquid tank 111 is the cuboid of upper opening, contains the liquid water or alcohol that can lower the temperature, the shape of the liquid tank 111
Shape can be adapted to according to the shape of workpiece 200.
Water-absorbing body 113, is placed in the liquid tank 111 of the lower section of the workpiece 200, the upper surface of the water-absorbing body 113
Lower surface with the workpiece 200 is contacted, and for absorbing liquid, liquid is attached into the surface of the water-absorbing body 113 to described
Workpiece 200 is persistently cooled down.
In certain embodiments, the water-absorbing body 113 is cavernous body or cotton.As shown in Fig. 2 the water-absorbing body 113 is
Cavernous body, the cuboid for being shaped as adapting to workpiece 200 of sponge, and workpiece is dragged for supportting, when laser processing device 100 is swashing
When temperature promotes the liquid boiling in liquid tank 111 to vaporize in light process, the sponge can constantly absorb liquid tank 111
In liquid so that the surface of sponge is constantly in moisture state, so can with continuous and effective to processing workpiece 200 lower the temperature.
Because cavernous body is very stable lasting absorption liquid, liquid splash and fluctuation are not resulted in.Therefore liquid tank 111 can be ensured
In liquid be constantly in the state of stabilization, can also cause the quality of work pieces process will not be subject to laser due to liquid refracting and anti-
The influence penetrated, can cause that the quality of processing is effectively lifted.
Laser processing device in above-described embodiment, is taken away sharp after being vaporized using liquid sublimation during processing
The heat produced in light process, fast cooling reduces the influence degree of the ablation to workpiece material of Laser Processing, and
Persistently absorbed water by water-absorbing body so that the continuous surface that liquid of lowering the temperature is attached to water-absorbing body all the time is effectively lowered the temperature, Er Qieping
Steady liquid side does not interfere with the transmission of laser beam, heat affecting when reducing the refraction and scattering of laser to processing, further
Stabilize the quality of Laser Processing.
On this basis, embodiment of the present utility model is the foregoing is only, not thereby limits of the present utility model special
Sharp scope, equivalent structure or equivalent flow conversion that every utilization the utility model specification and accompanying drawing content are made, for example respectively
Technical characteristic be combined with each other between embodiment, or is directly or indirectly used in other related technical fields, similarly includes
In scope of patent protection of the present utility model.
Claims (6)
1. a kind of laser processing device, it is characterised in that the laser processing device includes：Support member, laser, beam expander,
Scanning galvanometer, focus lamp, liquid tank and water-absorbing body,
The support member, is placed in the liquid tank, for fixing workpiece to be processed；
The laser, laser beam is sent for receiving enabled instruction；
The beam expander, for receiving the laser beam that the laser sends, and after the laser beam is expanded into shaping, output tool
There is the laser beam of uniform energy density to the scanning galvanometer；
The scanning galvanometer, for receive it is described have the laser beam of uniform energy density, and have uniform energy density described in adjusting
Laser beam angle, the laser beam for having uniform energy density is converged on the focus lamp；
The focus lamp, for the position according to work pieces process, by the laser beam focus for having uniform energy density described
Hot spot is formed on workpiece to be processed；
The liquid tank, is placed in the lower section of the workpiece, and for storing the liquid that can lower the temperature, being heated up when processing causes storage
During the vaporizing liquid that can lower the temperature, the heat of the workpiece is taken away；
The water-absorbing body, in the liquid tank being placed in below the workpiece, the upper surface of the water-absorbing body and the workpiece
Lower surface is contacted, and for absorbing liquid, the surface that liquid is attached to the water-absorbing body is persistently cooled down to the workpiece.
2. laser processing device according to claim 1, it is characterised in that the support member is at least one circular or side
The cylinder of shape.
3. laser processing device according to claim 1, it is characterised in that the beam expanding lens is by convex lens and concavees lens group
Into.
4. laser processing device according to claim 1, it is characterised in that the scanning galvanometer be located at the beam expanding lens with
Between the focus lamp, scanning mirror and regulation laser beam of the scanning galvanometer including the laser beam deflection for that will export are straight
The galvanometer in footpath.
5. laser processing device according to claim 1, it is characterised in that the liquid lowered the temperature of the liquid tank storage
Body, can be water or alcohol.
6. laser processing device according to claim 1, it is characterised in that the water-absorbing body can be cavernous body or cotton
Cloth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621294422.5U CN206241465U (en) | 2016-11-29 | 2016-11-29 | A kind of laser processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621294422.5U CN206241465U (en) | 2016-11-29 | 2016-11-29 | A kind of laser processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206241465U true CN206241465U (en) | 2017-06-13 |
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ID=59002602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621294422.5U Active CN206241465U (en) | 2016-11-29 | 2016-11-29 | A kind of laser processing device |
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| CN (1) | CN206241465U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108511620A (en) * | 2018-03-02 | 2018-09-07 | 南京第壹有机光电有限公司 | A kind of laser package OLED illumination panels and packaging method |
| CN113751869A (en) * | 2021-09-09 | 2021-12-07 | 芜湖天弋能源科技有限公司 | Tool and method for removing heat conduction in lithium ion battery laser welding |
-
2016
- 2016-11-29 CN CN201621294422.5U patent/CN206241465U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108511620A (en) * | 2018-03-02 | 2018-09-07 | 南京第壹有机光电有限公司 | A kind of laser package OLED illumination panels and packaging method |
| CN108511620B (en) * | 2018-03-02 | 2020-09-08 | 江苏壹光科技有限公司 | Laser packaging OLED lighting panel and packaging method |
| CN113751869A (en) * | 2021-09-09 | 2021-12-07 | 芜湖天弋能源科技有限公司 | Tool and method for removing heat conduction in lithium ion battery laser welding |
| CN113751869B (en) * | 2021-09-09 | 2023-08-29 | 芜湖天弋能源科技有限公司 | Method for removing heat conduction in laser welding of lithium ion battery |
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