GB2010732B - Mould for encapsulating a component having a lead at an angle to the axis of the component - Google Patents

Mould for encapsulating a component having a lead at an angle to the axis of the component

Info

Publication number
GB2010732B
GB2010732B GB7849172A GB7849172A GB2010732B GB 2010732 B GB2010732 B GB 2010732B GB 7849172 A GB7849172 A GB 7849172A GB 7849172 A GB7849172 A GB 7849172A GB 2010732 B GB2010732 B GB 2010732B
Authority
GB
United Kingdom
Prior art keywords
component
encapsulating
mould
lead
angle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7849172A
Other languages
English (en)
Other versions
GB2010732A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Union Carbide Corp
Original Assignee
Union Carbide Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/862,556 external-priority patent/US4155533A/en
Priority claimed from US05/862,553 external-priority patent/US4155532A/en
Application filed by Union Carbide Corp filed Critical Union Carbide Corp
Publication of GB2010732A publication Critical patent/GB2010732A/en
Application granted granted Critical
Publication of GB2010732B publication Critical patent/GB2010732B/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Ceramic Capacitors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
GB7849172A 1977-12-20 1978-12-19 Mould for encapsulating a component having a lead at an angle to the axis of the component Expired GB2010732B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US05/862,556 US4155533A (en) 1977-12-20 1977-12-20 Mold for encapsulating a component having non-axial leads
US05/862,553 US4155532A (en) 1977-12-20 1977-12-20 Mold for encapsulating a component having a lead at an angle to the axis of the component

Publications (2)

Publication Number Publication Date
GB2010732A GB2010732A (en) 1979-07-04
GB2010732B true GB2010732B (en) 1982-05-12

Family

ID=27127708

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7849172A Expired GB2010732B (en) 1977-12-20 1978-12-19 Mould for encapsulating a component having a lead at an angle to the axis of the component

Country Status (4)

Country Link
JP (1) JPS5491751A (enrdf_load_stackoverflow)
DE (1) DE2854631C3 (enrdf_load_stackoverflow)
FR (1) FR2412396B1 (enrdf_load_stackoverflow)
GB (1) GB2010732B (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6228792Y2 (enrdf_load_stackoverflow) * 1980-08-26 1987-07-23
JP7428962B2 (ja) * 2019-10-28 2024-02-07 Tdk株式会社 セラミック電子部品
JP7351177B2 (ja) * 2019-10-28 2023-09-27 Tdk株式会社 セラミック電子部品

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3045290A (en) * 1957-10-11 1962-07-24 Anderson Controls Inc Method of encapsulating coils
US2934792A (en) * 1958-06-16 1960-05-03 Marco Ind Method of fabricating indicator light with molded nylon jacket
FR1272045A (fr) * 1960-07-04 1961-09-22 Dubilier Condenser Co 1925 Ltd Perfectionnements à la fabrication d'éléments électriques gainés
FR1458756A (fr) * 1965-10-19 1966-03-04 Gen Electric Perfectionnements aux machines à mouler
US3768945A (en) * 1967-08-23 1973-10-30 Eaton Corp Injection molding apparatus providing a strippable flash for producing a plurality of flash-free articles
US3542328A (en) * 1969-02-19 1970-11-24 Western Electric Co Mold having v-shaped guides to prevent pinching a lead on a component during an encapsulation process
US3739438A (en) * 1970-02-25 1973-06-19 Union Carbide Corp System for molding electronic components
US3838316A (en) * 1973-10-09 1974-09-24 Western Electric Co Encapsulated electrical component assembly and method of fabrication

Also Published As

Publication number Publication date
FR2412396A1 (fr) 1979-07-20
FR2412396B1 (fr) 1985-08-23
GB2010732A (en) 1979-07-04
DE2854631A1 (de) 1979-06-21
JPS5491751A (en) 1979-07-20
DE2854631B2 (de) 1980-08-14
JPS6145849B2 (enrdf_load_stackoverflow) 1986-10-09
DE2854631C3 (de) 1981-04-09

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19931219