GB201002986D0 - Design and placement of pads for mechanically assembling multiple printed circuit boards together to form one integrated printed circuit board - Google Patents

Design and placement of pads for mechanically assembling multiple printed circuit boards together to form one integrated printed circuit board

Info

Publication number
GB201002986D0
GB201002986D0 GBGB1002986.6A GB201002986A GB201002986D0 GB 201002986 D0 GB201002986 D0 GB 201002986D0 GB 201002986 A GB201002986 A GB 201002986A GB 201002986 D0 GB201002986 D0 GB 201002986D0
Authority
GB
United Kingdom
Prior art keywords
printed circuit
pads
placement
design
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB1002986.6A
Other versions
GB2477993A (en
GB2477993B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB201002986A priority Critical patent/GB2477993B/en
Publication of GB201002986D0 publication Critical patent/GB201002986D0/en
Publication of GB2477993A publication Critical patent/GB2477993A/en
Application granted granted Critical
Publication of GB2477993B publication Critical patent/GB2477993B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
GB201002986A 2010-02-23 2010-02-23 Design and placement of pads for mechanically assembling multiple printed circuit boards together to form one intergraded printed circuit board Expired - Fee Related GB2477993B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB201002986A GB2477993B (en) 2010-02-23 2010-02-23 Design and placement of pads for mechanically assembling multiple printed circuit boards together to form one intergraded printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB201002986A GB2477993B (en) 2010-02-23 2010-02-23 Design and placement of pads for mechanically assembling multiple printed circuit boards together to form one intergraded printed circuit board

Publications (3)

Publication Number Publication Date
GB201002986D0 true GB201002986D0 (en) 2010-04-07
GB2477993A GB2477993A (en) 2011-08-24
GB2477993B GB2477993B (en) 2012-01-18

Family

ID=42114195

Family Applications (1)

Application Number Title Priority Date Filing Date
GB201002986A Expired - Fee Related GB2477993B (en) 2010-02-23 2010-02-23 Design and placement of pads for mechanically assembling multiple printed circuit boards together to form one intergraded printed circuit board

Country Status (1)

Country Link
GB (1) GB2477993B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108811317B (en) * 2018-07-03 2019-04-02 北京华悦龙驰科技有限公司 A kind of via pad structure, a kind of circuit board connection type and a kind of circuit board
CN109115159B (en) * 2018-08-30 2021-02-09 广州广合科技股份有限公司 Method for determining aperture of micro-slice

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1602993A (en) * 1968-12-31 1971-03-01
GB2005084B (en) * 1977-04-07 1982-01-13 Brittain D J Assemblies including printed circuit boards and methods of making such assemblies
US4335272A (en) * 1980-07-28 1982-06-15 Zenith Radio Corporation Breakaway circuit board with flexible coupling
JPH06204637A (en) * 1992-01-21 1994-07-22 Nec Corp Printed wiring board
JPH07142834A (en) * 1993-11-19 1995-06-02 Nippon Telegr & Teleph Corp <Ntt> Electronic device mounting structure
US6594152B2 (en) * 1999-09-30 2003-07-15 Intel Corporation Board-to-board electrical coupling with conductive band
US7005584B2 (en) * 2004-02-13 2006-02-28 Honeywell International Inc. Compact navigation device assembly
US20060172614A1 (en) * 2005-02-03 2006-08-03 Ta Sang H Universal systems printed circuit blocks and method for interconnecting the same
US7618283B1 (en) * 2008-04-23 2009-11-17 Tyco Electronics Corporation Bridge connector for connecting circuit boards

Also Published As

Publication number Publication date
GB2477993A (en) 2011-08-24
GB2477993B (en) 2012-01-18

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20150223