GB1592368A - Automated manipulative operation system - Google Patents

Automated manipulative operation system Download PDF

Info

Publication number
GB1592368A
GB1592368A GB41618/77A GB4161877A GB1592368A GB 1592368 A GB1592368 A GB 1592368A GB 41618/77 A GB41618/77 A GB 41618/77A GB 4161877 A GB4161877 A GB 4161877A GB 1592368 A GB1592368 A GB 1592368A
Authority
GB
United Kingdom
Prior art keywords
signals
workpiece
digital
chip
computer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB41618/77A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of GB1592368A publication Critical patent/GB1592368A/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/408—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by data handling or data format, e.g. reading, buffering or conversion of data
    • G05B19/4083—Adapting programme, configuration
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37572—Camera, tv, vision
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Image Analysis (AREA)
  • Wire Bonding (AREA)
  • Control Of Position Or Direction (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB41618/77A 1976-10-18 1977-10-06 Automated manipulative operation system Expired GB1592368A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US73350176A 1976-10-18 1976-10-18

Publications (1)

Publication Number Publication Date
GB1592368A true GB1592368A (en) 1981-07-08

Family

ID=24947871

Family Applications (1)

Application Number Title Priority Date Filing Date
GB41618/77A Expired GB1592368A (en) 1976-10-18 1977-10-06 Automated manipulative operation system

Country Status (4)

Country Link
JP (1) JPS5350673A (US06174465-20010116-C00003.png)
DE (1) DE2746814A1 (US06174465-20010116-C00003.png)
FR (1) FR2368073A1 (US06174465-20010116-C00003.png)
GB (1) GB1592368A (US06174465-20010116-C00003.png)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4266710A (en) * 1978-11-22 1981-05-12 Kulicke And Soffa Industries Inc. Wire bonding apparatus
US4632291A (en) * 1983-02-28 1986-12-30 Electrovert Ltd. Automatic wave soldering machine
GB2151350A (en) * 1983-11-25 1985-07-17 Vs Eng Ltd Sensing arrangement
CN115437327B (zh) * 2022-09-15 2024-10-11 中国核动力研究设计院 一种智能化核安全级dcs设计与验证方法、系统及存储介质

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3633011A (en) * 1968-08-29 1972-01-04 Ibm Method and apparatus for precisely contouring a workpiece imprecisely positioned on a supporting fixture
US3641660A (en) * 1969-06-30 1972-02-15 Texas Instruments Inc The method of ball bonding with an automatic semiconductor bonding machine
US3746447A (en) * 1971-07-07 1973-07-17 California Computer Products Marker enlarger
US3773240A (en) * 1972-03-06 1973-11-20 Texas Instruments Inc Automatic bonding machine
US4017721A (en) * 1974-05-16 1977-04-12 The Bendix Corporation Method and apparatus for determining the position of a body
US3986007A (en) * 1975-08-20 1976-10-12 The Bendix Corporation Method and apparatus for calibrating mechanical-visual part manipulating system

Also Published As

Publication number Publication date
DE2746814C2 (US06174465-20010116-C00003.png) 1987-08-20
FR2368073A1 (fr) 1978-05-12
DE2746814A1 (de) 1978-04-20
FR2368073B1 (US06174465-20010116-C00003.png) 1983-10-28
JPS6240852B2 (US06174465-20010116-C00003.png) 1987-08-31
JPS5350673A (en) 1978-05-09

Similar Documents

Publication Publication Date Title
US6449516B1 (en) Bonding method and apparatus
US6208419B1 (en) Method of and apparatus for bonding light-emitting element
US6389688B1 (en) Method and apparatus for chip placement
US4965665A (en) 3D imaging of a substrate using perpendicular scanning directions
KR20010033900A (ko) 스테레오 비젼 라인스캔 센서를 갖는 전자 조립 장치
KR20030065414A (ko) 기판상에 반도체 다이의 기준촛점을 위치시키고배치시키는 방법
US6031242A (en) Semiconductor die in-flight registration and orientation method and apparatus
GB2056766A (en) Systems for bonding pellets, for example semiconductor chips, to supports
JPH0737923A (ja) ワイヤボンディング装置及びその方法
GB1592368A (en) Automated manipulative operation system
JPH0737925A (ja) ワイヤボンディング装置及びその方法
US6266891B1 (en) Method of and apparatus for bonding component
TW202232051A (zh) 疊合焊線之迴路高度測量
JP2534912B2 (ja) ワイヤボンディング装置
JP2018152375A (ja) ダイボンディング装置および半導体装置の製造方法
JP2533375B2 (ja) テ―プボンディングにおけるリ―ドとバンプの位置検出方法
JP3008745B2 (ja) ワイヤボンディング検査方法及びワイヤボンディング検査装置
JPH0732188B2 (ja) 半導体装置の検査装置
JPS61148828A (ja) ワイヤボンデイングの検査方法
JP3084744B2 (ja) 半田付状態の外観検査方法
JP2648974B2 (ja) ワイヤリング検査可能なワイヤボンディング装置及びその方法並びにワイヤリング自動検査装置
JP3006437B2 (ja) 電子部品観察装置及び電子部品観察方法
US20020102016A1 (en) Image processing method and device
JPS5867033A (ja) ワイヤボンデイング方法
KR100400699B1 (ko) 와이어 본딩 방법 및 장치

Legal Events

Date Code Title Description
PS Patent sealed
PE20 Patent expired after termination of 20 years

Effective date: 19971005