GB1588758A - Method and apparatus for control of electroless plating solutions - Google Patents

Method and apparatus for control of electroless plating solutions Download PDF

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Publication number
GB1588758A
GB1588758A GB48323/77A GB4832377A GB1588758A GB 1588758 A GB1588758 A GB 1588758A GB 48323/77 A GB48323/77 A GB 48323/77A GB 4832377 A GB4832377 A GB 4832377A GB 1588758 A GB1588758 A GB 1588758A
Authority
GB
United Kingdom
Prior art keywords
bath
mixed potential
solution
plating
potential
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB48323/77A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of GB1588758A publication Critical patent/GB1588758A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
GB48323/77A 1976-11-22 1977-11-21 Method and apparatus for control of electroless plating solutions Expired GB1588758A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US74411076A 1976-11-22 1976-11-22

Publications (1)

Publication Number Publication Date
GB1588758A true GB1588758A (en) 1981-04-29

Family

ID=24991471

Family Applications (1)

Application Number Title Priority Date Filing Date
GB48323/77A Expired GB1588758A (en) 1976-11-22 1977-11-21 Method and apparatus for control of electroless plating solutions

Country Status (14)

Country Link
JP (1) JPS5365226A (es)
AT (1) AT354213B (es)
AU (1) AU512805B2 (es)
CA (1) CA1112523A (es)
CH (1) CH637995A5 (es)
DE (2) DE2759952C2 (es)
ES (1) ES464266A1 (es)
FR (1) FR2371522A1 (es)
GB (1) GB1588758A (es)
IL (1) IL53298A (es)
IT (1) IT1116376B (es)
NL (1) NL7712683A (es)
SE (1) SE442410B (es)
ZA (1) ZA775495B (es)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4707377A (en) * 1983-10-31 1987-11-17 International Business Machines Corporation Copper plating
GB2198750A (en) * 1986-10-31 1988-06-22 Kollmorgen Corp Controlling electroless deposition
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
GB2218714A (en) * 1988-04-29 1989-11-22 Kollmorgen Corp Electroless plating.
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
DE3938653A1 (de) * 1988-11-22 1990-05-23 American Chem & Refining Co Bad fuer die stromlose goldplattierung und verfahren zur verwendung desselben

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953348B2 (ja) * 1977-12-16 1984-12-24 株式会社日立製作所 化学銅めつき液の主成分自動管理方法並びにその装置
US4276323A (en) * 1979-12-21 1981-06-30 Hitachi, Ltd. Process for controlling of chemical copper plating solution
JPS6096767A (ja) * 1983-10-31 1985-05-30 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 銅めつき方法
JPS61110799A (ja) * 1984-10-30 1986-05-29 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン 金属めつき槽の制御装置
US4623554A (en) * 1985-03-08 1986-11-18 International Business Machines Corp. Method for controlling plating rate in an electroless plating system
JPS63149278U (es) * 1987-03-19 1988-09-30
DE3718584A1 (de) * 1987-06-03 1988-12-15 Norddeutsche Affinerie Verfahren zur messung der wirksamen inhibitorkonzentration waehrend der metallabscheidung aus waessrigen elektrolyten
US4842886A (en) * 1987-11-04 1989-06-27 International Business Machines Corporation Method for electroless plating
JP2005206931A (ja) 2003-12-26 2005-08-04 Sumitomo Electric Ind Ltd 金属粉末の製造方法
JP5116068B2 (ja) * 2004-09-07 2013-01-09 Ｊｘ日鉱日石金属株式会社 無電解金めっき液の安定化方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3375178A (en) * 1964-05-28 1968-03-26 Continental Oil Co Method of confirming the occurrence of plating in electroless nickel-plating
FR1522048A (fr) * 1966-05-06 1968-04-19 Photocircuits Corp Dépôt non galvanique de métaux
JPS5921386B2 (ja) * 1976-04-13 1984-05-19 株式会社東芝 無電解メツキのメツキ速度自動制御方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4707377A (en) * 1983-10-31 1987-11-17 International Business Machines Corporation Copper plating
GB2198750A (en) * 1986-10-31 1988-06-22 Kollmorgen Corp Controlling electroless deposition
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
GB2198750B (en) * 1986-10-31 1991-01-02 Kollmorgen Corp Method for electrolessly depositing high quality copper
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
GB2218714A (en) * 1988-04-29 1989-11-22 Kollmorgen Corp Electroless plating.
GB2218714B (en) * 1988-04-29 1992-10-14 Kollmorgen Corp Method of formulating and operating an electroless plating bath solution for forming cu-deposits which are essentially free of fissures
DE3938653A1 (de) * 1988-11-22 1990-05-23 American Chem & Refining Co Bad fuer die stromlose goldplattierung und verfahren zur verwendung desselben

Also Published As

Publication number Publication date
DE2751104A1 (de) 1978-05-24
FR2371522A1 (fr) 1978-06-16
IL53298A (en) 1981-02-27
FR2371522B1 (es) 1980-02-15
ES464266A1 (es) 1978-08-01
NL7712683A (nl) 1978-05-24
AT354213B (de) 1979-12-27
IT1116376B (it) 1986-02-10
CA1112523A (en) 1981-11-17
JPS5365226A (en) 1978-06-10
SE7713192L (sv) 1978-05-23
IL53298A0 (en) 1978-01-31
ATA827777A (de) 1979-05-15
DE2759952C2 (de) 1984-03-08
CH637995A5 (en) 1983-08-31
JPS5753857B2 (es) 1982-11-15
ZA775495B (en) 1978-07-26
SE442410B (sv) 1985-12-23
AU3076077A (en) 1979-05-24
AU512805B2 (en) 1980-10-30

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee

Free format text: IN PAT.BUL.5184,PAGE 1980 FOR 1588750 READ 1588758