GB1517039A - Assembling circuit components on a circuit board using projected light - Google Patents
Assembling circuit components on a circuit board using projected lightInfo
- Publication number
- GB1517039A GB1517039A GB5133075A GB5133075A GB1517039A GB 1517039 A GB1517039 A GB 1517039A GB 5133075 A GB5133075 A GB 5133075A GB 5133075 A GB5133075 A GB 5133075A GB 1517039 A GB1517039 A GB 1517039A
- Authority
- GB
- United Kingdom
- Prior art keywords
- board
- components
- image carrier
- projector
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0053—Arrangements for assisting the manual mounting of components, e.g. special tables or light spots indicating the place for mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09936—Marks, inscriptions, etc. for information
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Projection Apparatus (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Laminated Bodies (AREA)
- Apparatus For Radiation Diagnosis (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
1517039 Optical projectors A LEMMER [trading as ALFRED LEMMER WERKZEUGUND MASCHINENBAU] 15 Dec 1975 [16 Dec 1974] 51330/75 Heading G2J In the assembly of components on a circuit board, an opaque image carrier with a layer perforated in a given manner is positioned in fixed relation to a board, light is projected on to the board through the image carrier to illuminate parts of the board to locate components on the board. As shown in Fig. 1 a board 2, e.g. a printed circuit board, is mounted over a recess 3 in a table top 1. A projector 5 and a mirror 8 project on to board 2 an image whereby components kept in recess 4 are assembled on the board. Connecting wires may be cut by a cutter in recess 3. The image carrier to be mounted in the projector is manufactured as described in Specification 20315/77 and consists of a film 11 with an integral frame 10 of copper or other metal, or plastics material, having perforations 12 providing images on the board to guide the assembly of components thereon. The image carrier has recesses at the edge which co-operate with pins 15 in the projector for accurate location, and the film may be covered on both sides by a transparent layer, or the perforations may be filled with transparent plastics material. In modification, Figs. 4, 5 (not shown), the frame (20) is stamped out of the film plane and flanged at the edges.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19742459480 DE2459480C3 (en) | 1974-12-16 | Image carrier for an assembly image that can be projected onto a printed circuit board to be assembled |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1517039A true GB1517039A (en) | 1978-07-05 |
Family
ID=5933564
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB5133075A Expired GB1517039A (en) | 1974-12-16 | 1975-12-15 | Assembling circuit components on a circuit board using projected light |
GB2031577A Expired GB1517040A (en) | 1974-12-16 | 1975-12-15 | Perforation of opaque lamina to produce image carriers for use in assembling circuit components on a circuit board |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2031577A Expired GB1517040A (en) | 1974-12-16 | 1975-12-15 | Perforation of opaque lamina to produce image carriers for use in assembling circuit components on a circuit board |
Country Status (4)
Country | Link |
---|---|
CH (1) | CH607553A5 (en) |
FR (1) | FR2295675A1 (en) |
GB (2) | GB1517039A (en) |
IT (1) | IT1059864B (en) |
-
1975
- 1975-11-26 CH CH1533275A patent/CH607553A5/xx not_active IP Right Cessation
- 1975-12-15 GB GB5133075A patent/GB1517039A/en not_active Expired
- 1975-12-15 GB GB2031577A patent/GB1517040A/en not_active Expired
- 1975-12-15 IT IT7008175A patent/IT1059864B/en active
- 1975-12-15 FR FR7538298A patent/FR2295675A1/en active Granted
Also Published As
Publication number | Publication date |
---|---|
GB1517040A (en) | 1978-07-05 |
FR2295675B1 (en) | 1980-03-28 |
DE2459480B2 (en) | 1976-10-07 |
DE2459480A1 (en) | 1976-07-01 |
CH607553A5 (en) | 1978-12-29 |
FR2295675A1 (en) | 1976-07-16 |
IT1059864B (en) | 1982-06-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |