GB1463499A - Method and apparatus for mounting an electrical component on a circuit board - Google Patents
Method and apparatus for mounting an electrical component on a circuit boardInfo
- Publication number
- GB1463499A GB1463499A GB2326773A GB2326773A GB1463499A GB 1463499 A GB1463499 A GB 1463499A GB 2326773 A GB2326773 A GB 2326773A GB 2326773 A GB2326773 A GB 2326773A GB 1463499 A GB1463499 A GB 1463499A
- Authority
- GB
- United Kingdom
- Prior art keywords
- leads
- component
- mounting
- circuit board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0421—Feeding with belts or tapes with treatment of the terminal leads
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
1463499 Mounting components on circuit boards LUCAS ELECTRICAL Ltd 3 May 1974 [16 May 1973] 23267/73 Heading B3A A method of mounting an electrical component 12 on a circuit board comprises feeding the component which has leads 11 to a mounting station 13, clamping a portion of each lead 11 at the station, bending a portion of each lead, which portion is located on the opposite side of the clamped portions from the component, unclamping the leads, and effecting relative movement between the component and the circuit board so that the leads engage the board. Each of the leads is cut to length at a location spaced from each clamped portion. Apparatus for performing the method comprises a yoke 15 and a pair of movable, spaced anvils 14 for clamping the leads which are attached to bands 10 on the apparatus. Cutters 18 co-operate with shear blades 19 to cut the leads upon descent of the assembly of formers 16, drivers 17 and cutters 18. The formers 16 contact the cropped leads and bend them to the required shape while the drivers 17 urge the component 12 and leads 11 downwardly into engagement with the circuit board which is held on a movable platform. The assembly is then raised to permit the bands 10 to feed another component to the mounting station under the yoke 15. The leads are soldered in position in holes in the board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2326773A GB1463499A (en) | 1973-05-16 | 1973-05-16 | Method and apparatus for mounting an electrical component on a circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2326773A GB1463499A (en) | 1973-05-16 | 1973-05-16 | Method and apparatus for mounting an electrical component on a circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1463499A true GB1463499A (en) | 1977-02-02 |
Family
ID=10192905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2326773A Expired GB1463499A (en) | 1973-05-16 | 1973-05-16 | Method and apparatus for mounting an electrical component on a circuit board |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1463499A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112804831A (en) * | 2020-12-21 | 2021-05-14 | 兰州空间技术物理研究所 | Device for forming lead of axial device |
-
1973
- 1973-05-16 GB GB2326773A patent/GB1463499A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112804831A (en) * | 2020-12-21 | 2021-05-14 | 兰州空间技术物理研究所 | Device for forming lead of axial device |
CN112804831B (en) * | 2020-12-21 | 2023-03-10 | 兰州空间技术物理研究所 | Device for forming lead of axial device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |