GB1461464A - Apparatus for holding a substrate during ion-beam etching of a thin film on the substrate - Google Patents

Apparatus for holding a substrate during ion-beam etching of a thin film on the substrate

Info

Publication number
GB1461464A
GB1461464A GB1143674A GB1143674A GB1461464A GB 1461464 A GB1461464 A GB 1461464A GB 1143674 A GB1143674 A GB 1143674A GB 1143674 A GB1143674 A GB 1143674A GB 1461464 A GB1461464 A GB 1461464A
Authority
GB
United Kingdom
Prior art keywords
turntable
disc
substrate
friction disc
lead screw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1143674A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1461464A publication Critical patent/GB1461464A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • ing And Chemical Polishing (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
  • Drying Of Semiconductors (AREA)
GB1143674A 1973-03-16 1974-03-14 Apparatus for holding a substrate during ion-beam etching of a thin film on the substrate Expired GB1461464A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2313096A DE2313096A1 (de) 1973-03-16 1973-03-16 Probenhalterung fuer das aetzen von duennen schichten

Publications (1)

Publication Number Publication Date
GB1461464A true GB1461464A (en) 1977-01-13

Family

ID=5874944

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1143674A Expired GB1461464A (en) 1973-03-16 1974-03-14 Apparatus for holding a substrate during ion-beam etching of a thin film on the substrate

Country Status (4)

Country Link
JP (1) JPS5536070B2 (enExample)
DE (1) DE2313096A1 (enExample)
FR (1) FR2221815B1 (enExample)
GB (1) GB1461464A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4511194A (en) * 1982-03-26 1985-04-16 U.S. Philips Corporation Magazine and disc holders for supporting discs in the magazine

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2316723A1 (fr) * 1975-07-03 1977-01-28 Zaitseva Aita Dispositif d'amenee de pieces en vue de leur traitement par un faisceau d'ions
JPS61134378U (enExample) * 1985-02-13 1986-08-21
FR2701463B1 (fr) * 1993-02-15 1995-05-05 Alain Gentric Dispositif de sélection pour amener un objet, par exemple un substrat, à une station de traitement.
DE102005021831A1 (de) * 2005-05-11 2006-11-23 Mühlbauer Ag Vorrichtung zum Transportieren von Plättchen
AT510606B1 (de) 2011-02-09 2012-05-15 Leica Mikrosysteme Gmbh Vorrichtung und verfahren zur probenpräparation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4511194A (en) * 1982-03-26 1985-04-16 U.S. Philips Corporation Magazine and disc holders for supporting discs in the magazine

Also Published As

Publication number Publication date
FR2221815B1 (enExample) 1978-06-09
FR2221815A1 (enExample) 1974-10-11
JPS5536070B2 (enExample) 1980-09-18
JPS49127298A (enExample) 1974-12-05
DE2313096A1 (de) 1974-09-26

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee