GB1461446A - Method for the partial electroplating of a non-conducting or semiconducting material - Google Patents

Method for the partial electroplating of a non-conducting or semiconducting material

Info

Publication number
GB1461446A
GB1461446A GB983574A GB983574A GB1461446A GB 1461446 A GB1461446 A GB 1461446A GB 983574 A GB983574 A GB 983574A GB 983574 A GB983574 A GB 983574A GB 1461446 A GB1461446 A GB 1461446A
Authority
GB
United Kingdom
Prior art keywords
conducting
layer
electro
laquer
areas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB983574A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19732311660 external-priority patent/DE2311660C3/en
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Publication of GB1461446A publication Critical patent/GB1461446A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

1461446 Selective electro-plating of non- conductive surfaces LICENTIA PATENTVERWALTUNGS GmbH 5 March 1974 [9 March 1973] 9835/74 Heading C7B Metal is electro-deposited on selected areas of a non-conducting or semi-conducting material, e.g. of silicon, by forming a nickel layer without current over an entire surface of the material; forming a laquer layer on those areas which are not to be electro-plated; electrolytically depositing metal, e.g. Au, Cr, Rh, Ru, Pa, Ir, Ag, Pb, In or Sn or an alloy thereof e.g. Pb-Su alloy, on the areas not covered by the laquer layer and finally removing the laquer layer and the nickel layer therebeneath.
GB983574A 1973-03-09 1974-03-05 Method for the partial electroplating of a non-conducting or semiconducting material Expired GB1461446A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732311660 DE2311660C3 (en) 1973-03-09 Process for the partial electroplating of a semiconductor body made of silicon

Publications (1)

Publication Number Publication Date
GB1461446A true GB1461446A (en) 1977-01-13

Family

ID=5874223

Family Applications (1)

Application Number Title Priority Date Filing Date
GB983574A Expired GB1461446A (en) 1973-03-09 1974-03-05 Method for the partial electroplating of a non-conducting or semiconducting material

Country Status (3)

Country Link
JP (1) JPS49121748A (en)
FR (1) FR2220601A1 (en)
GB (1) GB1461446A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2724818A1 (en) * 2012-10-26 2014-04-30 Leo Shih Method of forming tool marking structure

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5243506A (en) * 1975-10-01 1977-04-05 Kawaguchiko Seimitsu Kk Method of marking metal surface and so on

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2724818A1 (en) * 2012-10-26 2014-04-30 Leo Shih Method of forming tool marking structure

Also Published As

Publication number Publication date
FR2220601A1 (en) 1974-10-04
DE2311660B2 (en) 1975-06-26
DE2311660A1 (en) 1974-09-26
JPS49121748A (en) 1974-11-21

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee