GB1461031A - Thick film circuits - Google Patents
Thick film circuitsInfo
- Publication number
- GB1461031A GB1461031A GB59975A GB59975A GB1461031A GB 1461031 A GB1461031 A GB 1461031A GB 59975 A GB59975 A GB 59975A GB 59975 A GB59975 A GB 59975A GB 1461031 A GB1461031 A GB 1461031A
- Authority
- GB
- United Kingdom
- Prior art keywords
- oxy
- thick film
- depositing
- acetylene
- high temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
1461031 Printed circuits STANDARD TELEPHONES & CABLES Ltd 7 Jan 1975 599/75 Heading H1D A thick film printed circuit is fabricated by depositing a layer of ceramic material containing, e.g. a large proportion of alumina on a finned aluminium heat sink depositing a circuit pattern thereon in metallic ink, and firing to fuse the metal into the ceramic layer which may be ground flat before deposition. The ceramic layer may be deposited at high temperature, e.g. by detonation of an ignited oxy-acetylene atmosphere, by a high velocity inert gas stream from a plasma torch, or by an oxy-acetylene or oxy-hydrogen torch; pulverulent ceramic material being introduced into the high temperature atmosphere.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB59975A GB1461031A (en) | 1975-01-07 | 1975-01-07 | Thick film circuits |
AU87501/75A AU501221B2 (en) | 1975-01-07 | 1975-12-12 | Producing thick film circuits ona ceramic substrate |
ES444106A ES444106A1 (en) | 1975-01-07 | 1976-01-07 | Thick film circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB59975A GB1461031A (en) | 1975-01-07 | 1975-01-07 | Thick film circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1461031A true GB1461031A (en) | 1977-01-13 |
Family
ID=9707218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB59975A Expired GB1461031A (en) | 1975-01-07 | 1975-01-07 | Thick film circuits |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU501221B2 (en) |
ES (1) | ES444106A1 (en) |
GB (1) | GB1461031A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1199915A2 (en) * | 2000-10-21 | 2002-04-24 | Hella KG Hueck & Co. | Circuit structures on thermally sprayed layers |
US8134083B2 (en) | 2006-06-07 | 2012-03-13 | Ab Mikroelektronik Gesselschaft Mit Beschrankter Haftung | Circuit carrier |
-
1975
- 1975-01-07 GB GB59975A patent/GB1461031A/en not_active Expired
- 1975-12-12 AU AU87501/75A patent/AU501221B2/en not_active Expired
-
1976
- 1976-01-07 ES ES444106A patent/ES444106A1/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1199915A2 (en) * | 2000-10-21 | 2002-04-24 | Hella KG Hueck & Co. | Circuit structures on thermally sprayed layers |
EP1199915A3 (en) * | 2000-10-21 | 2004-04-07 | Hella KG Hueck & Co. | Circuit structures on thermally sprayed layers |
US8134083B2 (en) | 2006-06-07 | 2012-03-13 | Ab Mikroelektronik Gesselschaft Mit Beschrankter Haftung | Circuit carrier |
Also Published As
Publication number | Publication date |
---|---|
AU8750175A (en) | 1977-06-16 |
ES444106A1 (en) | 1977-04-16 |
AU501221B2 (en) | 1979-06-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |