GB1458859A - Cooling of elecgronic devices - Google Patents

Cooling of elecgronic devices

Info

Publication number
GB1458859A
GB1458859A GB708174A GB708174A GB1458859A GB 1458859 A GB1458859 A GB 1458859A GB 708174 A GB708174 A GB 708174A GB 708174 A GB708174 A GB 708174A GB 1458859 A GB1458859 A GB 1458859A
Authority
GB
United Kingdom
Prior art keywords
heat sinks
thyristors
assembly
feb
juxtaposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB708174A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19732307527 external-priority patent/DE2307527C3/de
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of GB1458859A publication Critical patent/GB1458859A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Rectifiers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB708174A 1973-02-15 1974-02-15 Cooling of elecgronic devices Expired GB1458859A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732307527 DE2307527C3 (de) 1973-02-15 Luftgekühlter Stromrichtersatz

Publications (1)

Publication Number Publication Date
GB1458859A true GB1458859A (en) 1976-12-15

Family

ID=5872030

Family Applications (1)

Application Number Title Priority Date Filing Date
GB708174A Expired GB1458859A (en) 1973-02-15 1974-02-15 Cooling of elecgronic devices

Country Status (11)

Country Link
US (1) US3947868A (forum.php)
JP (1) JPS5314287B2 (forum.php)
AT (1) AT323288B (forum.php)
BE (1) BE810962A (forum.php)
CA (1) CA1006221A (forum.php)
CH (1) CH567829A5 (forum.php)
CS (1) CS172879B2 (forum.php)
FR (1) FR2217802B1 (forum.php)
GB (1) GB1458859A (forum.php)
NL (1) NL7400788A (forum.php)
SE (1) SE389580B (forum.php)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3609065A1 (de) * 1986-03-18 1987-09-24 Siemens Ag Niederinduktive verschienung
JPS63159894U (forum.php) * 1987-04-08 1988-10-19
US6942025B2 (en) * 2000-09-20 2005-09-13 Degree Controls, Inc. Uniform heat dissipating and cooling heat sink
US20030183368A1 (en) * 2002-04-02 2003-10-02 Paradis Leo Richard Diamond heat sink

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3428845A (en) * 1966-11-21 1969-02-18 Rca Corp Light-emitting semiconductor having relatively heavy outer layers for heat-sinking
US3541433A (en) * 1968-11-12 1970-11-17 Ariel R Davis Current supply apparatuses with an inductive winding and heat sink for solid state devices
US3652903A (en) * 1971-02-01 1972-03-28 Gen Electric Fluid cooled pressure assembly
US3771031A (en) * 1973-03-05 1973-11-06 Texas Instruments Inc Header assembly for lasers

Also Published As

Publication number Publication date
FR2217802B1 (forum.php) 1978-01-06
BE810962A (fr) 1974-05-29
DE2307527B2 (de) 1975-05-22
CH567829A5 (forum.php) 1975-10-15
DE2307527A1 (de) 1974-08-29
AT323288B (de) 1975-07-10
US3947868A (en) 1976-03-30
SE389580B (sv) 1976-11-08
CS172879B2 (forum.php) 1977-01-28
FR2217802A1 (forum.php) 1974-09-06
JPS5314287B2 (forum.php) 1978-05-16
CA1006221A (en) 1977-03-01
JPS49113130A (forum.php) 1974-10-29
NL7400788A (forum.php) 1974-08-19

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee