GB1421855A - Method and apparatus for packaging electronic components with thermosetting material - Google Patents

Method and apparatus for packaging electronic components with thermosetting material

Info

Publication number
GB1421855A
GB1421855A GB343473A GB343473A GB1421855A GB 1421855 A GB1421855 A GB 1421855A GB 343473 A GB343473 A GB 343473A GB 343473 A GB343473 A GB 343473A GB 1421855 A GB1421855 A GB 1421855A
Authority
GB
United Kingdom
Prior art keywords
mould
lower mould
flange portion
upper mould
recesses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB343473A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toko Inc
Original Assignee
Toko Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toko Inc filed Critical Toko Inc
Priority to GB343473A priority Critical patent/GB1421855A/en
Publication of GB1421855A publication Critical patent/GB1421855A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0038—Moulds or cores; Details thereof or accessories therefor with sealing means or the like
    • B29C33/0044—Moulds or cores; Details thereof or accessories therefor with sealing means or the like for sealing off parts of inserts projecting into the mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/74—Moulding material on a relatively small portion of the preformed part, e.g. outsert moulding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

1421855 Injection moulding TOKO Inc 23 Jan 1973 3434/73 Heading B5A In a method of packaging an electronic component, e.g. a pulse transformer element 1, the component is inserted into a lower mould 6 with its terminal pins 5 inserted in elongated slots 6g, a heated upper mould 7 engaged with the lower mould and thermosetting material injected into the upper mould cavity 7a, whereby the terminal pins 5 are kept free of moulding material. The electronic component 1 includes a thermosetting base member having a flange portion 4b which rests on stepped portions 6f in the lower mould. The top of the flange portion 4b is raised slightly above the level of the lower mould, so that when the heated upper mould descends it softens the flange portion 4b and produces a sealing effect. As shown in Fig. 4 the lower mould 6 comprises a main body 6a and a side plate 6b, the main body including a plurality of cavities 6e. The parts 6a, 6b are held together by screws 6c but biased apart by springs (6d) Fig. 2B (not shown). Two moulds 6 are mounted in recesses 8a in a member 8 together with push members 8c. Obliquely extending projections 8f on the members 8c engage with oblique guide grooves 8e in the sides of the recesses 8a. As a result, when the upper mould is brought down the push members move laterally as well as downwardly and move the side plates 6b into tight contact with the main bodies 6a. A preheated quantity of moulding material, e.g. a phenolic or epoxy resin is inserted into an inlet port (7b) Fig. 3 (not shown), compressed against a circular recess 8d<SP>1</SP> by means of a plunger (not shown) and melted so as to be injected into the mould cavities through runners (7c), 8d and gates (7d).
GB343473A 1973-01-23 1973-01-23 Method and apparatus for packaging electronic components with thermosetting material Expired GB1421855A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB343473A GB1421855A (en) 1973-01-23 1973-01-23 Method and apparatus for packaging electronic components with thermosetting material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB343473A GB1421855A (en) 1973-01-23 1973-01-23 Method and apparatus for packaging electronic components with thermosetting material

Publications (1)

Publication Number Publication Date
GB1421855A true GB1421855A (en) 1976-01-21

Family

ID=9758271

Family Applications (1)

Application Number Title Priority Date Filing Date
GB343473A Expired GB1421855A (en) 1973-01-23 1973-01-23 Method and apparatus for packaging electronic components with thermosetting material

Country Status (1)

Country Link
GB (1) GB1421855A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2183199A (en) * 1985-10-23 1987-06-03 Alps Electric Co Ltd Magnetic head encapsulating processes
EP0285718A2 (en) * 1987-04-10 1988-10-12 Citizen Watch Co. Ltd. Method of forming protective cover of pin grid array
GB2203378A (en) * 1987-04-07 1988-10-19 United Carr Ltd Trw Insert moulding around a mechanical connector component
CN112157901A (en) * 2020-09-07 2021-01-01 上海磐云科技有限公司 Gasbag pressurize tectorial membrane device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2183199A (en) * 1985-10-23 1987-06-03 Alps Electric Co Ltd Magnetic head encapsulating processes
GB2183199B (en) * 1985-10-23 1989-11-15 Alps Electric Co Ltd Processes for fabricating magnetic heads
GB2203378A (en) * 1987-04-07 1988-10-19 United Carr Ltd Trw Insert moulding around a mechanical connector component
GB2203378B (en) * 1987-04-07 1990-11-28 United Carr Ltd Trw Connectors
EP0285718A2 (en) * 1987-04-10 1988-10-12 Citizen Watch Co. Ltd. Method of forming protective cover of pin grid array
EP0285718A3 (en) * 1987-04-10 1989-02-01 Citizen Watch Co. Ltd. Method of forming protective cover of pin grid array
CN112157901A (en) * 2020-09-07 2021-01-01 上海磐云科技有限公司 Gasbag pressurize tectorial membrane device

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee