GB1419200A - Ceramic-metal structures - Google Patents

Ceramic-metal structures

Info

Publication number
GB1419200A
GB1419200A GB5395973A GB5395973A GB1419200A GB 1419200 A GB1419200 A GB 1419200A GB 5395973 A GB5395973 A GB 5395973A GB 5395973 A GB5395973 A GB 5395973A GB 1419200 A GB1419200 A GB 1419200A
Authority
GB
United Kingdom
Prior art keywords
dried
carrier strip
firing
printed
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5395973A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metalized Ceramics Corp
Original Assignee
Metalized Ceramics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metalized Ceramics Corp filed Critical Metalized Ceramics Corp
Publication of GB1419200A publication Critical patent/GB1419200A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/4505—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S264/00—Plastic and nonmetallic article shaping or treating: processes
    • Y10S264/36—Processes of making metal-ceramics

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ceramic Products (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
GB5395973A 1973-01-02 1973-11-21 Ceramic-metal structures Expired GB1419200A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US320621A US3870776A (en) 1973-01-02 1973-01-02 Method for making ceramic-metal structures

Publications (1)

Publication Number Publication Date
GB1419200A true GB1419200A (en) 1975-12-24

Family

ID=23247218

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5395973A Expired GB1419200A (en) 1973-01-02 1973-11-21 Ceramic-metal structures

Country Status (4)

Country Link
US (1) US3870776A (cg-RX-API-DMAC7.html)
JP (1) JPS5230164B2 (cg-RX-API-DMAC7.html)
DE (1) DE2357625C3 (cg-RX-API-DMAC7.html)
GB (1) GB1419200A (cg-RX-API-DMAC7.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986006925A1 (en) * 1985-05-10 1986-11-20 Boorman, Paul, Anthony Printed circuit boards and transfers therefor
GB2246020A (en) * 1990-04-19 1992-01-15 Murata Manufacturing Co Manufacturing ceramic green sheet
GB2246476A (en) * 1990-04-17 1992-01-29 Nippon Cmk Kk Forming carbon resistance on P.C.B.
GB2318532A (en) * 1996-10-22 1998-04-29 Strix Ltd Electric heaters

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS611088A (ja) * 1984-06-14 1986-01-07 松下電器産業株式会社 導電回路の形成法
US4900698A (en) * 1987-05-26 1990-02-13 W. R. Grace & Co.-Conn. Ceramic product and process
DE3810820A1 (de) * 1988-03-30 1989-10-12 Hoechst Ceram Tec Ag Verfahren zur herstellung von gleitkoerpern mit hohlkammern
DE69009692T2 (de) * 1989-06-16 1994-09-22 Nitto Denko Corp Verfahren zur herstellung von gebrannten mustern.
EP0464224B1 (en) * 1990-01-25 2000-10-11 Dai Nippon Insatsu Kabushiki Kaisha Method of and material for forming thick filmy pattern
EP0566043B1 (en) * 1992-04-14 1999-08-11 Hitachi Chemical Co., Ltd. Method of producing boards for printed wiring
US5480503A (en) * 1993-12-30 1996-01-02 International Business Machines Corporation Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof
US6114048A (en) * 1998-09-04 2000-09-05 Brush Wellman, Inc. Functionally graded metal substrates and process for making same
US6205649B1 (en) 1999-06-01 2001-03-27 Mark A. Clayton Method of making a ceramic heater with platinum heating element
AU2003275328A1 (en) * 2002-10-01 2004-04-23 Eveready Battery Company, Inc. Zirconia based blades and foils for razors and a method for producing same
US7357052B2 (en) * 2002-10-01 2008-04-15 Eveready Battery Company, Inc. Zirconia based blades and foils for razors and a method for producing same
CN101353259B (zh) * 2007-07-27 2012-08-22 日本碍子株式会社 陶瓷成型体、陶瓷部件、陶瓷成型体的制法及陶瓷部件的制法
TWI347807B (en) * 2008-05-13 2011-08-21 Unimicron Technology Corp Electrically interconnect structure and process thereof and circuit board structure
US20130099956A1 (en) * 2011-10-24 2013-04-25 Lsi Corporation Apparatus to reduce specific absorption rate

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3247573A (en) * 1962-06-11 1966-04-26 Rca Corp Method of making magnetic ferrite sheet with embedded conductors
US3324014A (en) * 1962-12-03 1967-06-06 United Carr Inc Method for making flush metallic patterns
US3322871A (en) * 1963-08-29 1967-05-30 Rca Corp Method of forming a pattern
US3706582A (en) * 1968-09-20 1972-12-19 Gte Sylvania Inc Glass frit-ceramic powder composition
US3695960A (en) * 1970-04-08 1972-10-03 Rca Corp Fabricating relatively thick ceramic articles
US3798762A (en) * 1972-08-14 1974-03-26 Us Army Circuit board processing

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986006925A1 (en) * 1985-05-10 1986-11-20 Boorman, Paul, Anthony Printed circuit boards and transfers therefor
GB2246476A (en) * 1990-04-17 1992-01-29 Nippon Cmk Kk Forming carbon resistance on P.C.B.
GB2246476B (en) * 1990-04-17 1993-11-17 Nippon Cmk Kk A method of forming a carbon resistance on a printed wiring board
GB2246020A (en) * 1990-04-19 1992-01-15 Murata Manufacturing Co Manufacturing ceramic green sheet
US5316602A (en) * 1990-04-19 1994-05-31 Murata Manufacturing Co., Ltd. Method for manufacturing ceramic green sheet laminate for an electronic component
GB2246020B (en) * 1990-04-19 1994-12-14 Murata Manufacturing Co Method of and apparatus for manufacturing ceramic green sheet for laminated ceramic electronic component
GB2318532A (en) * 1996-10-22 1998-04-29 Strix Ltd Electric heaters
GB2318532B (en) * 1996-10-22 2000-11-15 Strix Ltd Electric heaters

Also Published As

Publication number Publication date
US3870776A (en) 1975-03-11
DE2357625C3 (de) 1978-03-30
DE2357625A1 (de) 1974-07-11
JPS4999608A (cg-RX-API-DMAC7.html) 1974-09-20
DE2357625B2 (de) 1977-08-11
JPS5230164B2 (cg-RX-API-DMAC7.html) 1977-08-06

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee