GB1416561A - Semiconductor arrangements and cooling means therefor - Google Patents

Semiconductor arrangements and cooling means therefor

Info

Publication number
GB1416561A
GB1416561A GB325773A GB325773A GB1416561A GB 1416561 A GB1416561 A GB 1416561A GB 325773 A GB325773 A GB 325773A GB 325773 A GB325773 A GB 325773A GB 1416561 A GB1416561 A GB 1416561A
Authority
GB
United Kingdom
Prior art keywords
insulant
plates
wall
thyristor
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB325773A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of GB1416561A publication Critical patent/GB1416561A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB325773A 1972-01-22 1973-01-22 Semiconductor arrangements and cooling means therefor Expired GB1416561A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722203032 DE2203032C3 (de) 1972-01-22 1972-01-22 Gekühlte Halbleiteranordnung

Publications (1)

Publication Number Publication Date
GB1416561A true GB1416561A (en) 1975-12-03

Family

ID=5833737

Family Applications (1)

Application Number Title Priority Date Filing Date
GB325773A Expired GB1416561A (en) 1972-01-22 1973-01-22 Semiconductor arrangements and cooling means therefor

Country Status (5)

Country Link
JP (2) JPS4884571A (enrdf_load_stackoverflow)
BE (1) BE794291A (enrdf_load_stackoverflow)
DE (1) DE2203032C3 (enrdf_load_stackoverflow)
FR (1) FR2169093B1 (enrdf_load_stackoverflow)
GB (1) GB1416561A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1467607A1 (fr) * 2003-04-09 2004-10-13 Alstom Module de commutation de puissance et onduleur équipé de ce module
US9668376B2 (en) 2013-07-09 2017-05-30 Abb Schweiz Ag Electric converter with compact module arrangement for subsea applications
CN114473304A (zh) * 2022-02-28 2022-05-13 台州竞添机电有限公司 一种电焊机电子元件降温装置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52129467U (enrdf_load_stackoverflow) * 1976-03-27 1977-10-01
JPS5440081A (en) * 1977-09-06 1979-03-28 Fujitsu Fanuc Ltd Thyristor block
FR2413847A1 (fr) * 1977-12-09 1979-07-27 Alsthom Atlantique Circuit d'electronique de puissance immerge dans un hydrocarbure fluore
JPS5758576A (en) * 1980-09-23 1982-04-08 Honda Motor Co Ltd Regulator for shock absorber in autobicycle
CH673188A5 (enrdf_load_stackoverflow) * 1987-08-03 1990-02-15 Schlatter Ag
DE102007001234A1 (de) * 2007-01-08 2008-07-10 Robert Bosch Gmbh Halbleiterbaugruppe zum Anschluss an eine Transformatorwicklung und Transformatoranordnung
DE102016218420A1 (de) * 2016-09-26 2018-03-29 Siemens Aktiengesellschaft Leistungsmodul
DE102017203132A1 (de) * 2017-02-06 2018-08-09 Siemens Aktiengesellschaft Leistungsmodul

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4322388Y1 (enrdf_load_stackoverflow) * 1965-11-15 1968-09-19

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1467607A1 (fr) * 2003-04-09 2004-10-13 Alstom Module de commutation de puissance et onduleur équipé de ce module
FR2853808A1 (fr) * 2003-04-09 2004-10-15 Alstom Module de commutation de puissance et ondulateur equipe de ce module
US7042725B2 (en) 2003-04-09 2006-05-09 Alstom Power switching module and inverter equipped therewith
US9668376B2 (en) 2013-07-09 2017-05-30 Abb Schweiz Ag Electric converter with compact module arrangement for subsea applications
CN114473304A (zh) * 2022-02-28 2022-05-13 台州竞添机电有限公司 一种电焊机电子元件降温装置

Also Published As

Publication number Publication date
DE2203032B2 (de) 1979-10-11
BE794291A (fr) 1973-05-16
JPS5544363Y2 (enrdf_load_stackoverflow) 1980-10-17
JPS5392386U (enrdf_load_stackoverflow) 1978-07-28
FR2169093A1 (enrdf_load_stackoverflow) 1973-09-07
DE2203032A1 (de) 1973-08-02
JPS4884571A (enrdf_load_stackoverflow) 1973-11-09
DE2203032C3 (de) 1980-06-26
FR2169093B1 (enrdf_load_stackoverflow) 1977-04-22

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee