FR2169093B1 - - Google Patents

Info

Publication number
FR2169093B1
FR2169093B1 FR7301902A FR7301902A FR2169093B1 FR 2169093 B1 FR2169093 B1 FR 2169093B1 FR 7301902 A FR7301902 A FR 7301902A FR 7301902 A FR7301902 A FR 7301902A FR 2169093 B1 FR2169093 B1 FR 2169093B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7301902A
Other languages
French (fr)
Other versions
FR2169093A1 (enrdf_load_stackoverflow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of FR2169093A1 publication Critical patent/FR2169093A1/fr
Application granted granted Critical
Publication of FR2169093B1 publication Critical patent/FR2169093B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR7301902A 1972-01-22 1973-01-19 Expired FR2169093B1 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722203032 DE2203032C3 (de) 1972-01-22 1972-01-22 Gekühlte Halbleiteranordnung

Publications (2)

Publication Number Publication Date
FR2169093A1 FR2169093A1 (enrdf_load_stackoverflow) 1973-09-07
FR2169093B1 true FR2169093B1 (enrdf_load_stackoverflow) 1977-04-22

Family

ID=5833737

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7301902A Expired FR2169093B1 (enrdf_load_stackoverflow) 1972-01-22 1973-01-19

Country Status (5)

Country Link
JP (2) JPS4884571A (enrdf_load_stackoverflow)
BE (1) BE794291A (enrdf_load_stackoverflow)
DE (1) DE2203032C3 (enrdf_load_stackoverflow)
FR (1) FR2169093B1 (enrdf_load_stackoverflow)
GB (1) GB1416561A (enrdf_load_stackoverflow)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52129467U (enrdf_load_stackoverflow) * 1976-03-27 1977-10-01
JPS5440081A (en) * 1977-09-06 1979-03-28 Fujitsu Fanuc Ltd Thyristor block
FR2413847A1 (fr) * 1977-12-09 1979-07-27 Alsthom Atlantique Circuit d'electronique de puissance immerge dans un hydrocarbure fluore
JPS5758576A (en) * 1980-09-23 1982-04-08 Honda Motor Co Ltd Regulator for shock absorber in autobicycle
CH673188A5 (enrdf_load_stackoverflow) * 1987-08-03 1990-02-15 Schlatter Ag
FR2853808B1 (fr) 2003-04-09 2006-09-15 Alstom Module de commutation de puissance et ondulateur equipe de ce module
DE102007001234A1 (de) * 2007-01-08 2008-07-10 Robert Bosch Gmbh Halbleiterbaugruppe zum Anschluss an eine Transformatorwicklung und Transformatoranordnung
EP2825009B8 (en) 2013-07-09 2016-11-23 ABB Schweiz AG Electric converter with compact module arrangement for subsea applications
DE102016218420A1 (de) * 2016-09-26 2018-03-29 Siemens Aktiengesellschaft Leistungsmodul
DE102017203132A1 (de) * 2017-02-06 2018-08-09 Siemens Aktiengesellschaft Leistungsmodul
CN114473304B (zh) * 2022-02-28 2024-08-02 台州竞添机电有限公司 一种电焊机电子元件降温装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4322388Y1 (enrdf_load_stackoverflow) * 1965-11-15 1968-09-19

Also Published As

Publication number Publication date
JPS5392386U (enrdf_load_stackoverflow) 1978-07-28
JPS5544363Y2 (enrdf_load_stackoverflow) 1980-10-17
DE2203032C3 (de) 1980-06-26
FR2169093A1 (enrdf_load_stackoverflow) 1973-09-07
JPS4884571A (enrdf_load_stackoverflow) 1973-11-09
BE794291A (fr) 1973-05-16
DE2203032A1 (de) 1973-08-02
DE2203032B2 (de) 1979-10-11
GB1416561A (en) 1975-12-03

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Legal Events

Date Code Title Description
ST Notification of lapse