GB1374617A - Grinding machine and method and semiconductor formed thereby - Google Patents

Grinding machine and method and semiconductor formed thereby

Info

Publication number
GB1374617A
GB1374617A GB5937471A GB5937471A GB1374617A GB 1374617 A GB1374617 A GB 1374617A GB 5937471 A GB5937471 A GB 5937471A GB 5937471 A GB5937471 A GB 5937471A GB 1374617 A GB1374617 A GB 1374617A
Authority
GB
United Kingdom
Prior art keywords
grinding
chuck
wafers
strips
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5937471A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of GB1374617A publication Critical patent/GB1374617A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
GB5937471A 1970-12-21 1971-12-21 Grinding machine and method and semiconductor formed thereby Expired GB1374617A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP45115467A JPS504544B1 (enrdf_load_stackoverflow) 1970-12-21 1970-12-21

Publications (1)

Publication Number Publication Date
GB1374617A true GB1374617A (en) 1974-11-20

Family

ID=14663247

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5937471A Expired GB1374617A (en) 1970-12-21 1971-12-21 Grinding machine and method and semiconductor formed thereby

Country Status (4)

Country Link
US (1) US3834083A (enrdf_load_stackoverflow)
JP (1) JPS504544B1 (enrdf_load_stackoverflow)
CA (1) CA955061A (enrdf_load_stackoverflow)
GB (1) GB1374617A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113400131A (zh) * 2021-05-28 2021-09-17 力成科技（苏州）有限公司 一种改善晶圆边缘碎裂的削边装置
CN113842729A (zh) * 2021-09-24 2021-12-28 南京利卡维智能科技有限公司 一种多轴研磨机用真空抽取机构及其真空研磨方法
CN114871934A (zh) * 2022-07-05 2022-08-09 靖江市苏伦工程机械有限公司 销轴智能生产线自动防错位磨削抛光装置

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55112946A (en) * 1979-02-21 1980-09-01 Matsushita Electric Ind Co Ltd Controlling device of air flow in air conditioner
JPS56105638A (en) * 1980-01-26 1981-08-22 Sumitomo Electric Ind Ltd Manufacture of circular gallium arsenide wafer
US5094037A (en) * 1989-10-03 1992-03-10 Speedfam Company, Ltd. Edge polisher
US5154022A (en) * 1991-06-21 1992-10-13 International Business Machines Corporation High precision micromachining of very fine features
JP2827885B2 (ja) * 1994-02-12 1998-11-25 信越半導体株式会社 半導体単結晶基板およびその製造方法
US5952050A (en) 1996-02-27 1999-09-14 Micron Technology, Inc. Chemical dispensing system for semiconductor wafer processing
US6860795B2 (en) * 2001-09-17 2005-03-01 Hitachi Global Storage Technologies Netherlands B.V. Edge finishing process for glass or ceramic disks used in disk drive data storage devices
JP4162892B2 (ja) * 2002-01-11 2008-10-08 日鉱金属株式会社 半導体ウェハおよびその製造方法
KR20040089438A (ko) * 2002-03-14 2004-10-21 가부시기가이샤 디스코 반도체 웨이퍼의 이면 연삭방법
KR100898793B1 (ko) * 2005-12-29 2009-05-20 엘지디스플레이 주식회사 액정표시소자용 기판 합착 장치
CN111347061B (zh) * 2018-12-24 2021-03-30 有研半导体材料有限公司 一种硅环加工的工艺方法
CN113579891B (zh) * 2021-06-23 2022-06-07 福安市中虹机电技术开发有限公司 圆片堆叠打磨装置及其堆叠打磨方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1246191A (en) * 1916-10-05 1917-11-13 Dodge Brothers Cylinder-lapping machine.
US1634952A (en) * 1924-08-07 1927-07-05 American Optical Corp Surfacing-machine spindle attachment
US2074177A (en) * 1935-04-15 1937-03-16 Joseph P Graul Abrading tool
US2612729A (en) * 1948-10-09 1952-10-07 Walley John Towing clayware
US2637953A (en) * 1950-04-17 1953-05-12 Ammco Tools Inc Cylinder surfacing tool
US3146552A (en) * 1961-02-14 1964-09-01 Service Eng Ltd Ceramic ware towing device
US3065579A (en) * 1961-08-10 1962-11-27 Clark Feather Mfg Co Cylinder honing tool

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113400131A (zh) * 2021-05-28 2021-09-17 力成科技（苏州）有限公司 一种改善晶圆边缘碎裂的削边装置
CN113842729A (zh) * 2021-09-24 2021-12-28 南京利卡维智能科技有限公司 一种多轴研磨机用真空抽取机构及其真空研磨方法
CN113842729B (zh) * 2021-09-24 2022-11-25 南京利卡维智能科技有限公司 一种多轴研磨机用真空抽取机构及其真空研磨方法
CN114871934A (zh) * 2022-07-05 2022-08-09 靖江市苏伦工程机械有限公司 销轴智能生产线自动防错位磨削抛光装置
CN114871934B (zh) * 2022-07-05 2022-10-25 靖江市苏伦工程机械有限公司 销轴智能生产线自动防错位磨削抛光装置

Also Published As

Publication number Publication date
US3834083A (en) 1974-09-10
JPS504544B1 (enrdf_load_stackoverflow) 1975-02-20
CA955061A (en) 1974-09-24

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee