GB1353980A - Methods of manufacturing semiconductor devices - Google Patents

Methods of manufacturing semiconductor devices

Info

Publication number
GB1353980A
GB1353980A GB4122671A GB4122671A GB1353980A GB 1353980 A GB1353980 A GB 1353980A GB 4122671 A GB4122671 A GB 4122671A GB 4122671 A GB4122671 A GB 4122671A GB 1353980 A GB1353980 A GB 1353980A
Authority
GB
United Kingdom
Prior art keywords
layer
type
diodes
gaas
iii
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4122671A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1353980A publication Critical patent/GB1353980A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/207Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds further characterised by the doping material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

1353980 Semi-conductor devices PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd 3 Sept 1971 [8 Sept 1970] 41226/71 Heading H1K A low-resistance ohmic contact is formed on an N-type body of a III-V compound semiconductor such as GaAs, GaP or a mixture thereof by alloying with the body a doping layer comprising a metal such as Au, Ag, Sn or In, Ge which acts as a donor in the III-V compound and a further dopant, such as As, P or Sb, which acts as a donor in Ge. On recrystallization there are formed an N-type Ge-doped III-V layer and an overlying N-type Ge layer. After removal of the remaining part of the doping layer, e.g. using Hg or liquid Ga as a solvent, a metal contact is preferably applied to the N-type Ge layer to complete the ohmic contact. The metal contact may be of Au or Ag or of one of these metals on a layer of Cr, Al or Ti. Fig. 3 shows a plurality of mesa-like Gunn diodes 7 formed by etching a GaAs body mounted temporarily on a glass support 8. The GaAs body comprises an N<SP>+</SP>-type substrate 1 and an N-type epitaxial layer 2, both surfaces being provided with metal contacts 5, 6 in accordance with the invention. Other types of device to which the invention is applicable are avalanche diodes, varactor diodes, Schottky diodes and light-emissive diodes.
GB4122671A 1970-09-08 1971-09-03 Methods of manufacturing semiconductor devices Expired GB1353980A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7013226A NL7013226A (en) 1970-09-08 1970-09-08

Publications (1)

Publication Number Publication Date
GB1353980A true GB1353980A (en) 1974-05-22

Family

ID=19810980

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4122671A Expired GB1353980A (en) 1970-09-08 1971-09-03 Methods of manufacturing semiconductor devices

Country Status (11)

Country Link
JP (1) JPS5120155B1 (en)
AU (1) AU3308671A (en)
BE (1) BE772253A (en)
BR (1) BR7105871D0 (en)
CA (1) CA928870A (en)
DE (1) DE2142900A1 (en)
FR (1) FR2106379B1 (en)
GB (1) GB1353980A (en)
IT (1) IT939789B (en)
NL (1) NL7013226A (en)
SE (1) SE375187B (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6509986A (en) * 1964-08-03 1966-02-04
US3386867A (en) * 1965-09-22 1968-06-04 Ibm Method for providing electrical contacts to a wafer of gaas
GB1101909A (en) * 1967-01-13 1968-02-07 Standard Telephones Cables Ltd Method for producing gallium arsenide devices
GB1224171A (en) * 1967-02-07 1971-03-03 Associated Semiconductor Mft Improvements in and relating to gunn-effect devices

Also Published As

Publication number Publication date
AU3308671A (en) 1973-03-08
FR2106379B1 (en) 1975-07-11
IT939789B (en) 1973-02-10
FR2106379A1 (en) 1972-05-05
CA928870A (en) 1973-06-19
BE772253A (en) 1972-03-06
NL7013226A (en) 1972-03-10
SE375187B (en) 1975-04-07
JPS5120155B1 (en) 1976-06-23
BR7105871D0 (en) 1973-04-17
DE2142900A1 (en) 1972-03-16

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee