GB1353055A - Polyamide composition for use as a solder substitute - Google Patents

Polyamide composition for use as a solder substitute

Info

Publication number
GB1353055A
GB1353055A GB2380171A GB2380171A GB1353055A GB 1353055 A GB1353055 A GB 1353055A GB 2380171 A GB2380171 A GB 2380171A GB 2380171 A GB2380171 A GB 2380171A GB 1353055 A GB1353055 A GB 1353055A
Authority
GB
United Kingdom
Prior art keywords
parts
per cent
polyamide
ester
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2380171A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wiederhold Hermann GmbH Corp
Daimler Benz AG
Original Assignee
Wiederhold Hermann GmbH Corp
Daimler Benz AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wiederhold Hermann GmbH Corp, Daimler Benz AG filed Critical Wiederhold Hermann GmbH Corp
Publication of GB1353055A publication Critical patent/GB1353055A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06Polyamides derived from polyamines and polycarboxylic acids
    • C08L77/08Polyamides derived from polyamines and polycarboxylic acids from polyamines and polymerised unsaturated fatty acids
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/28Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/286Al as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615N-compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Polyamides (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
GB2380171A 1970-03-13 1971-04-19 Polyamide composition for use as a solder substitute Expired GB1353055A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702011946 DE2011946C3 (de) 1970-03-13 1970-03-13 Schwemmlot

Publications (1)

Publication Number Publication Date
GB1353055A true GB1353055A (en) 1974-05-15

Family

ID=5764978

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2380171A Expired GB1353055A (en) 1970-03-13 1971-04-19 Polyamide composition for use as a solder substitute

Country Status (5)

Country Link
JP (1) JPS4942238B1 (enExample)
DE (1) DE2011946C3 (enExample)
FR (1) FR2084497A6 (enExample)
GB (1) GB1353055A (enExample)
IT (1) IT983116B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3834147A1 (de) * 1988-10-07 1990-04-12 Systec Digital Analog Tech Loetverfahren zur verbindung elektronischer und/oder mechanischer bauteile mit einer leiterplatte, zusatzstoff sowie laserloetvorrichtung
FR2720392B1 (fr) * 1994-05-25 1996-08-02 Onera (Off Nat Aerospatiale) Procédé et composition pour l'assemblage de pièces en céramique et en alliage réfractaire.

Also Published As

Publication number Publication date
IT983116B (it) 1974-10-31
JPS4942238B1 (enExample) 1974-11-13
FR2084497A6 (enExample) 1971-12-17
DE2011946C3 (de) 1973-10-25
DE2011946B2 (de) 1973-03-29
DE2011946A1 (de) 1971-09-30

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees