GB1318141A - Sputtering apparatus - Google Patents
Sputtering apparatusInfo
- Publication number
- GB1318141A GB1318141A GB26271A GB26271A GB1318141A GB 1318141 A GB1318141 A GB 1318141A GB 26271 A GB26271 A GB 26271A GB 26271 A GB26271 A GB 26271A GB 1318141 A GB1318141 A GB 1318141A
- Authority
- GB
- United Kingdom
- Prior art keywords
- cathode
- anode
- target
- chamber
- sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004544 sputter deposition Methods 0.000 title abstract 8
- 239000000758 substrate Substances 0.000 abstract 7
- 239000002826 coolant Substances 0.000 abstract 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 abstract 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 abstract 2
- 239000000969 carrier Substances 0.000 abstract 2
- 239000012530 fluid Substances 0.000 abstract 2
- 229910052733 gallium Inorganic materials 0.000 abstract 2
- 229910001338 liquidmetal Inorganic materials 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052786 argon Inorganic materials 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 239000008367 deionised water Substances 0.000 abstract 1
- 239000010453 quartz Substances 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 abstract 1
- 239000010935 stainless steel Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H18/00—Winding webs
- B65H18/02—Supporting web roll
- B65H18/021—Multiple web roll supports
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3471—Introduction of auxiliary energy into the plasma
- C23C14/3478—Introduction of auxiliary energy into the plasma using electrons, e.g. triode sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Discharge Heating (AREA)
- Plasma Technology (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US482570A | 1970-01-22 | 1970-01-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1318141A true GB1318141A (en) | 1973-05-23 |
Family
ID=21712710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB26271A Expired GB1318141A (en) | 1970-01-22 | 1971-01-04 | Sputtering apparatus |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3707452A (enExample) |
| JP (1) | JPS4926837B1 (enExample) |
| DE (1) | DE2102334A1 (enExample) |
| FR (1) | FR2075468A5 (enExample) |
| GB (1) | GB1318141A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007050304A1 (en) * | 2005-10-24 | 2007-05-03 | Guardian Industries Corp. | Sputtering target and means for cooling the target |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4038171A (en) * | 1976-03-31 | 1977-07-26 | Battelle Memorial Institute | Supported plasma sputtering apparatus for high deposition rate over large area |
| US4268374A (en) * | 1979-08-09 | 1981-05-19 | Bell Telephone Laboratories, Incorporated | High capacity sputter-etching apparatus |
| EP0136364B1 (de) * | 1983-09-23 | 1988-07-20 | Ibm Deutschland Gmbh | Verfahren und Anordnung zum selektiven, selbstjustierten Aufbringen von Metallschichten und Verwendung des Verfahrens |
| US4478701A (en) * | 1983-12-30 | 1984-10-23 | Rca Corporation | Target support adjusting fixture |
| US5935411A (en) * | 1997-05-16 | 1999-08-10 | Ethicon, Inc. | Continuous process for electropolishing surgical needles |
| CN103849840B (zh) * | 2012-12-06 | 2016-02-10 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 物理气相沉积设备 |
| KR20200135569A (ko) * | 2016-01-13 | 2020-12-02 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판을 홀딩하기 위한 홀딩 어레인지먼트, 기판을 지지하기 위한 캐리어, 진공 프로세싱 시스템, 기판을 홀딩하기 위한 방법, 및 기판을 릴리스하기 위한 방법 |
| US11670490B2 (en) | 2017-09-29 | 2023-06-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated circuit fabrication system with adjustable gas injector |
| US20200316239A1 (en) * | 2017-12-30 | 2020-10-08 | 3M Innovative Properties Company | Plasma sterilization and drying system and methods |
| US10748740B2 (en) * | 2018-08-21 | 2020-08-18 | Fei Company | X-ray and particle shield for improved vacuum conductivity |
| EP3927865A1 (en) * | 2019-02-20 | 2021-12-29 | Oerlikon Surface Solutions AG, Pfäffikon | Optimized system and method for transporting and moving substrates in a modular coating facility |
-
1970
- 1970-01-22 US US4825A patent/US3707452A/en not_active Expired - Lifetime
- 1970-12-23 JP JP45115969A patent/JPS4926837B1/ja active Pending
-
1971
- 1971-01-04 GB GB26271A patent/GB1318141A/en not_active Expired
- 1971-01-07 FR FR7100859A patent/FR2075468A5/fr not_active Expired
- 1971-01-19 DE DE19712102334 patent/DE2102334A1/de active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007050304A1 (en) * | 2005-10-24 | 2007-05-03 | Guardian Industries Corp. | Sputtering target and means for cooling the target |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2102334A1 (de) | 1971-07-29 |
| JPS4926837B1 (enExample) | 1974-07-12 |
| US3707452A (en) | 1972-12-26 |
| FR2075468A5 (enExample) | 1971-10-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |