GB1314839A - Thermal bonding apparatus - Google Patents
Thermal bonding apparatusInfo
- Publication number
- GB1314839A GB1314839A GB4221270A GB4221270A GB1314839A GB 1314839 A GB1314839 A GB 1314839A GB 4221270 A GB4221270 A GB 4221270A GB 4221270 A GB4221270 A GB 4221270A GB 1314839 A GB1314839 A GB 1314839A
- Authority
- GB
- United Kingdom
- Prior art keywords
- flop
- transistor
- tip
- flip
- potentiometer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
- B23K20/007—Ball bonding
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1906—Control of temperature characterised by the use of electric means using an analogue comparing device
- G05D23/1913—Control of temperature characterised by the use of electric means using an analogue comparing device delivering a series of pulses
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
- G05D23/24—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07531—Techniques
- H10W72/07532—Compression bonding, e.g. thermocompression bonding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Mechanical Engineering (AREA)
- Control Of Temperature (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US86952969A | 1969-10-27 | 1969-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1314839A true GB1314839A (en) | 1973-04-26 |
Family
ID=25353723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB4221270A Expired GB1314839A (en) | 1969-10-27 | 1970-09-03 | Thermal bonding apparatus |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US3602684A (https=) |
| JP (1) | JPS5126592B1 (https=) |
| GB (1) | GB1314839A (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE445228B (sv) * | 1984-10-15 | 1986-06-09 | Tekno Detaljer Lindstrom & Wae | Anordning for vermebehandling av skruvlindade fjedrar |
| JPH03100002U (https=) * | 1990-02-01 | 1991-10-18 | ||
| US7896218B2 (en) * | 2007-06-28 | 2011-03-01 | Western Digital Technologies, Inc. | Apparatus and method for conductive metal ball bonding with electrostatic discharge detection |
| US20100326740A1 (en) * | 2009-06-26 | 2010-12-30 | Hall David R | Bonded Assembly Having Low Residual Stress |
| US8642924B2 (en) * | 2010-04-09 | 2014-02-04 | Illinois Tool Works Inc. | Welding arc termination method and system |
| US20130168380A1 (en) * | 2012-01-04 | 2013-07-04 | Ching-Chuan Wang | Heating structure and method for preventing the overheat of heating line |
| CN109565139B (zh) | 2016-08-11 | 2021-05-14 | D.M.贝纳塔夫有限责任公司 | 多种直径的线材的连接 |
-
1969
- 1969-10-27 US US869529A patent/US3602684A/en not_active Expired - Lifetime
-
1970
- 1970-09-03 GB GB4221270A patent/GB1314839A/en not_active Expired
- 1970-10-27 JP JP45094239A patent/JPS5126592B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5126592B1 (https=) | 1976-08-07 |
| US3602684A (en) | 1971-08-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |