GB1305047A - - Google Patents

Abstract

1305047 Soldering PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd 11 Dec 1970 [16 Dec 1969] 58943/70 Heading B3R A hot gas soldering device comprises a tube 1 having a supply member 3 for a gas, a nozzle 2 for directing the gas on to workpieces, an electric heating coil 5 in the tube 1 for heating the gas, a valve 7 outside the tube 1 in a conduit 6 connected to the tube via the supply member 3 for controlling the gas supply to the tube 1 and a duct 13 extending from the tube 1 at a point between the outlet end 18 of the nozzle and the adjacent end of the heating coil 5. The quartz glass tube 1 houses a quartz glass support 4 on which the coil 5 is wound with its terminals sealed in a spring urged stopper 25 and connected to a voltage source. The valve 7 is electromagnetic and the nozzle end of the tube is mounted in an asbestos cement block 8 secured in a holder 9 by a plate 10. The other end of the tube passes through an asbestos cement block 23 and a spring 24 connected between the stopper 25 and the holder 9 urges the tube against the plate 10. The duct 13 is provided in the block 8 to communicate at one end with the tube 1 and at the other end with a duct 14 in the holder 9 connected to a tube 16 in a support plate 15. The tube 16 communicates with an electromagnetic valve 17 connected to a source of reduced pressure. In operation one of the members to be soldered, e.g. a semi-conductor circuit element is laid on the flat end surface of the nozzle which is provided with radially extending grooves and the valve 17 is opened to hold the element against the nozzle, the tube 1 is adjusted on the plate 15 to align the crystal with conductors on a synthetic resin substrate, the substrate is urged against the crystal, the valve 17 is closed and valve 7 is opened to supply gas heated by the coil 5 to heat the crystal and melt solder between the crystal and conductors. Valve 7 is then closed and valve 17 opened to draw cooling air across the crystal.