GB1300981A - Process for preparing b-stage resin compositions - Google Patents

Process for preparing b-stage resin compositions

Info

Publication number
GB1300981A
GB1300981A GB4802770A GB4802770A GB1300981A GB 1300981 A GB1300981 A GB 1300981A GB 4802770 A GB4802770 A GB 4802770A GB 4802770 A GB4802770 A GB 4802770A GB 1300981 A GB1300981 A GB 1300981A
Authority
GB
United Kingdom
Prior art keywords
oct
epoxy
cure
reacting
prepared
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4802770A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink and Chemicals Co Ltd filed Critical Dainippon Ink and Chemicals Co Ltd
Publication of GB1300981A publication Critical patent/GB1300981A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)

Abstract

1300981 Impregnated glass-cloth laminates DAINIPPON INK & CHEMICALS Inc 8 Oct 1970 [8 Oct 1969 18 Oct 1969] 48027/70 Heading B5N [Also in Division C3] Glass-cloth laminates use as adhesive an organic solvent solution of a solid B-stage resin composition (m.p. # 50‹ C.) prepared by reacting a 2,3-epoxybutyl ether epoxy resin (I) with one or more aliphatic, alicyclic, aralkylene or heterocyclic polyamines at > 60‹ C. The polyamine is present in an amount sufficient to cure the resin but reaction is stopped before the cure has gone to completion. (I) may be prepared by reacting a polyhydric phenol or alcohol with 1,2-epoxy-3-chloro-butane or -isobutane or 2,3-epoxy-1-chlorobutane in the presence of alkali. The amine may be present so as to provide 0À8 to 1À2 active hydrogen atoms per epoxy group of (I). Examples relate to the preparation of 6-ply laminates by heating for 2 mins. at 173Œ4‹ C./15 kg./cm.<SP>2</SP>.
GB4802770A 1969-10-08 1970-10-08 Process for preparing b-stage resin compositions Expired GB1300981A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7997069 1969-10-08
JP8298369 1969-10-18

Publications (1)

Publication Number Publication Date
GB1300981A true GB1300981A (en) 1972-12-29

Family

ID=26420948

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4802770A Expired GB1300981A (en) 1969-10-08 1970-10-08 Process for preparing b-stage resin compositions

Country Status (3)

Country Link
DE (1) DE2049541A1 (en)
FR (1) FR2065185A5 (en)
GB (1) GB1300981A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5512372A (en) * 1992-01-15 1996-04-30 Brochier, S.A. Epoxy resin composition and applications, in particular in composite structures, using imidazole/polyamine mixture
CN104656373A (en) * 2015-01-08 2015-05-27 苏州瑞红电子化学品有限公司 Photosensitizer-free photoresist composition used in glass passivated rectifier chip (GPRC) technology

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5512372A (en) * 1992-01-15 1996-04-30 Brochier, S.A. Epoxy resin composition and applications, in particular in composite structures, using imidazole/polyamine mixture
CN104656373A (en) * 2015-01-08 2015-05-27 苏州瑞红电子化学品有限公司 Photosensitizer-free photoresist composition used in glass passivated rectifier chip (GPRC) technology
CN104656373B (en) * 2015-01-08 2018-10-12 苏州瑞红电子化学品有限公司 A kind of photoetching compositions and its application for without photosensitizer in glass passivation rectifying chip technique

Also Published As

Publication number Publication date
FR2065185A5 (en) 1971-07-23
DE2049541A1 (en) 1971-06-09

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee