GB1299413A - Contact deposition of platinum and other metals - Google Patents

Contact deposition of platinum and other metals

Info

Publication number
GB1299413A
GB1299413A GB2519171A GB2519171A GB1299413A GB 1299413 A GB1299413 A GB 1299413A GB 2519171 A GB2519171 A GB 2519171A GB 2519171 A GB2519171 A GB 2519171A GB 1299413 A GB1299413 A GB 1299413A
Authority
GB
United Kingdom
Prior art keywords
metals
alloy
deposition
substrate
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2519171A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ExxonMobil Oil Corp
Original Assignee
Mobil Oil Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mobil Oil Corp filed Critical Mobil Oil Corp
Publication of GB1299413A publication Critical patent/GB1299413A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1644—Composition of the substrate porous substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C23C18/1692—Heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals

Abstract

1299413 Electroless deposition of alloys from pi-complexes MOBIL OIL CORP 19 April 1971 [24 March 1970 5 May 1970] 25191/71 Addition to 1180891 Heading C7F An alloy is deposited upon a substrate by contacting the substrate with a non-aqueous solution of compounds of a plurality of metals, at least one of said metals being in the form of a pi-complex having at least one ligand which is an organic group containing at least one carbon-tocarbon multiple bond, the group being pi-bonded to the metal by one or more such multiple bonds and at least one of said metals being in the form of a compound which is not a pi-complex and reducing the compounds at a temperature below the thermal decomposition temperature thereof to the elemental metals, which deposit as an alloy. A reducing agent such as H 2 gas may be added to the solution to assist deposition, or the catalytic effect of the substrate surface may promote deposition, especially when the solvent is an alcohol. The metals of the alloy are from Groups IB, IV, V, VI, VII, or VIII of the Periodic Table, with Ru, Rh, Pd, Os, Ir, Pt, Ag, Au, Mn, V, Ti, and Re being preferred; specific alloys mentioned are Au-Ag, Pd-Au, Pd-Ag, Pt-Re, Pt-Ti, Au-Co, and Pd-Rh-Au. Extensive lists of ligands, solvents and reducing agents are given; one alloy may be deposited on top of another. Substrates mentioned are: metal oxides, aluminosilicate molecular sieves, ion-exchange resins, polymers, graphite, carbon black, powdered metals, e.g. Cu, Ag, and metal screens.
GB2519171A 1970-03-24 1971-04-19 Contact deposition of platinum and other metals Expired GB1299413A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US2236270A 1970-03-24 1970-03-24
US3486370A 1970-05-05 1970-05-05

Publications (1)

Publication Number Publication Date
GB1299413A true GB1299413A (en) 1972-12-13

Family

ID=26695847

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2519171A Expired GB1299413A (en) 1970-03-24 1971-04-19 Contact deposition of platinum and other metals

Country Status (1)

Country Link
GB (1) GB1299413A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2242203A (en) * 1990-03-21 1991-09-25 Johnson Matthey Plc Catalyst material comprising platinum alloy supported on carbon
EP0927775A2 (en) * 1997-11-25 1999-07-07 NGK Spark Plug Co. Ltd. Process for forming an electrode for a ceramic sensor element by electroless plating

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2242203A (en) * 1990-03-21 1991-09-25 Johnson Matthey Plc Catalyst material comprising platinum alloy supported on carbon
EP0927775A2 (en) * 1997-11-25 1999-07-07 NGK Spark Plug Co. Ltd. Process for forming an electrode for a ceramic sensor element by electroless plating
EP0927775A3 (en) * 1997-11-25 2002-04-03 NGK Spark Plug Co. Ltd. Process for forming an electrode for a ceramic sensor element by electroless plating

Similar Documents

Publication Publication Date Title
US4510182A (en) Method for the production of homogeneous coatings of two or more metals and/or metal compounds
Toshima et al. Preparation and catalysis of novel colloidal dispersions of copper/noble metal bimetallic clusters
White et al. Synthesis and crystal and molecular structure of [(C5H5) 2Ti (SCH2CH2P (C6H5) 2) 2Cu] BF4: a heterobimetallic species with a copper to titanium dative bond
JP4108135B2 (en) Direct deposition of palladium
Heck Addition reactions of transition metal compounds
US3635761A (en) Electroless deposition of metals
Guy et al. Olefin, Acetylene, and π-Allylic Complexes of Transition Metals
KR900006014B1 (en) Thick film conductor composition
ES439589A1 (en) Catalysts for electroless deposition of metals on comparatively low-temperature polyolefin and polyester substrates
SE464798B (en) CATALYST CONTAINING A SUBSTRATE, AN INTERMEDIATE OXID LAYER AND A CATALYTIC LAYER
JPH0352475B2 (en)
Hierso et al. Platinum, palladium and rhodium complexes as volatile precursors for depositing materials
Cabeza et al. The transition metal chemistry of PGeP and PSnP pincer heavier tetrylenes
Shin et al. Preparation of volatile, monomeric copper (I) β-diketonate complexes
Aika et al. Ammonia synthesis over rhodium, iridium and platinum promoted by potassium
GB1299413A (en) Contact deposition of platinum and other metals
CA2078881A1 (en) Ceramic materials, method of preparing the same and hydrogenation and oxidation processes using the same
US3974095A (en) Catalyst for hydrogenation, isomerization and hydrosilylation of alkanes, and method of preparation
US3253946A (en) Vapor plating with manganese, chromium, molybdenum or tungsten employing cyclopentadienyl metal carbonyl
GB1454078A (en) Electroless plating
EP0514525A1 (en) Preparation of platinum group metal and rhenium carboxylates
US3844980A (en) Catalyst for use in purification of exhaust gases
Aresta et al. Carbon dioxide as modulator of the oxidative properties of dioxygen in the presence of transition metal systems
GB1403197A (en) Metal encapsulation
JPS62130208A (en) Production of finely divided metal powder

Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees