GB1260618A - Planar junctions with integrated resistor, for high voltages - Google Patents
Planar junctions with integrated resistor, for high voltagesInfo
- Publication number
- GB1260618A GB1260618A GB2414070A GB2414070A GB1260618A GB 1260618 A GB1260618 A GB 1260618A GB 2414070 A GB2414070 A GB 2414070A GB 2414070 A GB2414070 A GB 2414070A GB 1260618 A GB1260618 A GB 1260618A
- Authority
- GB
- United Kingdom
- Prior art keywords
- layer
- junction
- semi
- conductor
- weakly conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 abstract 3
- 230000015556 catabolic process Effects 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 238000005421 electrostatic potential Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
- H01L29/405—Resistive arrangements, e.g. resistive or semi-insulating field plates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
- H01L29/404—Multiple field plate structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/8611—Planar PN junction diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Thyristors (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
1,260,618. Semi-conductor devices. SOC. GENERALE SEMICONDUTTORI S.p.A. SGS. 19 May, 1970 [9 Aug., 1969], No. 24140/70. Heading H1K. A thin layer 11 of weakly conducting material overlying an oxide layer 5 interconnects opposite sides of a planar PN junction 8, 9 which emerges at a surface of a semi-conductor body 4 below the oxide layer 5. The layer 11 provides a distributed electrostatic potential in the surface of the body 4, and improves the breakdown characteristic of the junction 8, 9. The body 4 may be of Si, the junction 8, 9 being formed by oxide-masked diffusion of B from vapour. The thickness of the weakly conducting layer 11 may vary as shown to control its resistance, or the same effect may be obtained by varying its surface configuration along its length. Discrete highly conductive areas (13a-13d), Figs. 4 and 5 (not shown), may be provided above or below the weakly conducting layer to modify the potential distribution induced in the semi-conductor. The invention is applicable to integrated circuits, diodes, transistors and thyristors.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT5295669 | 1969-08-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1260618A true GB1260618A (en) | 1972-01-19 |
Family
ID=11278832
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2414070A Expired GB1260618A (en) | 1969-08-09 | 1970-05-19 | Planar junctions with integrated resistor, for high voltages |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE2031082C2 (en) |
FR (1) | FR2070661B1 (en) |
GB (1) | GB1260618A (en) |
NL (1) | NL168654C (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0615291B1 (en) * | 1993-03-10 | 1997-05-21 | Hitachi, Ltd. | A high breakdown voltage semiconductor device having a semi-insulating layer |
WO2000075989A1 (en) * | 1999-06-03 | 2000-12-14 | Koninklijke Philips Electronics N.V. | Semiconductor device comprising a high-voltage circuit element |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4157563A (en) * | 1971-07-02 | 1979-06-05 | U.S. Philips Corporation | Semiconductor device |
BE785747A (en) * | 1971-07-02 | 1973-01-02 | Philips Nv | SEMICONDUCTOR DEVICE |
JPS5218070B2 (en) * | 1972-10-04 | 1977-05-19 | ||
US4009483A (en) * | 1974-04-04 | 1977-02-22 | Motorola, Inc. | Implementation of surface sensitive semiconductor devices |
JPS51111069A (en) * | 1975-03-26 | 1976-10-01 | Hitachi Ltd | Semiconductor device |
GB2011178B (en) * | 1977-12-15 | 1982-03-17 | Philips Electronic Associated | Fieldeffect devices |
US4947232A (en) * | 1980-03-22 | 1990-08-07 | Sharp Kabushiki Kaisha | High voltage MOS transistor |
JPS56169369A (en) * | 1980-05-30 | 1981-12-26 | Sharp Corp | High withstand voltage mos field effect semiconductor device |
JPS56169368A (en) * | 1980-05-30 | 1981-12-26 | Sharp Corp | High withstand voltage mos field effect semiconductor device |
DE3520599A1 (en) * | 1984-06-15 | 1985-12-19 | Rca Corp., Princeton, N.J. | Semiconductor component |
GB2167229B (en) * | 1984-11-21 | 1988-07-20 | Philips Electronic Associated | Semiconductor devices |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA941074A (en) * | 1964-04-16 | 1974-01-29 | Northern Electric Company Limited | Semiconductor devices with field electrodes |
-
1970
- 1970-05-19 GB GB2414070A patent/GB1260618A/en not_active Expired
- 1970-06-19 FR FR7022664A patent/FR2070661B1/fr not_active Expired
- 1970-06-24 DE DE19702031082 patent/DE2031082C2/en not_active Expired
- 1970-06-24 NL NL7009259A patent/NL168654C/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0615291B1 (en) * | 1993-03-10 | 1997-05-21 | Hitachi, Ltd. | A high breakdown voltage semiconductor device having a semi-insulating layer |
WO2000075989A1 (en) * | 1999-06-03 | 2000-12-14 | Koninklijke Philips Electronics N.V. | Semiconductor device comprising a high-voltage circuit element |
Also Published As
Publication number | Publication date |
---|---|
NL7009259A (en) | 1971-02-11 |
DE2031082A1 (en) | 1971-04-08 |
NL168654C (en) | 1982-04-16 |
FR2070661B1 (en) | 1974-03-22 |
FR2070661A1 (en) | 1971-09-17 |
NL168654B (en) | 1981-11-16 |
DE2031082C2 (en) | 1983-02-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PE20 | Patent expired after termination of 20 years |