GB1254101A - Improvements in or relating to microcircuit insulation - Google Patents
Improvements in or relating to microcircuit insulationInfo
- Publication number
- GB1254101A GB1254101A GB52519/67A GB5251967A GB1254101A GB 1254101 A GB1254101 A GB 1254101A GB 52519/67 A GB52519/67 A GB 52519/67A GB 5251967 A GB5251967 A GB 5251967A GB 1254101 A GB1254101 A GB 1254101A
- Authority
- GB
- United Kingdom
- Prior art keywords
- glaze
- layers
- refractory oxide
- insulating
- nov
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000009413 insulation Methods 0.000 title 1
- 238000010438 heat treatment Methods 0.000 abstract 2
- 239000011810 insulating material Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 abstract 1
- 229910010413 TiO 2 Inorganic materials 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 abstract 1
- 238000010276 construction Methods 0.000 abstract 1
- 238000007796 conventional method Methods 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 abstract 1
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 238000004377 microelectronic Methods 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 abstract 1
- 238000005507 spraying Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
- H01B3/085—Particles bound with glass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
1,254,101. Printed circuits. NATIONAL RESEARCH DEVELOPMENT CORP. 15 Nov., 1968 [17 Nov., 1967], No. 52519/67. Heading H1R. [Also in Division C1] A plurality of insulating layers (3, 5, 7) are formed in the construction of a multilayer microelectronic circuit by (i) depositing on a substrate (1-e.g. alumina) an insulating matarial dispersed in an organic carrier liquid, the insulating material consisting of a powdered glaze and at least one particulate refractory oxide having a melting point higher than the working temperature of the glaze, (ii) removing the organic carrier by evaporation, (iii) heating the coated substrate to the working temperature of the glaze to form a glaze layer into which the refractory oxide diffuses, thereby raising the glaze softening temperature, and (iv) repeating steps (i) to (iii) until the desired number of layers are formed. Preferably the heat treatments of all the layers are at substantially the same temperature. The refractory oxide may be Al 2 O 3 , TiO 2 , BeO, ZO 2 , CaO or MgO, and preferably comprises 10-40% by weight of the insulating material. The oxide may have a particle size of 2-30Á. The dispersion may be applied by screen-printing or spraying. The glaze used preferably fuses at 600-1300 C. Conductive layers (2, 4, 6) may be applied by conventional methods using, e.g. gold metallizing paste.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB52519/67A GB1254101A (en) | 1967-11-17 | 1967-11-17 | Improvements in or relating to microcircuit insulation |
NL6816364A NL6816364A (en) | 1967-11-17 | 1968-11-15 | |
JP8358068A JPS5428954B1 (en) | 1967-11-17 | 1968-11-16 | |
DE19681809572 DE1809572A1 (en) | 1967-11-17 | 1968-11-18 | Insulation material containing glaze for the production of electronic microcircuits or a circuit element and process for the production of electronic microcircuits produced using such an insulation material |
US05/424,048 US3950586A (en) | 1967-11-17 | 1973-12-12 | Electrical insulator materials for use in micro-circuit construction |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB52519/67A GB1254101A (en) | 1967-11-17 | 1967-11-17 | Improvements in or relating to microcircuit insulation |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1254101A true GB1254101A (en) | 1971-11-17 |
Family
ID=10464226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB52519/67A Expired GB1254101A (en) | 1967-11-17 | 1967-11-17 | Improvements in or relating to microcircuit insulation |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5428954B1 (en) |
DE (1) | DE1809572A1 (en) |
GB (1) | GB1254101A (en) |
NL (1) | NL6816364A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4237606A (en) * | 1976-08-13 | 1980-12-09 | Fujitsu Limited | Method of manufacturing multilayer ceramic board |
US4445274A (en) * | 1977-12-23 | 1984-05-01 | Ngk Insulators, Ltd. | Method of manufacturing a ceramic structural body |
US4570337A (en) * | 1982-04-19 | 1986-02-18 | Olin Corporation | Method of assembling a chip carrier |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3241225A1 (en) * | 1982-11-09 | 1984-05-10 | F & O Electronic Systems GmbH & Co, 6901 Neckarsteinach | METHOD FOR THE PRODUCTION OF ELECTRONIC SWITCHING ELEMENTS AND / OR CIRCUITS IN MULTILAYER THICK FILM TECHNOLOGY (MULTILAYER THICK FILM TECHNOLOGY) ON A SUBSTRATE AND SWITCHING ELEMENTS MANUFACTURED AND ITS DESIGN |
DE10117061A1 (en) * | 2001-04-05 | 2002-10-10 | Delphi Tech Inc | Electrical connector e.g. for high current equipment in motor vehicles, includes stack of mutually aligned contact elements forming at least one connection section |
JP2003110207A (en) * | 2001-09-28 | 2003-04-11 | Alps Electric Co Ltd | Flexible substrate |
-
1967
- 1967-11-17 GB GB52519/67A patent/GB1254101A/en not_active Expired
-
1968
- 1968-11-15 NL NL6816364A patent/NL6816364A/xx unknown
- 1968-11-16 JP JP8358068A patent/JPS5428954B1/ja active Pending
- 1968-11-18 DE DE19681809572 patent/DE1809572A1/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4237606A (en) * | 1976-08-13 | 1980-12-09 | Fujitsu Limited | Method of manufacturing multilayer ceramic board |
US4445274A (en) * | 1977-12-23 | 1984-05-01 | Ngk Insulators, Ltd. | Method of manufacturing a ceramic structural body |
US4570337A (en) * | 1982-04-19 | 1986-02-18 | Olin Corporation | Method of assembling a chip carrier |
Also Published As
Publication number | Publication date |
---|---|
DE1809572A1 (en) | 1969-10-16 |
NL6816364A (en) | 1969-05-20 |
JPS5428954B1 (en) | 1979-09-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3622384A (en) | Microelectronic circuits and processes for making them | |
US3266661A (en) | Method of applying electro-conductive coatings and resulting article | |
KR930001762A (en) | Method of manufacturing a multilayer electronic circuit | |
US4827083A (en) | Wiring substrate | |
GB1424642A (en) | Layer circuits | |
US2937353A (en) | Photoconductive devices | |
US3576668A (en) | Multilayer thick film ceramic hybrid integrated circuit | |
GB1254101A (en) | Improvements in or relating to microcircuit insulation | |
GB1378520A (en) | Metallising pastes | |
Zhang et al. | Laser direct-write and its application in low temperature Co-fired ceramic (LTCC) technology | |
JPH11251723A (en) | Circuit board | |
US3955023A (en) | Black dielectric mask on white substrate | |
DE102016106178B4 (en) | Method for manufacturing an electronic power module | |
CN101774305B (en) | Thermal head | |
GB1217148A (en) | Improvements in or relating to substrates for microelectronic components | |
CA2000680A1 (en) | Hybrid circuits and thick film dielectrics used therein | |
GB1504097A (en) | Electronic circuit package | |
JPS6030196A (en) | Method of producing multilayer circuit board | |
JPH04198039A (en) | Insulating paste for thick-film circuit | |
JP2733613B2 (en) | Conductive paste and circuit board | |
JPS60117796A (en) | Multilayer circuit board and method of producing same | |
JPH0239878B2 (en) | ||
JPS62247589A (en) | Manufacture of thick film circuit | |
JPS62119951A (en) | Multilayer interconnection substrate | |
JPS55111152A (en) | Method of manufacturing multilayer thin film circuit board |