GB1251340A - - Google Patents

Info

Publication number
GB1251340A
GB1251340A GB1251340DA GB1251340A GB 1251340 A GB1251340 A GB 1251340A GB 1251340D A GB1251340D A GB 1251340DA GB 1251340 A GB1251340 A GB 1251340A
Authority
GB
United Kingdom
Prior art keywords
hydroxide
slurry
weight
polishing
undissolved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1251340A publication Critical patent/GB1251340A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
GB1251340D 1967-10-30 1968-10-11 Expired GB1251340A (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US67924867A 1967-10-30 1967-10-30

Publications (1)

Publication Number Publication Date
GB1251340A true GB1251340A (https=) 1971-10-27

Family

ID=24726155

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1251340D Expired GB1251340A (https=) 1967-10-30 1968-10-11

Country Status (4)

Country Link
US (1) US3552071A (https=)
DE (1) DE1805861A1 (https=)
FR (1) FR1603234A (https=)
GB (1) GB1251340A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4057939A (en) * 1975-12-05 1977-11-15 International Business Machines Corporation Silicon wafer polishing
US6114248A (en) * 1998-01-15 2000-09-05 International Business Machines Corporation Process to reduce localized polish stop erosion
JP4428473B2 (ja) * 1999-01-18 2010-03-10 株式会社東芝 気相法無機酸化物粒子の含水固体状物質及び研磨用スラリーの製造方法

Also Published As

Publication number Publication date
DE1805861A1 (de) 1969-06-26
FR1603234A (https=) 1971-03-22
US3552071A (en) 1971-01-05

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees