FR1603234A - - Google Patents
Info
- Publication number
- FR1603234A FR1603234A FR1603234DA FR1603234A FR 1603234 A FR1603234 A FR 1603234A FR 1603234D A FR1603234D A FR 1603234DA FR 1603234 A FR1603234 A FR 1603234A
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P52/40—Chemomechanical polishing [CMP]
- H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US67924867A | 1967-10-30 | 1967-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR1603234A true FR1603234A (https=) | 1971-03-22 |
Family
ID=24726155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1603234D Expired FR1603234A (https=) | 1967-10-30 | 1968-10-28 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3552071A (https=) |
| DE (1) | DE1805861A1 (https=) |
| FR (1) | FR1603234A (https=) |
| GB (1) | GB1251340A (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4057939A (en) * | 1975-12-05 | 1977-11-15 | International Business Machines Corporation | Silicon wafer polishing |
| US6114248A (en) * | 1998-01-15 | 2000-09-05 | International Business Machines Corporation | Process to reduce localized polish stop erosion |
| JP4428473B2 (ja) * | 1999-01-18 | 2010-03-10 | 株式会社東芝 | 気相法無機酸化物粒子の含水固体状物質及び研磨用スラリーの製造方法 |
-
1967
- 1967-10-30 US US679248A patent/US3552071A/en not_active Expired - Lifetime
-
1968
- 1968-10-11 GB GB1251340D patent/GB1251340A/en not_active Expired
- 1968-10-28 FR FR1603234D patent/FR1603234A/fr not_active Expired
- 1968-10-29 DE DE19681805861 patent/DE1805861A1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE1805861A1 (de) | 1969-06-26 |
| GB1251340A (https=) | 1971-10-27 |
| US3552071A (en) | 1971-01-05 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |