GB1237681A - Electrical printed circuit assemblies - Google Patents

Electrical printed circuit assemblies

Info

Publication number
GB1237681A
GB1237681A GB2079567A GB2079567A GB1237681A GB 1237681 A GB1237681 A GB 1237681A GB 2079567 A GB2079567 A GB 2079567A GB 2079567 A GB2079567 A GB 2079567A GB 1237681 A GB1237681 A GB 1237681A
Authority
GB
United Kingdom
Prior art keywords
frame
ceramic
printed
resistor
tile
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2079567A
Inventor
Peter Henry Wood
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF International UK Ltd
Original Assignee
Lucas Industries Ltd
Joseph Lucas Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Industries Ltd, Joseph Lucas Industries Ltd filed Critical Lucas Industries Ltd
Priority to GB2079567A priority Critical patent/GB1237681A/en
Publication of GB1237681A publication Critical patent/GB1237681A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Products (AREA)

Abstract

1,237,681. Brazing. JOSEPH LUCAS (INDUSTRIES) Ltd. 18 July, 1968 [4 May, 1967], No. 20795/67. Heading B3R. [Also in Division H1] In order to braze together two parts of a printed circuit assembly an electrical resistor is printed adjacent to the interengaging surfaces of the parts so that when a current is passed through the resistor brazing compound between the surfaces melts. A ceramic tile 10 provided with printed conductors 11 has a glass slide 12 carrying capacitors and resistors 13 connected thereto by wires 14. In order to encapsulate the glass slide 12 within an inert atmosphere a ceramic frame 15 is glass bonded to ceramic tile 10 and a ceramic lid 16 is secured to the frame 15 after the mounting of slide 12. The interengaging surfaces of the frame 15 and lid 16 are printed with a copper gold alloy which adheres to the ceramic and a brazing compound such as a tin based solder, gold tin or gold germanium alloy is applied between the surfaces. Lid 16 is printed on its top surface with an electrical resistor 11 having a configuration corresponding to the interengaging surfaces so that when a current is passed through the resistor local heating takes place to effect a seal. The resistor may be provided on the outside surface of the frame 15. Other parts can be joined by the method such as the connection of the glass slide to the tile 10 or the frame 15 to the tile 10.
GB2079567A 1967-05-04 1967-05-04 Electrical printed circuit assemblies Expired GB1237681A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2079567A GB1237681A (en) 1967-05-04 1967-05-04 Electrical printed circuit assemblies

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2079567A GB1237681A (en) 1967-05-04 1967-05-04 Electrical printed circuit assemblies

Publications (1)

Publication Number Publication Date
GB1237681A true GB1237681A (en) 1971-06-30

Family

ID=10151794

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2079567A Expired GB1237681A (en) 1967-05-04 1967-05-04 Electrical printed circuit assemblies

Country Status (1)

Country Link
GB (1) GB1237681A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1722615A3 (en) * 2005-05-10 2008-03-26 Pace Micro Technology PLC A printed circuit board having protection means and a method of use thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1722615A3 (en) * 2005-05-10 2008-03-26 Pace Micro Technology PLC A printed circuit board having protection means and a method of use thereof

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