GB1236148A - Methods of exposing and processing radiation sensitive elements - Google Patents

Methods of exposing and processing radiation sensitive elements

Info

Publication number
GB1236148A
GB1236148A GB44004/69A GB4400469A GB1236148A GB 1236148 A GB1236148 A GB 1236148A GB 44004/69 A GB44004/69 A GB 44004/69A GB 4400469 A GB4400469 A GB 4400469A GB 1236148 A GB1236148 A GB 1236148A
Authority
GB
United Kingdom
Prior art keywords
layer
areas
resistors
reaction
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB44004/69A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teeg Research Inc
Original Assignee
Teeg Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teeg Research Inc filed Critical Teeg Research Inc
Publication of GB1236148A publication Critical patent/GB1236148A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067Etchants
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J19/12Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electromagnetic waves
    • B01J19/122Incoherent waves
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0042Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G03F7/0044Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists involving an interaction between the metallic and non-metallic component, e.g. photodope systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0548Masks
    • H05K2203/056Using an artwork, i.e. a photomask for exposing photosensitive layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1142Conversion of conductive material into insulating material or into dissolvable compound

Abstract

1,236,148. Resistors; capacitors; - circuit assemblies. TEEG RESEARCH Inc. 21 May, 1968 [14 June, 1967], No. 44004/69. Divided out of 1,234,302. Headings H1M, H1R and H1S. [Also in Divisions G2-G3] Resistors are produced by image-wise exposing a photosensitive material comprising a metal layer and a photosensitive layer which on exposure reacts with the metal layer at the boundary thereof to give a product with a resistivity between that of the metal and photosensitive layers. The. amount of reaction is proportional to the exposure and both layers may be completely reacted if there is sufficient exposure. The metal may be silver, copper, lead, columbium, iron, aluminium, chromium or nickel. The other material may:be a mixture of sulphur arsenic and iodine or arsenic, sulphur and bismuth. Alternatively it may be a metal halide arsenide, selenide, telluride, arsenic trisulphide or arsenic pentasulphide and sulphurselenium mixtures or iodine, selenium, tellurium or thallium. To produce a resistor of desired value R x , the metal layer 212 of the photosensitive material 210 is connected via terminals 216 and 218 to a Wheatstone Bridge circuit containing meter 246. The material 210 is exposed to a mask 224 using lights 220 and when sufficient metal has reacted to give resistance R x and the bridge is balanced, meter 246 opens switch 248 cutting off lights 220. Alternatively, resistors may be produced by connecting one terminal to layer 212 and one terminal to layer 214. Capacitors of desired impedance are produced by a similar exposure control, metal layer 212 being coated with a dielectric layer and a further metal layer to which one of the terminals is connected (see Fig. 6, not shown). Printed circuits.-A material comprising photosensitive layer 214, metal layer 212, dielectric layer 260, metal layer 212, and photoconductive layer 214 (if Fig. 12) is exposed on each side to different masks. Side 280 is exposed to mask which causes complete reaction between layers 212 and 214 in areas 282, partial reaction in areas 290 to produce resistors 306 and 308 and no reaction in areas 286 to produce conductive leads connected -to terminals 294, 292 and 296 and to plate 302 of capacitor 304. Side 284 (Fig. 13) is exposed to a mask to produce complete reaction in areas 288, partial reaction in areas 290 to produce resistors 314 and 316, and no reaction in areas 286 to produce conductive leads to terminals 298 and 300 and plate 312 of capacitor 304. The complete printed circuit is shown in Fig. 14. The various resistors, capacitors and circuits are either coated with an opaque shellac or varnish or sheathed in an opaque sheath to prevent exposure of the unexposed or partly exposed areas.
GB44004/69A 1967-06-14 1968-05-21 Methods of exposing and processing radiation sensitive elements Expired GB1236148A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US64610967A 1967-06-14 1967-06-14
US67341067A 1967-10-06 1967-10-06
US70642368A 1968-02-19 1968-02-19

Publications (1)

Publication Number Publication Date
GB1236148A true GB1236148A (en) 1971-06-23

Family

ID=27417763

Family Applications (1)

Application Number Title Priority Date Filing Date
GB44004/69A Expired GB1236148A (en) 1967-06-14 1968-05-21 Methods of exposing and processing radiation sensitive elements

Country Status (1)

Country Link
GB (1) GB1236148A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009034347A3 (en) * 2007-09-13 2009-04-30 Eads Defence And Security Syst Protection of electronic devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009034347A3 (en) * 2007-09-13 2009-04-30 Eads Defence And Security Syst Protection of electronic devices

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