GB1228433A - - Google Patents
Info
- Publication number
- GB1228433A GB1228433A GB1228433DA GB1228433A GB 1228433 A GB1228433 A GB 1228433A GB 1228433D A GB1228433D A GB 1228433DA GB 1228433 A GB1228433 A GB 1228433A
- Authority
- GB
- United Kingdom
- Prior art keywords
- assembly
- conductors
- conductor
- lugs
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Connecting Device With Holders (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Rectifiers (AREA)
Abstract
1,228,433. Semi-conductor devices. SIEMENS A.G. 5 April, 1968 [8 April, 1967; 21 July, 1967], No. 16652/68. Heading H1K. A conductor assembly is formed from sheet metal so that the conductors to be attached to a monocrystalline pn - junction - containing element are formed with lugs which when the element is placed between them grip the element to hold it during the soldering process. A conductor assembly for two rectifiers is shown in Fig. 3. After the elements 1 have been placed in the positions indicated and soldered, insulation may be cast or moulded around the assembly leaving the conductor ends exposed, and the linking web 4 trimmed away. In another assembly (Fig. 4, not shown) five conductors (like 2, 34) are used to hold the four elements of a full wave rectifier. On the side of the assembly opposite to the linking web there is a permanent connecting strap between the outermost conductors so that only four connections need be made to the bridge. Such an assembly may be placed in a plastic housing having slots moulded in the inside of its side walls to receive the outer conductors of the bridge. The housing may be filled with a thermoplastic or thermosetting resin with a silicone content to make it water-impenetrable. The assembly shown in Fig. 7 is also formed from a plane sheet but the central conductor 2 is bent twice to bring its single lugs 21 over the single lugs 30 of the outer conductors 31. Insertion of the semi-conductor elements displaces the conductors from their equilibrium position so that the lugs are resiliently held against the elements. In another variant, Fig. 10, there is little separation between the ends of facing lugs 21, 30 which are bent slightly from the plane containing their conductors 2, 3. The gap is less than the thickness of the semi-conductor elements which when inserted is thus held at an angle between the lugs and cannot drop out. The Specification also describes an assembly for holding and making contact to a three electrode device, a thyristor.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES0109258 | 1967-04-08 | ||
DES0110932 | 1967-07-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1228433A true GB1228433A (en) | 1971-04-15 |
Family
ID=25998764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1228433D Expired GB1228433A (en) | 1967-04-08 | 1968-04-05 |
Country Status (3)
Country | Link |
---|---|
DE (2) | DE1614491A1 (en) |
FR (1) | FR1559493A (en) |
GB (1) | GB1228433A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2940769A1 (en) * | 1979-10-08 | 1981-04-16 | Siemens AG, 1000 Berlin und 8000 München | Contacting of LED with light emitting chip - using complete metallising of chip surfaces for its insertion between anode and cathode which form shanks of metal system support |
DE3106376A1 (en) * | 1981-02-20 | 1982-09-09 | Siemens AG, 1000 Berlin und 8000 München | SEMICONDUCTOR ARRANGEMENT WITH CONNECTING CABLES cut out of sheet metal |
CN107425390B (en) * | 2017-09-20 | 2023-10-10 | 黄山市振亿电子有限公司 | Assembling clamp and assembling method for rectifier bridge electrode and wiring terminal |
-
1967
- 1967-04-08 DE DE19671614491 patent/DE1614491A1/en active Pending
- 1967-07-21 DE DE19671614567 patent/DE1614567C3/en not_active Expired
-
1968
- 1968-04-05 FR FR1559493D patent/FR1559493A/fr not_active Expired
- 1968-04-05 GB GB1228433D patent/GB1228433A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE1614567B2 (en) | 1974-09-12 |
FR1559493A (en) | 1969-03-07 |
DE1614491A1 (en) | 1970-02-26 |
DE1614567A1 (en) | 1970-08-20 |
DE1614567C3 (en) | 1975-04-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PE20 | Patent expired after termination of 20 years |