GB1214733A - A method for the preparation of stannous salt/palladium compositions - Google Patents

A method for the preparation of stannous salt/palladium compositions

Info

Publication number
GB1214733A
GB1214733A GB30369/68A GB3036968A GB1214733A GB 1214733 A GB1214733 A GB 1214733A GB 30369/68 A GB30369/68 A GB 30369/68A GB 3036968 A GB3036968 A GB 3036968A GB 1214733 A GB1214733 A GB 1214733A
Authority
GB
United Kingdom
Prior art keywords
stannous salt
palladium
solution
salt
compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB30369/68A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Publication of GB1214733A publication Critical patent/GB1214733A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

1,214,733. Acidic stannous salt/palladium composition. MACDERMID Inc. 26 June, 1968 [28 June, 1967], No. 30369/68. Heading ClA. [Also in Division C7] Acidic stannous salt/palladium compositions are prepared by dissolving a palladium II salt, suitable PdCl 2 , in HCl and adding a stannous salt, preferably 5nCl 2 , just equivalent to the palladium in solution. The mixture is agitated to completely dissolve the stannous salt and to effect the reduction Pd<SP>2</SP>+ --> Pd‹. A solution of additional stannous salt in HCI, which solution may also contain Na 2 SnO 3 , is added, with stirring to the solution to form a protective colloid for the reduced Pd‹. The reaction may be carried out at room temperature or, if more active compositions are required, at temperatures between 100-120‹ C. In a preferred embodiment the reactants are present in amounts to provide a composition containing 0À05-5À0 g/I. of Pd, 2À5-250 g/1. of Sn= ions, 0À35-35À0 0 g/l. of Ne 2 SnO 3 , HCI and water.
GB30369/68A 1967-06-28 1968-06-26 A method for the preparation of stannous salt/palladium compositions Expired GB1214733A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US65430767A 1967-06-28 1967-06-28

Publications (1)

Publication Number Publication Date
GB1214733A true GB1214733A (en) 1970-12-02

Family

ID=24624315

Family Applications (1)

Application Number Title Priority Date Filing Date
GB30369/68A Expired GB1214733A (en) 1967-06-28 1968-06-26 A method for the preparation of stannous salt/palladium compositions

Country Status (3)

Country Link
US (1) US3532518A (en)
ES (1) ES355956A1 (en)
GB (1) GB1214733A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2422187A1 (en) * 1978-04-04 1979-11-02 Polaroid Corp PROCESS FOR FORMING SILVER PRECIPITATION CORES BY A NOBLE METAL

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US3655433A (en) * 1970-07-06 1972-04-11 Standard Oil Co Platable polymers
US3790400A (en) * 1972-07-24 1974-02-05 Macdermid Inc Preparation of plastic substrates for electroless plating and solutions therefor
US3841881A (en) * 1972-09-13 1974-10-15 Rca Corp Method for electroless deposition of metal using improved colloidal catalyzing solution
US3902908A (en) * 1973-03-21 1975-09-02 Macdermid Inc Catalyst system for activating surfaces prior to electroless deposition
CA1005808A (en) * 1973-06-27 1977-02-22 Shipley Company Inc. Catalyst solution for electroless metal deposition on a substrate
US3915717A (en) * 1973-11-12 1975-10-28 Rca Corp Stabilized autocatalytic metal deposition baths
US4212768A (en) * 1975-05-05 1980-07-15 Jameson Melvin N Electroless plating of nonconductive substrates
US4008343A (en) * 1975-08-15 1977-02-15 Bell Telephone Laboratories, Incorporated Process for electroless plating using colloid sensitization and acid rinse
US4048354A (en) * 1975-10-23 1977-09-13 Nathan Feldstein Method of preparation and use of novel electroless plating catalysts
US4025343A (en) * 1976-01-14 1977-05-24 Polaroid Corporation Image receiving elements comprising stannic oxide polymers having noble metals reduced thereon
ZA764709B (en) * 1976-01-26 1978-02-22 Borg Warner Catalytically active composition for electroless plating
US4100037A (en) * 1976-03-08 1978-07-11 Western Electric Company, Inc. Method of depositing a metal on a surface
US4065316A (en) * 1976-07-19 1977-12-27 Western Electric Company, Incorporated Printing ink
US4181759A (en) * 1976-08-05 1980-01-01 Nathan Feldstein Process for metal deposition of a non-conductor substrate
US4167601A (en) * 1976-11-15 1979-09-11 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
US4073981A (en) * 1977-03-11 1978-02-14 Western Electric Company, Inc. Method of selectively depositing metal on a surface
US4322457A (en) * 1978-01-25 1982-03-30 Western Electric Co., Inc. Method of selectively depositing a metal on a surface
US4381951A (en) * 1978-01-25 1983-05-03 Western Electric Co. Inc. Method of removing contaminants from a surface
US4339476A (en) * 1978-08-17 1982-07-13 Nathan Feldstein Dispersions for activating non-conductors for electroless plating
US4282271A (en) * 1978-08-17 1981-08-04 Nathan Feldstein Dispersions for activating non-conductors for electroless plating
US4318940A (en) * 1978-08-17 1982-03-09 Surface Technology, Inc. Dispersions for activating non-conductors for electroless plating
US4204013A (en) * 1978-10-20 1980-05-20 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine
US4228213A (en) * 1979-08-13 1980-10-14 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
WO1983004268A1 (en) * 1982-05-26 1983-12-08 Macdermid Incorporated Catalyst solutions for activating non-conductive substrates and electroless plating process
US4863758A (en) * 1982-05-26 1989-09-05 Macdermid, Incorporated Catalyst solutions for activating non-conductive substrates and electroless plating process
US4450191A (en) * 1982-09-02 1984-05-22 Omi International Corporation Ammonium ions used as electroless copper plating rate controller
DE3242162A1 (en) * 1982-11-13 1984-05-17 Bayer Ag, 5090 Leverkusen METHOD FOR PRODUCING COMPOSITES
DE3248778A1 (en) * 1982-12-31 1984-07-12 Bayer Ag, 5090 Leverkusen METHOD FOR PRODUCING METALLIZED POROESE SOLIDS
US4759952A (en) * 1984-01-26 1988-07-26 Learonal, Inc. Process for printed circuit board manufacture
US4847114A (en) * 1984-01-26 1989-07-11 Learonal, Inc. Preparation of printed circuit boards by selective metallization
US4761304A (en) * 1984-01-26 1988-08-02 Learonal, Inc. Process for printed circuit board manufacture
US4593016A (en) * 1985-02-14 1986-06-03 International Business Machines Corporation Process for manufacturing a concentrate of a palladium-tin colloidal catalyst
US4749626A (en) * 1985-08-05 1988-06-07 Olin Corporation Whisker resistant tin coatings and baths and methods for making such coatings
US4820643A (en) * 1986-03-10 1989-04-11 International Business Machines Corporation Process for determining the activity of a palladium-tin catalyst
US4717421A (en) * 1986-04-28 1988-01-05 Mcgean-Rohco, Inc. Solid tin-palladium catalyst for electroless deposition incorporating stannous salts of organic acids
JP2615804B2 (en) 1988-04-14 1997-06-04 日本電気株式会社 Manufacturing method of magnetic recording medium
US5147692A (en) * 1990-05-08 1992-09-15 Macdermid, Incorporated Electroless plating of nickel onto surfaces such as copper or fused tungston
US5328561A (en) * 1992-07-10 1994-07-12 Macdermid Incorporated Microetchant for copper surfaces and processes for using same
US5368718A (en) * 1993-09-13 1994-11-29 Enthone-Omi, Inc. Electrowinning of direct metallization accelerators
US5545429A (en) * 1994-07-01 1996-08-13 International Business Machines Corporation Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess
DE19524601C1 (en) * 1995-07-06 1996-03-21 Deutsche Automobilgesellsch Activating porous plastic surfaces for chemical metallisation
US5648125A (en) * 1995-11-16 1997-07-15 Cane; Frank N. Electroless plating process for the manufacture of printed circuit boards
DE19630581A1 (en) * 1996-07-30 1998-02-05 Studiengesellschaft Kohle Mbh Process for the production of solvent-stabilized metal colloids and carrier-fixed metal clusters
US5792248A (en) * 1996-10-16 1998-08-11 Fidelity Chemical Products Corporation, A Division Of Auric Corporation Sensitizing solution
US5770032A (en) * 1996-10-16 1998-06-23 Fidelity Chemical Products Corporation Metallizing process
DE10024239C1 (en) * 2000-05-15 2001-09-20 Atotech Deutschland Gmbh Process for galvanically treating workpieces used e.g. in the production of circuit boards comprises contacting the workpieces with a palladium colloidal solution, and recovering the solution after use
KR20020061530A (en) * 2001-01-18 2002-07-24 쉬플리 캄파니, 엘.엘.씨. A method for recovering catalytic metals
US6586047B2 (en) 2001-09-05 2003-07-01 Brad Durkin Process for plating particulate matter
US6645557B2 (en) 2001-10-17 2003-11-11 Atotech Deutschland Gmbh Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions
DE60209095T2 (en) 2001-11-21 2006-08-17 Shipley Co., L.L.C., Marlborough Process for recovering catalytic metals
DE60201404T2 (en) * 2001-11-21 2005-03-10 Shipley Co., L.L.C., Marlborough Process for the recovery of catalyst metals using a porous metal filter
US20050016416A1 (en) * 2003-07-23 2005-01-27 Jon Bengston Stabilizer for electroless copper plating solution
JP4729108B2 (en) * 2007-02-07 2011-07-20 株式会社きもと Electroless plating forming material, catalyst adhesion coating solution, electroless plating forming method, and plating method
US20090056994A1 (en) * 2007-08-31 2009-03-05 Kuhr Werner G Methods of Treating a Surface to Promote Metal Plating and Devices Formed
WO2009029871A1 (en) * 2007-08-31 2009-03-05 Zettacore, Inc. Methods of treating a surface to promote binding of molecule(s) of interest, coatings and devices formed therefrom
US20090238979A1 (en) * 2008-03-21 2009-09-24 William Decesare Method of Applying Catalytic Solution for Use in Electroless Deposition
EP2591645B1 (en) 2010-07-06 2018-09-05 Namics Corporation Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards

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US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2422187A1 (en) * 1978-04-04 1979-11-02 Polaroid Corp PROCESS FOR FORMING SILVER PRECIPITATION CORES BY A NOBLE METAL

Also Published As

Publication number Publication date
ES355956A1 (en) 1970-02-16
US3532518A (en) 1970-10-06

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PE20 Patent expired after termination of 20 years