GB1209141A - Improvements in and relating to transistors - Google Patents

Improvements in and relating to transistors

Info

Publication number
GB1209141A
GB1209141A GB47535/66A GB4753566A GB1209141A GB 1209141 A GB1209141 A GB 1209141A GB 47535/66 A GB47535/66 A GB 47535/66A GB 4753566 A GB4753566 A GB 4753566A GB 1209141 A GB1209141 A GB 1209141A
Authority
GB
United Kingdom
Prior art keywords
base
collector
region
layer
oct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB47535/66A
Other languages
English (en)
Inventor
Wolfgang Franz Joseph Edlinger
Leonard Peter Morgan
James Gilbert Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASSOCIATED SEMICONDUCTOR MFT
Original Assignee
ASSOCIATED SEMICONDUCTOR MFT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASSOCIATED SEMICONDUCTOR MFT filed Critical ASSOCIATED SEMICONDUCTOR MFT
Priority to GB47535/66A priority Critical patent/GB1209141A/en
Priority to SE14408/67A priority patent/SE319239B/xx
Priority to BE705522D priority patent/BE705522A/xx
Priority to CH1477367A priority patent/CH487507A/de
Priority to BR194091/67A priority patent/BR6794091D0/pt
Priority to NL6714395A priority patent/NL6714395A/xx
Priority to FR1548545D priority patent/FR1548545A/fr
Priority to DE19671614287 priority patent/DE1614287A1/de
Publication of GB1209141A publication Critical patent/GB1209141A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00—Bipolar junction transistors [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
GB47535/66A 1966-10-24 1966-10-24 Improvements in and relating to transistors Expired GB1209141A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
GB47535/66A GB1209141A (en) 1966-10-24 1966-10-24 Improvements in and relating to transistors
SE14408/67A SE319239B (enrdf_load_stackoverflow) 1966-10-24 1967-10-20
BE705522D BE705522A (enrdf_load_stackoverflow) 1966-10-24 1967-10-23
CH1477367A CH487507A (de) 1966-10-24 1967-10-23 Transistor
BR194091/67A BR6794091D0 (pt) 1966-10-24 1967-10-23 Aperfeicoamentos em ou relativos a transistores
NL6714395A NL6714395A (enrdf_load_stackoverflow) 1966-10-24 1967-10-24
FR1548545D FR1548545A (enrdf_load_stackoverflow) 1966-10-24 1967-10-24
DE19671614287 DE1614287A1 (de) 1966-10-24 1967-10-24 Transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB47535/66A GB1209141A (en) 1966-10-24 1966-10-24 Improvements in and relating to transistors

Publications (1)

Publication Number Publication Date
GB1209141A true GB1209141A (en) 1970-10-21

Family

ID=10445329

Family Applications (1)

Application Number Title Priority Date Filing Date
GB47535/66A Expired GB1209141A (en) 1966-10-24 1966-10-24 Improvements in and relating to transistors

Country Status (8)

Country Link
BE (1) BE705522A (enrdf_load_stackoverflow)
BR (1) BR6794091D0 (enrdf_load_stackoverflow)
CH (1) CH487507A (enrdf_load_stackoverflow)
DE (1) DE1614287A1 (enrdf_load_stackoverflow)
FR (1) FR1548545A (enrdf_load_stackoverflow)
GB (1) GB1209141A (enrdf_load_stackoverflow)
NL (1) NL6714395A (enrdf_load_stackoverflow)
SE (1) SE319239B (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
CH487507A (de) 1970-03-15
DE1614287A1 (de) 1970-06-25
BR6794091D0 (pt) 1973-01-11
NL6714395A (enrdf_load_stackoverflow) 1968-04-25
SE319239B (enrdf_load_stackoverflow) 1970-01-12
FR1548545A (enrdf_load_stackoverflow) 1968-12-06
BE705522A (enrdf_load_stackoverflow) 1968-04-23

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee