GB1195547A - Improvements in or relating to Luminescent Diodes - Google Patents

Improvements in or relating to Luminescent Diodes

Info

Publication number
GB1195547A
GB1195547A GB5068667A GB5068667A GB1195547A GB 1195547 A GB1195547 A GB 1195547A GB 5068667 A GB5068667 A GB 5068667A GB 5068667 A GB5068667 A GB 5068667A GB 1195547 A GB1195547 A GB 1195547A
Authority
GB
United Kingdom
Prior art keywords
zone
exit surface
focal point
diode
nov
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5068667A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of GB1195547A publication Critical patent/GB1195547A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46Reflective coating, e.g. dielectric Bragg reflector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/24Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Optical Elements Other Than Lenses (AREA)

Abstract

1,195,547. Electroluminescence. SIEMENS A.G. 8 Nov., 1967 [9 Nov., 1966], No. 50686/67. Heading C4S. [Also in Division H1] A luminescent diode comprises a carrier crystal body, e.g. an A<SP>m</SP>B<SP>V</SP> material preferably of n-type GaAs, with a first part 4 of the surface of one zone 1 shaped to form a concave reflector, and with a metal layer 6 of good reflectivity, heat-conductivity and electrical conductivity, the remaining surface part 5 forming the radiation exit surface and provided with a reflection reducing coating. Layer 6 may be of Ag, Cu, Al or an alloy. Surface 4 may be part of a paraboloid (Figs. 1, 2 and 3, not shown); an ellipsoid optionally with P-N junction 3 in the vicinity of focal point F, Fig. 5 (and Fig. 4, not shown); or a sphere with the P-N junction between the sphere centre and the reflector surface (Figs. 6 and 7, not shown). Exit surface 5 may be plane or curved to at least partially focus the radiation, e.g. in Fig. 5 the spherical exit surface is confocal to focal point F 2 and in Fig. 3 the convex exit surface radius of curvature is less than the distance from focal point F to the exit surface. In Fig. 6 (not shown), zone 2 of the P-N diode is at the centre of the flat exit surface. Axial drilling along the axis A from either direction may be effected by electron, ion or laser beams, or gas or liquid jets while zone 2 may be produced by alloying, diffusion, or focused ion beam bombardment. Surface 4 may be polished before layer 6 is provided. The diode electrodes are contacted via terminal E 1 to coating 6 and terminal E 2 to zone 2 by a wire alloyed or in pressure contact with zone 2.
GB5068667A 1966-11-09 1967-11-08 Improvements in or relating to Luminescent Diodes Expired GB1195547A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0106907 1966-11-09

Publications (1)

Publication Number Publication Date
GB1195547A true GB1195547A (en) 1970-06-17

Family

ID=7527729

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5068667A Expired GB1195547A (en) 1966-11-09 1967-11-08 Improvements in or relating to Luminescent Diodes

Country Status (6)

Country Link
AT (1) AT274914B (en)
CH (1) CH474201A (en)
DE (1) DE1539564A1 (en)
GB (1) GB1195547A (en)
NL (1) NL6710636A (en)
SE (1) SE342383B (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4942290A (en) * 1972-03-03 1974-04-20
JPS49149679U (en) * 1973-04-27 1974-12-25
JPS504990A (en) * 1973-05-16 1975-01-20
JPS5133171Y1 (en) * 1970-12-26 1976-08-17
JPS5372483U (en) * 1977-10-20 1978-06-17
US5175783A (en) * 1990-04-03 1992-12-29 Sumitomo Electric Industries, Ltd. Optical molded device including two lenses and active element integrally
EP1427027A1 (en) * 2001-08-13 2004-06-09 Josuke Nakata Semiconductor device and method of its manufacture
WO2005048362A1 (en) * 2003-11-04 2005-05-26 3M Innovative Properties Company Side reflector for illumination using light emitting diode
EP1744375A1 (en) * 2005-07-14 2007-01-17 Osram Opto Semiconductors GmbH Optoelectronic chip and process for its manufacture
US7214557B2 (en) 2003-10-24 2007-05-08 Kyosemi Corporation Light receiving or light emitting modular sheet and process for producing the same
US7220997B2 (en) 2002-06-21 2007-05-22 Josuke Nakata Light receiving or light emitting device and itsd production method
US7238966B2 (en) 2002-05-02 2007-07-03 Josuke Nakata Light-receiving panel or light-emitting panel, and manufacturing method thereof
US7244998B2 (en) 2001-08-13 2007-07-17 Josuke Nakata Light-emitting or light-receiving semiconductor module and method of its manufacture
US7378757B2 (en) 2003-06-09 2008-05-27 Kyosemi Corporation Power generation system
US7387400B2 (en) 2003-04-21 2008-06-17 Kyosemi Corporation Light-emitting device with spherical photoelectric converting element
US7602035B2 (en) 2001-10-19 2009-10-13 Josuke Nakata Light emitting or light receiving semiconductor module and method for manufacturing same
EP3297044A1 (en) * 2016-09-19 2018-03-21 Nick Shepherd Improved led emitter, led emitter array and method for manufacturing the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4698730A (en) * 1986-08-01 1987-10-06 Stanley Electric Co., Ltd. Light-emitting diode
DE19924316B4 (en) * 1999-05-27 2010-10-07 Zumtobel Lighting Gmbh emitting diode

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5133171Y1 (en) * 1970-12-26 1976-08-17
JPS4942290A (en) * 1972-03-03 1974-04-20
JPS49149679U (en) * 1973-04-27 1974-12-25
JPS504990A (en) * 1973-05-16 1975-01-20
JPS5418906B2 (en) * 1973-05-16 1979-07-11
JPS5372483U (en) * 1977-10-20 1978-06-17
JPS54774Y2 (en) * 1977-10-20 1979-01-16
US5175783A (en) * 1990-04-03 1992-12-29 Sumitomo Electric Industries, Ltd. Optical molded device including two lenses and active element integrally
EP1427027A4 (en) * 2001-08-13 2006-12-20 Josuke Nakata Semiconductor device and method of its manufacture
EP1427027A1 (en) * 2001-08-13 2004-06-09 Josuke Nakata Semiconductor device and method of its manufacture
US7244998B2 (en) 2001-08-13 2007-07-17 Josuke Nakata Light-emitting or light-receiving semiconductor module and method of its manufacture
US7238968B2 (en) 2001-08-13 2007-07-03 Josuke Nakata Semiconductor device and method of making the same
US7602035B2 (en) 2001-10-19 2009-10-13 Josuke Nakata Light emitting or light receiving semiconductor module and method for manufacturing same
US7238966B2 (en) 2002-05-02 2007-07-03 Josuke Nakata Light-receiving panel or light-emitting panel, and manufacturing method thereof
US7220997B2 (en) 2002-06-21 2007-05-22 Josuke Nakata Light receiving or light emitting device and itsd production method
US7387400B2 (en) 2003-04-21 2008-06-17 Kyosemi Corporation Light-emitting device with spherical photoelectric converting element
US7378757B2 (en) 2003-06-09 2008-05-27 Kyosemi Corporation Power generation system
US7214557B2 (en) 2003-10-24 2007-05-08 Kyosemi Corporation Light receiving or light emitting modular sheet and process for producing the same
WO2005048362A1 (en) * 2003-11-04 2005-05-26 3M Innovative Properties Company Side reflector for illumination using light emitting diode
EP1744375A1 (en) * 2005-07-14 2007-01-17 Osram Opto Semiconductors GmbH Optoelectronic chip and process for its manufacture
US7663150B2 (en) 2005-07-14 2010-02-16 Osram Opto Semiconductors Gmbh Optoelectronic chip
EP3297044A1 (en) * 2016-09-19 2018-03-21 Nick Shepherd Improved led emitter, led emitter array and method for manufacturing the same

Also Published As

Publication number Publication date
NL6710636A (en) 1968-05-10
CH474201A (en) 1969-06-15
DE1539564A1 (en) 1969-12-11
SE342383B (en) 1972-01-31
AT274914B (en) 1969-10-10

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees