GB1195330A - Electroless Copper Plating - Google Patents

Electroless Copper Plating

Info

Publication number
GB1195330A
GB1195330A GB58920/68A GB5892068A GB1195330A GB 1195330 A GB1195330 A GB 1195330A GB 58920/68 A GB58920/68 A GB 58920/68A GB 5892068 A GB5892068 A GB 5892068A GB 1195330 A GB1195330 A GB 1195330A
Authority
GB
United Kingdom
Prior art keywords
copper plating
electroless copper
solution contains
methyldichlorosilane
hcho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB58920/68A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Publication of GB1195330A publication Critical patent/GB1195330A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
GB58920/68A 1968-01-05 1968-12-11 Electroless Copper Plating Expired GB1195330A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69586068A 1968-01-05 1968-01-05

Publications (1)

Publication Number Publication Date
GB1195330A true GB1195330A (en) 1970-06-17

Family

ID=24794740

Family Applications (1)

Application Number Title Priority Date Filing Date
GB58920/68A Expired GB1195330A (en) 1968-01-05 1968-12-11 Electroless Copper Plating

Country Status (7)

Country Link
US (1) US3475186A (lv)
BE (1) BE726182A (lv)
DE (1) DE1900442B2 (lv)
FR (1) FR1599501A (lv)
GB (1) GB1195330A (lv)
NL (1) NL139095B (lv)
SE (1) SE345144B (lv)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615733A (en) * 1968-08-13 1971-10-26 Shipley Co Electroless copper plating
US3615735A (en) * 1968-08-13 1971-10-26 Shipley Co Electroless copper plating
US3765936A (en) * 1968-08-13 1973-10-16 Shipley Co Electroless copper plate
US3978252A (en) * 1973-03-23 1976-08-31 Macdermid Incorporated Method of improving the adhesion between a molded resin substrate and a metal film deposited thereon
US4167601A (en) * 1976-11-15 1979-09-11 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
US4228213A (en) * 1979-08-13 1980-10-14 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
US4563217A (en) * 1983-07-25 1986-01-07 Hitachi, Ltd. Electroless copper plating solution
US4969842A (en) * 1989-11-30 1990-11-13 Amp Incorporated Molded electrical connector having integral spring contact beams
US20090206526A1 (en) 2008-02-18 2009-08-20 Huntsman Petrochemical Corporation Sintering aids

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating
GB1089317A (en) * 1965-06-19 1967-11-01 Asahi Dow Ltd An electroless copper plating bath

Also Published As

Publication number Publication date
BE726182A (lv) 1969-06-27
US3475186A (en) 1969-10-28
DE1900442B2 (de) 1971-09-09
NL6900088A (lv) 1969-07-08
DE1900442A1 (de) 1969-11-20
FR1599501A (lv) 1970-07-15
SE345144B (lv) 1972-05-15
NL139095B (nl) 1973-06-15

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee