GB1194112A - Improvements in Methods of Manufacturing Printed Circuits - Google Patents

Improvements in Methods of Manufacturing Printed Circuits

Info

Publication number
GB1194112A
GB1194112A GB2155268A GB2155268A GB1194112A GB 1194112 A GB1194112 A GB 1194112A GB 2155268 A GB2155268 A GB 2155268A GB 2155268 A GB2155268 A GB 2155268A GB 1194112 A GB1194112 A GB 1194112A
Authority
GB
United Kingdom
Prior art keywords
substrate
pattern
areas
pyrolyzate
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2155268A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1194112A publication Critical patent/GB1194112A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1136—Conversion of insulating material into conductive material, e.g. by pyrolysis

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
GB2155268A 1967-05-29 1968-05-07 Improvements in Methods of Manufacturing Printed Circuits Expired GB1194112A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US64198567A 1967-05-29 1967-05-29

Publications (1)

Publication Number Publication Date
GB1194112A true GB1194112A (en) 1970-06-10

Family

ID=24574674

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2155268A Expired GB1194112A (en) 1967-05-29 1968-05-07 Improvements in Methods of Manufacturing Printed Circuits

Country Status (3)

Country Link
DE (1) DE1765484A1 (cg-RX-API-DMAC7.html)
FR (1) FR1583800A (cg-RX-API-DMAC7.html)
GB (1) GB1194112A (cg-RX-API-DMAC7.html)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2425790A1 (fr) * 1978-05-08 1979-12-07 Limours Const Meca Elect El Perfectionnements aux circuits imprimes et a leurs procedes de fabrication
GB2287472A (en) * 1994-03-15 1995-09-20 Univ Singapore Selective metallisation of insulating substrates by printing surface with carbon-based ink catalyst and electroless and electrolytic plating
WO2002023962A3 (en) * 2000-09-18 2002-06-13 A L T Advanced Laser Technolog Method for the formation of a pattern on an insulating substrate
US20120152745A1 (en) * 2010-12-17 2012-06-21 Jason Cecil William Corbett Laser doppler electrophoresis using a diffusion barrier
US10648945B2 (en) 2010-12-17 2020-05-12 Malvern Panalytical Limited Laser doppler electrophoresis using a diffusion barrier
WO2025034396A1 (en) * 2023-08-08 2025-02-13 E Ink Corporation Backplanes for segmented electro-optic displays and methods of manufacturing same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009018350A1 (de) * 2009-04-23 2010-10-28 Aimes Gmbh Umwandlungsvorrichtung zum Umwandeln von Biomasse in Kohlenwasserstoffverbindungen, Verfahren zum wenigstens teilweisen Umwandeln von Biomasse in Kohlenwasserstoffverbindungen, Nutzgas und Feststoff, sowie Verfahren zum wenigstens teilweisen Umwandeln von kontaminierten Stoffen in CO2

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2425790A1 (fr) * 1978-05-08 1979-12-07 Limours Const Meca Elect El Perfectionnements aux circuits imprimes et a leurs procedes de fabrication
GB2287472A (en) * 1994-03-15 1995-09-20 Univ Singapore Selective metallisation of insulating substrates by printing surface with carbon-based ink catalyst and electroless and electrolytic plating
WO2002023962A3 (en) * 2000-09-18 2002-06-13 A L T Advanced Laser Technolog Method for the formation of a pattern on an insulating substrate
US20120152745A1 (en) * 2010-12-17 2012-06-21 Jason Cecil William Corbett Laser doppler electrophoresis using a diffusion barrier
US8702942B2 (en) * 2010-12-17 2014-04-22 Malvern Instruments, Ltd. Laser doppler electrophoresis using a diffusion barrier
US10648945B2 (en) 2010-12-17 2020-05-12 Malvern Panalytical Limited Laser doppler electrophoresis using a diffusion barrier
US11988631B2 (en) 2010-12-17 2024-05-21 Malvern Panalytical Limited Laser doppler electrophoresis using a diffusion barrier
WO2025034396A1 (en) * 2023-08-08 2025-02-13 E Ink Corporation Backplanes for segmented electro-optic displays and methods of manufacturing same

Also Published As

Publication number Publication date
DE1765484A1 (de) 1971-07-29
FR1583800A (cg-RX-API-DMAC7.html) 1969-10-27

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee