GB1178745A - Improvements in and relating to Multilayer Circuit Structures - Google Patents
Improvements in and relating to Multilayer Circuit StructuresInfo
- Publication number
- GB1178745A GB1178745A GB00554/67A GB1055467A GB1178745A GB 1178745 A GB1178745 A GB 1178745A GB 00554/67 A GB00554/67 A GB 00554/67A GB 1055467 A GB1055467 A GB 1055467A GB 1178745 A GB1178745 A GB 1178745A
- Authority
- GB
- United Kingdom
- Prior art keywords
- sheets
- metal
- paste
- filled
- zaep
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 abstract 7
- 239000002184 metal Substances 0.000 abstract 7
- 229910017309 Mo—Mn Inorganic materials 0.000 abstract 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 abstract 2
- 239000000919 ceramic Substances 0.000 abstract 2
- 238000007654 immersion Methods 0.000 abstract 2
- 150000002736 metal compounds Chemical class 0.000 abstract 2
- 150000002739 metals Chemical class 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 229910052726 zirconium Inorganic materials 0.000 abstract 2
- 239000001856 Ethyl cellulose Substances 0.000 abstract 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 abstract 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 abstract 1
- 239000011230 binding agent Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 229920001249 ethyl cellulose Polymers 0.000 abstract 1
- 235000019325 ethyl cellulose Nutrition 0.000 abstract 1
- 238000010304 firing Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000003801 milling Methods 0.000 abstract 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract 1
- 229910052573 porcelain Inorganic materials 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000012255 powdered metal Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 238000005245 sintering Methods 0.000 abstract 1
- 239000002002 slurry Substances 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 229910052715 tantalum Inorganic materials 0.000 abstract 1
- 229910052719 titanium Inorganic materials 0.000 abstract 1
- 229910052721 tungsten Inorganic materials 0.000 abstract 1
- 238000009736 wetting Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/302—Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Conductive Materials (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US53877066A | 1966-03-30 | 1966-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1178745A true GB1178745A (en) | 1970-01-21 |
Family
ID=24148353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB00554/67A Expired GB1178745A (en) | 1966-03-30 | 1967-03-07 | Improvements in and relating to Multilayer Circuit Structures |
Country Status (8)
| Country | Link |
|---|---|
| BE (1) | BE694305A (forum.php) |
| CH (1) | CH452016A (forum.php) |
| DE (1) | DE1301378B (forum.php) |
| ES (1) | ES338549A1 (forum.php) |
| FR (1) | FR1512995A (forum.php) |
| GB (1) | GB1178745A (forum.php) |
| NL (1) | NL144473B (forum.php) |
| SE (1) | SE337856B (forum.php) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2568053A1 (fr) * | 1984-07-23 | 1986-01-24 | Avx Corp | Procede de fabrication d'un condensateur ceramique multicouche et condensateur ainsi obtenu |
| GB2242784A (en) * | 1990-04-07 | 1991-10-09 | Korea Inst Sci & Tech | Method for manufacturing multilayer ceramic capacitor |
| WO2007061448A3 (en) * | 2005-05-18 | 2008-08-28 | Harvard College | Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks |
| WO2013120908A1 (en) * | 2012-02-17 | 2013-08-22 | Sony Dadc Austria Ag | Microstructured polymer devices |
| CN109511218A (zh) * | 2018-12-16 | 2019-03-22 | 天津荣事顺发电子有限公司 | 一种多层陶瓷电路板制备方法 |
| CN119070140A (zh) * | 2024-08-28 | 2024-12-03 | 成都国光电气股份有限公司 | 爆炸箔起爆系统平面开关的制备工艺 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL169260C (nl) * | 1971-04-16 | 1982-06-16 | Tam Ceramics Inc | Werkwijze om gesinterde keramische voorwerpen te vervaardigen, welke geleiders bevatten. |
| DE2306236C2 (de) * | 1973-02-08 | 1982-11-25 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung von Schichtschaltungen mit leitenden Schichten auf beiden Seiten eines Keramiksubstrates |
| US3999004A (en) * | 1974-09-27 | 1976-12-21 | International Business Machines Corporation | Multilayer ceramic substrate structure |
| GB2103422B (en) * | 1981-07-30 | 1985-02-27 | Standard Telephones Cables Ltd | Ceramic capacitors |
| EP0089550A3 (de) * | 1982-03-19 | 1984-09-26 | DRALORIC Electronic GmbH | Monolithischer Kondensator und Verfahren zu seiner Herstellung |
| JP2579937B2 (ja) * | 1987-04-15 | 1997-02-12 | 株式会社東芝 | 電子回路装置およびその製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE631489A (forum.php) * | 1962-04-27 |
-
1967
- 1967-02-17 DE DEJ33027A patent/DE1301378B/de active Pending
- 1967-02-20 BE BE694305D patent/BE694305A/xx not_active IP Right Cessation
- 1967-02-22 FR FR8376A patent/FR1512995A/fr not_active Expired
- 1967-03-07 GB GB00554/67A patent/GB1178745A/en not_active Expired
- 1967-03-15 CH CH379667A patent/CH452016A/de unknown
- 1967-03-28 ES ES338549A patent/ES338549A1/es not_active Expired
- 1967-03-30 SE SE04423/67A patent/SE337856B/xx unknown
- 1967-03-30 NL NL676704510A patent/NL144473B/xx not_active IP Right Cessation
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2568053A1 (fr) * | 1984-07-23 | 1986-01-24 | Avx Corp | Procede de fabrication d'un condensateur ceramique multicouche et condensateur ainsi obtenu |
| US4584629A (en) * | 1984-07-23 | 1986-04-22 | Avx Corporation | Method of making ceramic capacitor and resulting article |
| GB2242784A (en) * | 1990-04-07 | 1991-10-09 | Korea Inst Sci & Tech | Method for manufacturing multilayer ceramic capacitor |
| GB2242784B (en) * | 1990-04-07 | 1994-08-24 | Korea Inst Sci & Tech | Method for manufacturing multilayer ceramic capacitor |
| WO2007061448A3 (en) * | 2005-05-18 | 2008-08-28 | Harvard College | Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks |
| WO2013120908A1 (en) * | 2012-02-17 | 2013-08-22 | Sony Dadc Austria Ag | Microstructured polymer devices |
| US9823221B2 (en) | 2012-02-17 | 2017-11-21 | STRATEC CONSUMABLES GmbH | Microstructured polymer devices |
| CN109511218A (zh) * | 2018-12-16 | 2019-03-22 | 天津荣事顺发电子有限公司 | 一种多层陶瓷电路板制备方法 |
| CN119070140A (zh) * | 2024-08-28 | 2024-12-03 | 成都国光电气股份有限公司 | 爆炸箔起爆系统平面开关的制备工艺 |
Also Published As
| Publication number | Publication date |
|---|---|
| FR1512995A (fr) | 1968-02-09 |
| NL144473B (nl) | 1974-12-16 |
| BE694305A (forum.php) | 1967-07-31 |
| DE1301378B (de) | 1969-08-21 |
| CH452016A (de) | 1968-05-15 |
| SE337856B (forum.php) | 1971-08-23 |
| ES338549A1 (es) | 1968-04-01 |
| NL6704510A (forum.php) | 1967-10-02 |
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