GB1166659A - A method of Forming Metallic Patterns on Substrate Bodies - Google Patents

A method of Forming Metallic Patterns on Substrate Bodies

Info

Publication number
GB1166659A
GB1166659A GB50643/66A GB5064366A GB1166659A GB 1166659 A GB1166659 A GB 1166659A GB 50643/66 A GB50643/66 A GB 50643/66A GB 5064366 A GB5064366 A GB 5064366A GB 1166659 A GB1166659 A GB 1166659A
Authority
GB
United Kingdom
Prior art keywords
platinum
layer
titanium
oxide
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB50643/66A
Other languages
English (en)
Inventor
Joseph Martin Szabo Jr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB1166659A publication Critical patent/GB1166659A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Die Bonding (AREA)
  • Weting (AREA)
  • Bipolar Transistors (AREA)
GB50643/66A 1965-12-07 1966-11-11 A method of Forming Metallic Patterns on Substrate Bodies Expired GB1166659A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US512045A US3388048A (en) 1965-12-07 1965-12-07 Fabrication of beam lead semiconductor devices

Publications (1)

Publication Number Publication Date
GB1166659A true GB1166659A (en) 1969-10-08

Family

ID=24037447

Family Applications (1)

Application Number Title Priority Date Filing Date
GB50643/66A Expired GB1166659A (en) 1965-12-07 1966-11-11 A method of Forming Metallic Patterns on Substrate Bodies

Country Status (11)

Country Link
US (1) US3388048A (https=)
AT (1) AT266219B (https=)
BE (1) BE690534A (https=)
CH (1) CH455945A (https=)
DE (1) DE1589076C3 (https=)
ES (1) ES334684A1 (https=)
FR (1) FR1504176A (https=)
GB (1) GB1166659A (https=)
IL (1) IL26908A (https=)
NL (1) NL6617128A (https=)
SE (1) SE325336B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991014288A1 (en) * 1990-03-07 1991-09-19 Santa Barbara Research Center Magnetoresistor structure and operating method
CN111945128A (zh) * 2020-08-18 2020-11-17 江苏能华微电子科技发展有限公司 一种提高铂与衬底黏附性的方法及其产品

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3506887A (en) * 1966-02-23 1970-04-14 Motorola Inc Semiconductor device and method of making same
GB1175667A (en) * 1966-04-07 1969-12-23 Associated Semiconductor Mft Improvements in the Electrodeposition of Metals using a Composite Mask
US3537175A (en) * 1966-11-09 1970-11-03 Advalloy Inc Lead frame for semiconductor devices and method for making same
US3507756A (en) * 1967-08-04 1970-04-21 Bell Telephone Labor Inc Method of fabricating semiconductor device contact
US3658489A (en) * 1968-08-09 1972-04-25 Nippon Electric Co Laminated electrode for a semiconductor device
US3620932A (en) * 1969-05-05 1971-11-16 Trw Semiconductors Inc Beam leads and method of fabrication
US3708403A (en) * 1971-09-01 1973-01-02 L Terry Self-aligning electroplating mask
US3926747A (en) * 1974-02-19 1975-12-16 Bell Telephone Labor Inc Selective electrodeposition of gold on electronic devices
US4011144A (en) * 1975-12-22 1977-03-08 Western Electric Company Methods of forming metallization patterns on beam lead semiconductor devices
US4988412A (en) * 1988-12-27 1991-01-29 General Electric Company Selective electrolytic desposition on conductive and non-conductive substrates

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3287612A (en) * 1963-12-17 1966-11-22 Bell Telephone Labor Inc Semiconductor contacts and protective coatings for planar devices
US3325379A (en) * 1962-05-22 1967-06-13 Hazeltine Research Inc Method of making metallic patterns having continuous interconnections
NL134170C (https=) * 1963-12-17 1900-01-01
US3274670A (en) * 1965-03-18 1966-09-27 Bell Telephone Labor Inc Semiconductor contact

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991014288A1 (en) * 1990-03-07 1991-09-19 Santa Barbara Research Center Magnetoresistor structure and operating method
CN111945128A (zh) * 2020-08-18 2020-11-17 江苏能华微电子科技发展有限公司 一种提高铂与衬底黏附性的方法及其产品

Also Published As

Publication number Publication date
FR1504176A (fr) 1967-12-01
NL6617128A (https=) 1967-06-08
SE325336B (https=) 1970-06-29
ES334684A1 (es) 1967-11-01
US3388048A (en) 1968-06-11
BE690534A (https=) 1967-05-16
DE1589076B2 (de) 1975-05-22
DE1589076C3 (de) 1980-11-06
IL26908A (en) 1970-11-30
AT266219B (de) 1968-11-11
DE1589076A1 (de) 1970-03-19
CH455945A (de) 1968-05-15

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PE Patent expired