GB1166659A - A method of Forming Metallic Patterns on Substrate Bodies - Google Patents
A method of Forming Metallic Patterns on Substrate BodiesInfo
- Publication number
- GB1166659A GB1166659A GB50643/66A GB5064366A GB1166659A GB 1166659 A GB1166659 A GB 1166659A GB 50643/66 A GB50643/66 A GB 50643/66A GB 5064366 A GB5064366 A GB 5064366A GB 1166659 A GB1166659 A GB 1166659A
- Authority
- GB
- United Kingdom
- Prior art keywords
- platinum
- layer
- titanium
- oxide
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Electrodes Of Semiconductors (AREA)
- Die Bonding (AREA)
- Weting (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US512045A US3388048A (en) | 1965-12-07 | 1965-12-07 | Fabrication of beam lead semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1166659A true GB1166659A (en) | 1969-10-08 |
Family
ID=24037447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB50643/66A Expired GB1166659A (en) | 1965-12-07 | 1966-11-11 | A method of Forming Metallic Patterns on Substrate Bodies |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US3388048A (https=) |
| AT (1) | AT266219B (https=) |
| BE (1) | BE690534A (https=) |
| CH (1) | CH455945A (https=) |
| DE (1) | DE1589076C3 (https=) |
| ES (1) | ES334684A1 (https=) |
| FR (1) | FR1504176A (https=) |
| GB (1) | GB1166659A (https=) |
| IL (1) | IL26908A (https=) |
| NL (1) | NL6617128A (https=) |
| SE (1) | SE325336B (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991014288A1 (en) * | 1990-03-07 | 1991-09-19 | Santa Barbara Research Center | Magnetoresistor structure and operating method |
| CN111945128A (zh) * | 2020-08-18 | 2020-11-17 | 江苏能华微电子科技发展有限公司 | 一种提高铂与衬底黏附性的方法及其产品 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3506887A (en) * | 1966-02-23 | 1970-04-14 | Motorola Inc | Semiconductor device and method of making same |
| GB1175667A (en) * | 1966-04-07 | 1969-12-23 | Associated Semiconductor Mft | Improvements in the Electrodeposition of Metals using a Composite Mask |
| US3537175A (en) * | 1966-11-09 | 1970-11-03 | Advalloy Inc | Lead frame for semiconductor devices and method for making same |
| US3507756A (en) * | 1967-08-04 | 1970-04-21 | Bell Telephone Labor Inc | Method of fabricating semiconductor device contact |
| US3658489A (en) * | 1968-08-09 | 1972-04-25 | Nippon Electric Co | Laminated electrode for a semiconductor device |
| US3620932A (en) * | 1969-05-05 | 1971-11-16 | Trw Semiconductors Inc | Beam leads and method of fabrication |
| US3708403A (en) * | 1971-09-01 | 1973-01-02 | L Terry | Self-aligning electroplating mask |
| US3926747A (en) * | 1974-02-19 | 1975-12-16 | Bell Telephone Labor Inc | Selective electrodeposition of gold on electronic devices |
| US4011144A (en) * | 1975-12-22 | 1977-03-08 | Western Electric Company | Methods of forming metallization patterns on beam lead semiconductor devices |
| US4988412A (en) * | 1988-12-27 | 1991-01-29 | General Electric Company | Selective electrolytic desposition on conductive and non-conductive substrates |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3287612A (en) * | 1963-12-17 | 1966-11-22 | Bell Telephone Labor Inc | Semiconductor contacts and protective coatings for planar devices |
| US3325379A (en) * | 1962-05-22 | 1967-06-13 | Hazeltine Research Inc | Method of making metallic patterns having continuous interconnections |
| NL134170C (https=) * | 1963-12-17 | 1900-01-01 | ||
| US3274670A (en) * | 1965-03-18 | 1966-09-27 | Bell Telephone Labor Inc | Semiconductor contact |
-
1965
- 1965-12-07 US US512045A patent/US3388048A/en not_active Expired - Lifetime
-
1966
- 1966-11-11 GB GB50643/66A patent/GB1166659A/en not_active Expired
- 1966-11-21 IL IL26908A patent/IL26908A/xx unknown
- 1966-12-01 BE BE690534D patent/BE690534A/xx not_active IP Right Cessation
- 1966-12-02 DE DE1589076A patent/DE1589076C3/de not_active Expired
- 1966-12-02 CH CH1724766A patent/CH455945A/de unknown
- 1966-12-05 ES ES0334684A patent/ES334684A1/es not_active Expired
- 1966-12-05 AT AT1124066A patent/AT266219B/de active
- 1966-12-06 SE SE16709/66A patent/SE325336B/xx unknown
- 1966-12-06 NL NL6617128A patent/NL6617128A/xx unknown
- 1966-12-07 FR FR86549A patent/FR1504176A/fr not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991014288A1 (en) * | 1990-03-07 | 1991-09-19 | Santa Barbara Research Center | Magnetoresistor structure and operating method |
| CN111945128A (zh) * | 2020-08-18 | 2020-11-17 | 江苏能华微电子科技发展有限公司 | 一种提高铂与衬底黏附性的方法及其产品 |
Also Published As
| Publication number | Publication date |
|---|---|
| FR1504176A (fr) | 1967-12-01 |
| NL6617128A (https=) | 1967-06-08 |
| SE325336B (https=) | 1970-06-29 |
| ES334684A1 (es) | 1967-11-01 |
| US3388048A (en) | 1968-06-11 |
| BE690534A (https=) | 1967-05-16 |
| DE1589076B2 (de) | 1975-05-22 |
| DE1589076C3 (de) | 1980-11-06 |
| IL26908A (en) | 1970-11-30 |
| AT266219B (de) | 1968-11-11 |
| DE1589076A1 (de) | 1970-03-19 |
| CH455945A (de) | 1968-05-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PE | Patent expired |