GB1165854A - Method of Encapsulating a Plurality of Microelectronic Units and Product - Google Patents

Method of Encapsulating a Plurality of Microelectronic Units and Product

Info

Publication number
GB1165854A
GB1165854A GB09518/68A GB1951868A GB1165854A GB 1165854 A GB1165854 A GB 1165854A GB 09518/68 A GB09518/68 A GB 09518/68A GB 1951868 A GB1951868 A GB 1951868A GB 1165854 A GB1165854 A GB 1165854A
Authority
GB
United Kingdom
Prior art keywords
clips
mould
block
terminal pads
encapsulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB09518/68A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Friden Inc
Original Assignee
Friden Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Friden Inc filed Critical Friden Inc
Publication of GB1165854A publication Critical patent/GB1165854A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
GB09518/68A 1967-05-15 1968-04-25 Method of Encapsulating a Plurality of Microelectronic Units and Product Expired GB1165854A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US63853667A 1967-05-15 1967-05-15

Publications (1)

Publication Number Publication Date
GB1165854A true GB1165854A (en) 1969-10-01

Family

ID=24560432

Family Applications (1)

Application Number Title Priority Date Filing Date
GB09518/68A Expired GB1165854A (en) 1967-05-15 1968-04-25 Method of Encapsulating a Plurality of Microelectronic Units and Product

Country Status (9)

Country Link
US (1) US3489952A (https=)
BE (1) BE715204A (https=)
CH (1) CH472120A (https=)
DE (1) DE1766392A1 (https=)
ES (1) ES367720A1 (https=)
FR (1) FR1578928A (https=)
GB (1) GB1165854A (https=)
NL (1) NL6806852A (https=)
SE (1) SE334654B (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3604099A (en) * 1969-08-18 1971-09-14 Western Electric Co Methods of and apparatus for bonding leaded devices to substrates
US3672046A (en) * 1970-01-14 1972-06-27 Technitrol Inc The method of making an electrical component
US3919602A (en) * 1972-03-23 1975-11-11 Bosch Gmbh Robert Electric circuit arrangement and method of making the same
US3774078A (en) * 1972-03-29 1973-11-20 Massachusetts Inst Technology Thermally integrated electronic assembly with tapered heat conductor
US3777220A (en) * 1972-06-30 1973-12-04 Ibm Circuit panel and method of construction
US3959874A (en) * 1974-12-20 1976-06-01 Western Electric Company, Inc. Method of forming an integrated circuit assembly
US4392181A (en) * 1981-05-01 1983-07-05 Western Electric Company, Inc. Circuit board and contact assemblies
US4514784A (en) * 1983-04-22 1985-04-30 Cray Research, Inc. Interconnected multiple circuit module
US4559272A (en) * 1984-05-09 1985-12-17 Hughes Aircraft Company Heat curable polyglycidyl aromatic amine encapsulants
US4780795A (en) * 1986-04-28 1988-10-25 Burr-Brown Corporation Packages for hybrid integrated circuit high voltage isolation amplifiers and method of manufacture
US5444600A (en) * 1992-12-03 1995-08-22 Linear Technology Corporation Lead frame capacitor and capacitively-coupled isolator circuit using the same
US7927920B2 (en) * 2007-02-15 2011-04-19 Headway Technologies, Inc. Method of manufacturing electronic component package, and wafer and substructure used for manufacturing electronic component package
US7816176B2 (en) * 2007-05-29 2010-10-19 Headway Technologies, Inc. Method of manufacturing electronic component package
DE102009001371A1 (de) * 2009-03-06 2010-09-09 Hilti Aktiengesellschaft Handgeführtes Eintreibgerät
US8310835B2 (en) * 2009-07-14 2012-11-13 Apple Inc. Systems and methods for providing vias through a modular component

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2629802A (en) * 1951-12-07 1953-02-24 Rca Corp Photocell amplifier construction
US3029495A (en) * 1959-04-06 1962-04-17 Norman J Doctor Electrical interconnection of miniaturized modules
GB1058296A (en) * 1963-06-28 1967-02-08 Rca Corp Composite insulator-semiconductor wafer and method of making same
US3290753A (en) * 1963-08-19 1966-12-13 Bell Telephone Labor Inc Method of making semiconductor integrated circuit elements
US3262022A (en) * 1964-02-13 1966-07-19 Gen Micro Electronics Inc Packaged electronic device
US3312871A (en) * 1964-12-23 1967-04-04 Ibm Interconnection arrangement for integrated circuits
US3457123A (en) * 1965-06-28 1969-07-22 Motorola Inc Methods for making semiconductor structures having glass insulated islands

Also Published As

Publication number Publication date
SE334654B (https=) 1971-05-03
BE715204A (https=) 1968-09-30
NL6806852A (https=) 1968-11-18
DE1766392A1 (de) 1971-07-22
CH472120A (fr) 1969-04-30
ES367720A1 (es) 1971-04-16
US3489952A (en) 1970-01-13
FR1578928A (https=) 1969-08-22

Similar Documents

Publication Publication Date Title
GB1165854A (en) Method of Encapsulating a Plurality of Microelectronic Units and Product
US5286679A (en) Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer
US3930114A (en) Integrated circuit package utilizing novel heat sink structure
US3716907A (en) Method of fabrication of semiconductor device package
US4459607A (en) Tape automated wire bonded integrated circuit chip assembly
US5358826A (en) Method of fabricating metallized chip carries from wafer-shaped substrates
US3964157A (en) Method of mounting semiconductor chips
US3675089A (en) Heat dispenser from a semiconductor wafer by a multiplicity of unaligned minuscule heat conductive raised dots
US7736944B2 (en) Semiconductor device with improved design freedom of external terminal
US7372137B2 (en) Semiconductor device and manufacturing method thereof
GB1231019A (https=)
US3567506A (en) Method for providing a planar transistor with heat-dissipating top base and emitter contacts
US3656232A (en) Method of encapsulating coplanar microelectric system
US4110598A (en) Thermal printhead assembly
US5898128A (en) Electronic component
GB1101906A (en) Improvements in or relating to the manufacture of semiconductor circuits or assemblies
JP2596615B2 (ja) 樹脂封止用回路基板
US3750269A (en) Method of mounting electronic devices
GB1033813A (en) Electrical semiconductor device
US3447038A (en) Method and apparatus for interconnecting microelectronic circuit wafers
FR2282720B1 (https=)
US4406054A (en) Method of mounting and packaging elongate silicon devices on a ceramic base
GB1044689A (en) Improvements in or relating to mountings for semi-conductor devices
US3626584A (en) Method of making miniature hybrid integrated circuits
JP2816084B2 (ja) 半田塗布方法、半導体装置の製造方法およびスキージ

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees