GB1161789A - Electronic Structural Unit. - Google Patents

Electronic Structural Unit.

Info

Publication number
GB1161789A
GB1161789A GB3751266A GB3751266A GB1161789A GB 1161789 A GB1161789 A GB 1161789A GB 3751266 A GB3751266 A GB 3751266A GB 3751266 A GB3751266 A GB 3751266A GB 1161789 A GB1161789 A GB 1161789A
Authority
GB
United Kingdom
Prior art keywords
transistors
resistors
semi
resistor
controlled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3751266A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Publication of GB1161789A publication Critical patent/GB1161789A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/082—Cooling, heating or ventilating arrangements using forced fluid flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/22—Elongated resistive element being bent or curved, e.g. sinusoidal, helical
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/62—Protection against overvoltage, e.g. fuses, shunts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Electromagnetism (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Control Of Electrical Variables (AREA)
GB3751266A 1965-08-21 1966-08-22 Electronic Structural Unit. Expired GB1161789A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEL0051443 1965-08-21

Publications (1)

Publication Number Publication Date
GB1161789A true GB1161789A (en) 1969-08-20

Family

ID=7274058

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3751266A Expired GB1161789A (en) 1965-08-21 1966-08-22 Electronic Structural Unit.

Country Status (5)

Country Link
CH (1) CH449751A (fr)
DE (1) DE1540090A1 (fr)
GB (1) GB1161789A (fr)
NL (1) NL6611713A (fr)
SE (1) SE328341B (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2525392A1 (fr) * 1982-04-19 1983-10-21 Inst Elektrodinamiki Akademii Transistor de puissance du type comportant un nombre n de structures fonctionnelles branchees en parallele
EP2179296A1 (fr) * 2007-08-16 2010-04-28 Radian Research, Inc. Appareil et procédé pour tester un transformateur d'instruments
WO2012103992A3 (fr) * 2011-02-03 2012-12-06 Robert Bosch Gmbh Onduleur à modulation de largeur d'impulsions à résistance de shunt refroidie et système de propulsion électrique à onduleur à modulation de largeur d'impulsions comportant une résistance de shunt refroidie

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3703873A1 (de) * 1987-02-07 1988-08-18 Sueddeutsche Kuehler Behr Kuehlkoerper, insbesondere zum kuehlen elektronischer bauelemente
DE4105786A1 (de) * 1991-02-23 1992-08-27 Abb Patent Gmbh Anordnung mit fluessigkeitsgekuehltem, elektrischem leistungswiderstand und verfahren zu ihrer herstellung

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2525392A1 (fr) * 1982-04-19 1983-10-21 Inst Elektrodinamiki Akademii Transistor de puissance du type comportant un nombre n de structures fonctionnelles branchees en parallele
EP2179296A1 (fr) * 2007-08-16 2010-04-28 Radian Research, Inc. Appareil et procédé pour tester un transformateur d'instruments
EP2179296A4 (fr) * 2007-08-16 2013-05-22 Radian Res Inc Appareil et procédé pour tester un transformateur d'instruments
US9366744B2 (en) 2007-08-16 2016-06-14 Radian Research, Inc. Instrument transformer test equipment and method
WO2012103992A3 (fr) * 2011-02-03 2012-12-06 Robert Bosch Gmbh Onduleur à modulation de largeur d'impulsions à résistance de shunt refroidie et système de propulsion électrique à onduleur à modulation de largeur d'impulsions comportant une résistance de shunt refroidie

Also Published As

Publication number Publication date
CH449751A (de) 1968-01-15
DE1540090A1 (de) 1970-05-21
NL6611713A (fr) 1967-02-22
SE328341B (fr) 1970-09-14

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees